According to a new market report published by Lucintel, the future of the 3D TSV and 2.5D market looks promising with opportunities in the consumer electronics, automotive, high-performance computing and networking industries. The global 3D TSV and 2.5D market is expected to grow with a CAGR of 33% from 2020 to 2025. The major drivers for this market are growth of the high performance computing application and expanding scope of data centers and memory devices.
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In this market, 3D stacked memory, 2.5D interposer,CMOS image sensors (CIS) with Through Silicon Vias (TSV), and 3D System-on-Chip (SoC) are the major packaging types used. Lucintel forecasts that CIS with TSV will remain the largest segment over the forecast period due to the growth of smartphones and it is increasingly integrated into the high-end market segment for memory devices.
Within this market, consumer electronics is expected to witness the highest growth over the forecast period due to increasing number of smartphones, tablets, and other hand-held devices.
Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to the increasing smartphone adoption rates.
Taiwan Semiconductor Manufacturing Company, Samsung Electronics, Toshiba, ASE Group, Amkor Technology are among the major suppliers in the global 3D TSV and 2.5D market.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global 3D TSV and 2.5D market by packaging type, end use industry, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global 3D TSV and 2.5D Market 2020-2025: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global 3D TSV and 2.5D market by packaging type, end use industry, and region as follows:
By Packaging Type [Value ($ Million) shipment analysis for 2014 – 2025]:
3D Stacked Memory
2.5D Interposer
CIS with TSV
3D SoC
Others
By End Use Industry [Value ($ Million) shipment analysis for 2014 – 2025]:
Consumer Electronics
Automotive
High-Performance Computing and Networking
Others
By Region [Value ($ Million) shipment analysis for 2014 – 2025]:
United States
Canada
Mexico
United Kingdom
Spain
Germany
France
China
India
Japan
South Korea
A more than 150 pages research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision makers in a variety of industries. For further information, visit www.lucintel.com.