• helpdesk@Lucintel.com
  • |
  • +1 972 636 5056
  • |
  • Login
  • |
  • Register
  • |
  • Search
  • |
'
...

The Impact of COVID-19 is included in Outsourced Semiconductor Assembly and Test Market. Buy it today to get an advantage.

Request the impact of COVID-19 on your product or industry


The future of the global outsourced semiconductor assembly and test (OSAT) market looks promising with opportunities in the computer & networking, consumer electronics, industrial electronics, and telecom industries. The global OSAT market is expected to reach an estimated $45 billion by 2027 with a CAGR of 4.6% from 2021 to 2027. The major drivers for this market are increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices,  and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.
OSAT Market by Service Type, Packaging Type, and End Use Industries
Evolution of OSAT Opportunities
OSAT opportunities have evolved through number of stages as presented in figure below:


 
Evolution of OSAT Technologies
 

Emerging Trends in the OSAT Market
Emerging trend, which has a direct impact on the dynamics of the industry, includes miniaturization and higher functionality semiconductors. 
A total of 107 figures / charts and 68 tables are provided in this 200-page report to help in your business decisions. A sample figure with insights is shown below. To learn the scope of benefits, companies researched, and other details of the facial cleanser market report, please download the report brochure.
OSAT Market by Segments

OSAT Market by Segment
The study includes a forecast for the global OSAT market by service type, packaging type, end use industries, and region as follows:
OSAT Market by Service Type [Value ($M) shipment analysis for 2016 – 2027]:
OSAT Market by Packaging Type [Value ($B) shipment analysis for 2016 – 2027]:
OSAT Market by End Use Industry [Value ($M) shipment analysis for 2016 – 2027]:
OSAT Market by Region [Value ($M) shipment analysis for 2016 – 2027]:
  • North America
  • US
  • Canada
  • Mexico
  • Europe
  • Germany
  • The United Kingdom
  • France
  • Asia Pacific
  • China
  • Japan
  • South Korea
  • The Rest of the World
List of OSAT Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies OSAT companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the OSAT companies profiled in this report includes.
OSAT Market Insight
  • Lucintel forecasts that computer and networking will remain the largest end use segment over the forecast period due to increasing demand of semiconductors in data centers, network infrastructure, and storage applications.
  • Wire bond will remain the largest packaging type over the forecast period, as wire bond packaging is cost effective solution for low to medium pin count applications.
  • Asia Pacific will remain the largest region over the forecast period and it is also expected to witness the highest growth over the over the forecast period due to a growing adoption of IoT (internet of things), increasing electronic content per vehicles, and growing industrial automation in countries such as China, Taiwan, and India.
Features of OSAT Market
  • Market Size Estimates: OSAT market size estimation in terms of value ($B)
  • Trend and Forecast Analysis: Market trends (2016-2021) and forecast (2022-2027) by various segments and regions.
  • Segmentation Analysis: Market size by service type, packaging type, and end use industries.
  • Regional Analysis: OSAT market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis of growth opportunities in different service type, packaging type, end use industries, and regions for the OSAT market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the OSAT market.
  • Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
FAQ
Q1. What is the OSAT market size?
Answer: The global OSAT market is expected to reach an estimated $45 billion by 2027           
Q2. What is the growth forecast for OSAT market?
Answer: The OSAT market is expected to grow at a CAGR of 4.6% from 2021 to 2027.  
Q3. What are the major drivers influencing the growth of the OSAT market?
Answer: The major drivers for this market are increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices,  and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.
Q4. What are the major applications or end use industries for OSAT?
Answer: Computer and networking and consumer electronics are the major end use industries for facial cleanser.       
Q5. What are the emerging trends in OSAT market?
Answer: Emerging trend, which has a direct impact on the dynamics of the industry, includes miniaturization and higher functionality semiconductors.     
Q6. Who are the key OSAT companies?
Answer: Some of the key OSAT companies are as follows:
  • Advanced Semiconductor Engineering
  • Amkor
  • Jiangsu Changjiang Electronics Technology
  • Siliconware Precision Industries Co. ltd.
  • PTI(Powertech Technology Inc.)
  • Tianshui Huatian Technology co. Ltd
  • Tongfu Microelectronics co. Ltd
  • United test and assembly center Ltd
  • King Yuan Electronics co, Ltd.
  • ChipMOS
Q7.Which OSAT product segment will be the largest in future?
Answer: Lucintel forecasts that wire bond will remain the largest packaging type over the forecast period, as wire bond packaging is cost effective solution for low to medium pin count applications.
Q8: In OSAT market, which region is expected to be the largest in next 5 years?
Answer: Asia Pacific is expected to remain the largest region and witness the highest growth over next 5 years          
Q9. Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.
 
This report answers following 11 key questions
Q.1 What are some of the most promising potential, high growth opportunities for the global OSAT market by service type (assembly/packaging and testing), end use industry (telecommunication & devices, computer & networking, consumer electronics, industrial electronics, others), packaging type (wire bond, flip chip, wafer level, and others),and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q. 2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to the market?
Q.6 What are the emerging trends in this market and the reasons behind them?
Q.7 What are the changing demands of customers in the market?
Q.8 What are the new developments in the market? Which companies are leading these developments?
Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M & A activities have taken place in the last 5 years in this market?
 
OSAT Opportunities and Technologies Have Evolved Through Number of Stages as presented in figure below:

 
Evolution of OSAT Opportunities



 
 

Table of Contents
1. Executive Summary

2. Market Background and Classifications
2.1: Introduction
2.2: Supply Chain
2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2016 to 2027
3.1: Macroeconomic Trends and Forecast
3.2: Global OSAT Market  Trends and Forecast
3.3: Global OSAT Market by Service Type
3.3.1: Assembly & Packaging
3.3.2: Testing
3.4: Global OSAT Market by Packaging Type
3.4.1: Wire bond
3.4.2: Flip Chip Others
3.4.3: Wafer level
3.4.4: Others
3.5: Global OSAT Market by End Use Industry
3.5.1: Telecommunication
3.5.2: Consumer Electronics
3.5.3: Computer and Networking
3.5.4:Industrial Electronics
3.5.5: Others
 
4. Market Trends and Forecast Analysis by Region from 2016 to 2027
4.1: Global OSAT Market by Region
4.2: North American OSAT Market
4.2.1: North American OSAT Market by Packaging Type
4.2.2: North American OSAT Market by End Use Industry
4.2.3: United States OSAT Market
4.2.4: Canadian OSAT Market
4.2.5: Mexican OSAT Market
4.3: European OSAT Market
4.3.1: European OSAT Market by Packaging Type
4.3.2: European OSAT Market by End Use Industry
4.3.3: German OSAT Market
4.3.4: United Kingdom OSAT Market
4.3.5: French OSAT Market
4.4 : APAC OSAT Market
4.4.1: APAC OSAT Market by Packaging Type
4.4.2: APAC OSAT Market by End Use Industry
4.4.3: Chinese OSAT Market
4.4.4: Japanese OSAT Market
4.4.5: South Korean OSAT Market
4.5: ROW OSAT Market

5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Geographical Reach
5.3: Porter’s Five Forces Analysis

6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities Analysis by Service Type
6.1.1: Growth Opportunities Analysis by Packaging Type
6.1.2: Growth Opportunities Analysis by End Use Industry
6.1.3: Growth Opportunities Analysis by Region
6.2: Emerging Trends of the Global OSAT Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Mergers, Acquisitions, and Joint Ventures
6.3.3: Certification and Licensing
6.3.4: Capacity Expansion

7. Company Profiles of Leading Players
7.1: Advanced Semiconductor Engineering
7.2: Amkor
7.3: Jiangsu Changjiang Electronics Technology
7.4: Siliconware Precision Industries Co. ltd.
7.5: PTI(Powertech Technology Inc.)
7.6: Tianshui Huatian Technology co. Ltd
7.7:Tongfu Microelectronics co. Ltd
7.8: United test and assembly center Ltd
7.9: King Yuan Electronics co, Ltd.
7.10: ChipMOS
.

Buy full report or by chapter as follows

Price by License Type:
[-] Hide Chapter Details
[Chapter Number] [Chapter Name] [Chapter Number Of Pages] [Chapter Price]
Title/Chapter Name Pages Price
Full Report: Outsourced Semiconductor Assembly and Test Market: Trends, Forecast and Competitive Analysis Full Report $ 4,850
107 figures/charts and 68 tables are provided in this 200 - page report
Lucintel has been in the business of market research and management consulting since 2000 and has published over 600 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted in the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts in the automotive adhesive market. Some of the OSAT companies profiled in this report include ASE, Amkor, JCET, SPIL, and PTI.
 
Below is a brief summary of the primary interviews that were conducted by job function for this report.
 
 
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process.
 

Please sign in below to get report brochure - Outsourced Semiconductor Assembly and Test Market.

At Lucintel, we respect your privacy and maintain the confidentiality of information / data provided by you
(Please enter your corporate email. * These fields are mandatory )