Technology & Telecommunications

According to a new market report published by Lucintel, the future of the global outsourced semiconductor assembly and test (OSAT) market looks promising with opportunities in the computer & networking, consumer electronics, industrial electronics, and telecom industries. The global OSAT market is expected to decline in 2020 due to global economic recession led by COVID-19. However, market will witness recovery in the year 2021 and it is expected to reach an estimated $32.5 billion by 2025 with a CAGR of 2% to 4% from 2020 to 2025. The major drivers for this market are increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices,  and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.



In this market, OSAT companies offer third-party IC-packaging and test services. Wire bond, flip chip, and wafer level packaged products are the major packaging types of the global OSAT market. Lucintel forecasts that wire bond will remain the largest packaging type over the forecast period, as wire bond packaging is cost effective solution for low to medium pin count applications. The wafer level packaging segment is expected to witness the highest growth during the forecast period due to increasing demand for high performance and reliable packaging in mobile communication applications.



Within this market, computer and networking will remain the largest end use industry for OSAT services due to increasing demand of semiconductors in data centers, network infrastructure, and storage applications. Consumer electronics is expected to witness the highest growth over the forecast period due to the increasing demand for internet connected device.



Asia Pacific will remain the largest region over the forecast period and it is also expected to witness the highest growth over the over the forecast period due to a growing adoption of IoT (internet of things), increasing electronic content per vehicles, and growing industrial automation in countries such as China, Taiwan, and India.



Emerging trend, which has a direct impact on the dynamics of the industry, includes miniaturization and higher functionality semiconductors.  ASE, Amkor, JCET, SPIL, and PTI are among the major OSAT providers.



Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global OSAT market by service type, packaging type, end use industries, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global OSAT Market 2020-2025: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global OSAT market by service type, packaging type, end use industries, and region as follows:



By Service Type [$M analysis for 2014 – 2025]:

By Packaging Type [$M analysis for 2014 – 2025]:

By End Use Industry [$M analysis for 2014 – 2025]:

By Region [$M analysis for 2014 – 2025]:

 

This 200 page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.



About Lucintel



Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision makers in a variety of industries. For further information, visit www.lucintel.com.