According to a new market report by Lucintel, the future of the global capillary underfill material market looks promising with opportunities in the chip scale packaging, flip chips, and ball grid array applications. The global capillary underfill material market is expected to decline in 2020 due to global economic recession led by COVID-19. However, the market will witness recovery in the year 2021 and it is expected to grow with a CAGR of 9% from 2020 to 2025. The major growth driver for this market is growth in the electronics industry.
To download report brochure, please go to www.lucintel.com/capillary-underfill-material-market.aspx and click "download brochure" tab from the menu.
In this market, molded underfill material and no flow underfill material are major product type of capillary underfill material market.
Within this market, flip-chip is expected to witness the highest growth over the forecast period due to the demand for smaller, lighter, and cost-effective devices, and the attention on capillary underfill material.
Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to growth of the semiconductor industry.
Zymet, Epoxy Technology, H.B. Fuller, Henkel, Namics Corporation, Nordson Corporation, Yincae Advanced Material, and Master Bond are among the major manufacturers of the global capillary underfill material market.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global capillary underfill material market by product type, application, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global Capillary Underfill Material Market 2020-2025: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global capillary underfill material market by product type, application, and region as follows:
By Product Type [$M shipment analysis for 2014 – 2025]:
Molded Underfill Material
No Flow Underfill Material
Others
By Application [$M shipment analysis for 2014 – 2025]:
Chip Scale Packaging
Flip Chips
Ball Grid Array
Others
By Region [$M shipment analysis for 2014 – 2025]:
North America
United States
Canada
Mexico
Europe
Asia Pacific
China
Japan
India
South Korea
Rest of the World
This 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.