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The future of the global capillary underfill material market looks promising with opportunities in the chip scale packaging, flip chips, and ball grid array applications. The global capillary underfill material market is expected to decline in 2020 due to global economic recession led by COVID-19. However, the market will witness recovery in the year 2021 and it is expected to grow with a CAGR of 8% to 10% from 2020 to 2025. The major growth driver for this market is growth in the electronics industry.
 
A total of XX figures / charts and XX tables are provided in more than 150 pages report is developed to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of global capillary underfill material market report download the report brochure.

 
capillary underfill material
 
Growth in various segments of the capillary underfill material market are given below
 
capillary underfill material
 
The study includes trends and forecast for the global capillary underfill Material market by product type, application, and region as follows
 
By Product Type [$M shipment analysis for 2014 – 2025]:
  • Molded Underfill Material
  • No Flow Underfill Material
  • Others
By Application [$M shipment analysis for 2014 – 2025]:
  • Chip Scale Packaging
  • Flip Chips
  • Ball Grid Array
  • Others
By Region [$M shipment analysis for 2014 – 2025]:
  • North America
  • United States
  • Canada
  • Mexico
  • Europe
  • Germany
  • UK
  • Italy
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Rest of the World
Some of the capillary underfill manufacturers profiled in this report include,Zymet, Epoxy Technology Inc., H.B. Fuller, Henkel Ag & Co. Kg, Namics Corporation, Nordson Corporation, Yincae Advanced Material, LLC, Master Bond. 
 
In this market, molded underfill material and no flow underfill material are major product type of capillary underfill material market. 
 
Within this market, flip-chip is expected to witness the highest growth over the forecast period due to the demand for smaller, lighter, and cost-effective devices, and the attention on capillary underfill material.
 
Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to growth of the semiconductor industry.
 
 
Features of the Global Capillary Underfill Material  Market
  • Market size estimates: Global capillary underfill material market size estimation in terms of value ($M) shipment.
  • Trend and forecast analysis: Market trend (2014-2019) and forecast (2020-2025) by end use industry
  • Segmentation analysis: Market size by various segments such as by product type, application, and region
  • Regional analysis: Global capillary underfill material Market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth opportunities: Analysis on growth opportunities in different application and regions for the global capillary underfill material Market.
  • Strategic analysis: This includes M&A, new product development, and competitive landscape of the global capillary underfill material market.
  • Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
 
 
This report answers following 11 key questions
 
Q.1 What are some of the most promising potential, high-growth opportunities for the global capillary underfill material market by product type (molded underfill material, no flow underfill material, and others), applications (chip scale packaging, flip chips, ball grid array, and others), and region (North America, Europe, Asia Pacific (APAC), and Rest of the World (ROW)?                                                                                              
Q. 2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to the global capillary underfill material market?
Q.6 What are emerging trends in global capillary underfill material market and the reasons behind them?
Q.7 What are some changing demands of customers in the global capillary underfill material market?
Q.8 What are the new developments in the capillary underfill material market? Which companies are leading these developments?
Q.9 Who are the major players in this global capillary underfill material market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this global capillary underfill material market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M & A activities did take place in the last five years in this, global capillary underfill material market?
 
Report Scope

Key Features Description
Base Year for Estimation 2019
Trend Period
(Actual Estimates)
2014-2019
Forecast Period 2020-2025
Pages 150
Market Representation / Units Revenue in US $ Million
Report Coverage Market Trends & Forecasts, Competitor Analysis, New Product Development, Company Expansion, Merger Acquisitions & Joint Venture, and Company Profiling
Market Segments Capillary Underfill Material  Market By Product Type (Molded Underfill Material, No Flow Underfill Material and Others); Applications (Chip Scale Packaging, Flip Chips, Ball Grid Array, and Others)
Regional Scope North America, Europe, Asia Pacific, and RoW
Customization 10% Customization Without any Additional Cost
 

Table of Contents
 
1. Executive Summary
 
2. Market Background and Classification
2.1: Introduction, Background, and Classification
2.2: Supply Chain
2.3: Industry Drivers and Challenges
 
3. Market Trends and Forecast Analysis from 2014 to 2025
3.1: Macroeconomic Trends and Forecast
3.2: Global Capillary Underfill Material Market Trends and Forecast
3.3: Global Capillary Underfill Material Market by Product Type
3.3.1: Molded Underfill Material
3.3.2: No flow Underfill Material 
3.3.3: Others
3.4: Global Capillary Underfill Material Market By Application
3.4.1: Chip Scale Packaging
3.4.2: Flip Chips
3.4.3: Ball Grid Array
3.4.4: Others
 
4. Market Trends and Forecast Analysis by Region             
4.1: Global Capillary Underfill Material  Market by Region
4.2: North American Capillary Underfill Material  Market 
4.2.1: Market by Product Type: Molded Underfill Material, No Flow Underfill Material and Others
4.2.2: Market by Application: Chip Scale Packaging, Flip Chips, Ball Grid Array, and Others 
4.2.3: United States Capillary Underfill Material  Market
4.2.4: Canadian Capillary Underfill Material  Market
4.2.5: Mexican Capillary Underfill Material  Market
4.3: European Capillary Underfill Material  Market
4.3.1: Market by Product Type: Molded Underfill Material, No Flow Underfill Material and Others
4.3.2: Market by Application: Chip Scale Packaging, Flip Chips, Ball Grid Array, and Others 
4.3.3: Germany Capillary Underfill Material  Market
4.3.4: UK Capillary Underfill Material  Market
4.3.5: Italy Capillary Underfill Material  Market
4.4: APAC Capillary Underfill Material  Market
4.4.1: Market by Product Type: Molded Underfill Material, No Flow Underfill Material and Others
4.4.2: Market by Application: Chip Scale Packaging, Flip Chips, Ball Grid Array, and Others 
4.4.3: China Capillary Underfill Material Market
4.4.4: Japan Capillary Underfill Material Market
4.4.5: South Korea Capillary Underfill Material Market
4.4.6: India Capillary Underfill Material Market
4.5: ROW Capillary Underfill Material  Market
4.5.1: Market by Product Type: Molded Underfill Material, No Flow Underfill Material and Others
4.5.2: Market by Application: Chip Scale Packaging, Flip Chips, Ball Grid Array, and Others 
 
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Market Share Analysis
5.3: Operational Integration
5.4: Geographical Reach
5.5: Porter’s Five Forces Analysis
 
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for Global Capillary Underfill Material by Product Type
6.1.2: Growth Opportunities for Global Capillary Underfill Material Market by Application
6.1.3: Growth Opportunities for Global Capillary Underfill Material Market by Region
6.2: Emerging Trends in Capillary Underfill Material Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of Global Capillary Underfill Material Market
6.3.3: Mergers, Acquisitions and Joint Ventures in the Global Capillary Underfill Material Market
6.3.4: Certification and Licensing
 
7. Company Profiles of Leading Players
7.1: Zymet
7.2: Epoxy Technology Inc
7.3: H.B. Fuller, Henkel Ag & Co. Kg
7.4: Namics Corporation
7.5: Nordson Corporation
7.6: Yincae Advanced Material, LLC
7.7: Master Bond
 
.

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Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Below is a brief summary of the primary interviews that were conducted by job function for this report.
 

 
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process.