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The future of the 3D TSV and 2.5D market looks promising with opportunities in the consumer electronics, automotive, high-performance computing and networking industries. The global 3D TSV and 2.5D market is expected to grow with a CAGR of 32% to 34% from 2020 to 2025. The major drivers for this market are growth of the high performance computing application and expanding scope of data centers and memory devices.
 
A total of XX figures / charts and XX tables are provided in more than 150 pages report is developed to help in your business decisions. Sample figures with some insights are shown below. To learn the scope, benefits, companies researched, and other details of the global 3D TSV and 2.5D market report, please download the report brochure.

 
3D TSV and 2.5D Market by Packaging Type and End Use Industry
 
Growth in various segments of the 3D TSV and 2.5D market are given below:

 
3D TSV and 2.5D Market by Segments
 
The study includes trends and forecast for the global 3D TSV and 2.5D market by packaging type, end use industy, and region as follows:
 
By Packaging Type [Value ($ Million) shipment analysis for 2014 – 2025]:
  • 3D Stacked Memory 
  • 2.5D Interposer 
  • CIS with TSV
  • 3D SoC
  • Others
By End Use Industry [Value ($ Million) shipment analysis for 2014 – 2025]:
  • Consumer Electronics
  • Automotive 
  • High-Performance Computing and Networking
  • Others
By Region [Value ($ Million) shipment analysis for 2014 – 2025]:
  • North America
  • United States
  • Canada 
  • Mexico
  • Europe
  • United Kingdom
  • Spain
  • Germany
  • France
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • The Rest of the World 
  • Brazil
Some of the 3D TSV and 2.5D manufacturers profiled in this report include, Taiwan Semiconductor Manufacturing Company, Samsung Electronics, Toshiba, ASE Group, and Amkor Technology.
 
Lucintel forecasts that CIS with TSV will remain the largest segment over the forecast period due to growth of the smartphones and  is increasingly integrated into the high-end market segment for memory devices.
 
Within this market, consumer electronics is expected to witness the highest growth over the forecast period due to increasing number of smartphones, tablets, and other hand-held devices. 
 
Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to the increasing smartphone adoption rates have made Asia-Pacific one of the largest mobile markets in the world.
 
 
Features of the Global 3D TSV and 2.5D Market
 
  • Market Size Estimates: Global 3D TSV and 2.5D market size estimation in terms of value ($M) shipment.
  • Trend and Forecast Analysis: Market trends (2014-2019) and forecast (2020-2025) by various segments and regions.
  • Segmentation Analysis: Global 3D TSV and 2.5D market size by various segments, such as packaging, end use industry in terms of value.
  • Regional Analysis: Global 3D TSV and 2.5D market breakdown by the North America, Europe, Asia Pacific, and Rest of the World.
  • Growth Opportunities: Analysis of growth opportunities in different packaging, end use industry, and region for the global 3D TSV and 2.5D market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape of the global 3D TSV and 2.5D market.
  • Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
 
 
 
This report answers following key questions
 
Q.1 What are some of the most promising potential, high-growth opportunities for the global 3D TSV and 2.5D market by packaging type (3D stacked memory, 2.5D interposer, CIS with TSV, 3D SoC, and Others), end use industry (consumer electronics, automotive, high-performance computing and networking, and others), and region (North America, Europe, Asia Pacific, and Rest of the World)?
Q. 2 Which segments will grow at a faster pace and why?
Q.3 Which region will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to the market?
Q.6 What are emerging trends in this market and the reasons behind them?
Q.7 What are some changing demands of customers in the market?
Q.8 What are the new developments in the market? Which companies are leading these developments?
Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M & A activities did take place in the last five years in this market?

 
 
Report Scope

Key Features Description
Base Year for Estimation 2019
Trend Period
(Actual Estimates)
2014-2019
Forecast Period 2020-2025
Pages More than 150
Market Representation / Units Revenue in US $ Million
Report Coverage Market Trends & Forecasts, Competitor Analysis, New Product Development, Company Expansion, Merger, Acquisitions & Joint Venture, and Company Profiling
Market Segments Packaging Type (3D Stacked Memory, 2.5D Interposer, CIS With TSV, 3D Soc, and Others), End Use Industry (Consumer Electronics, Automotive, High-Performance Computing and Networking, and Others)

Regional Scope

North America (USA, Mexico, and Canada), Europe (United Kingdom, Spain, Germany, and France), Asia (China, India, Japan, and South Korea), and ROW (Brazil)

Customization 10% Customization without Any Additional Cost

Table of Contents
 
 
1. Executive Summary
 
2. Market Background and Classification
2.1: Introduction, Background, and Classification
2.2: Supply Chain
2.3: Industry Drivers and Challenges
 
3. Market Trends and Forecast Analysis from 2014 to 2025
3.1: Macroeconomic Trends and Forecast
3.2: Global 3D TSV and 2.5D Market Trends and Forecast
3.3: Global 3D TSV and 2.5D Market by Packaging Type
3.3.1: 3D Stacked Memory
3.3.2: 5D Interposer
3.3.3: CIS with TSV
3.3.4: 3D SoC
3.3.5: Others
3.4: Global 3D TSV and 2.5D Market by End-user Application
3.4.1: Consumer Electronics
3.4.2: Automotive 
3.4.3: High-Performance Computing and Networking
3.4.4: Others
          
4. Market Trends and Forecast Analysis by Region
4.1: Global 3D TSV and 2.5D Market by Region
4.2: North American 3D TSV and 2.5D Market
4.2.1: Market by Packaging Type: 3D Stacked Memory, 2.5D Interposer, CIS with TSV, 3D SoC, and Others
4.2.2: Market by End Use Industy: Consumer Electronics, Automotive, High-Performance Computing and Networking, and Others
4.2.3: United States 3D TSV and 2.5D Market
4.2.4: Canadian 3D TSV and 2.5D Market
4.2.5: Mexican 3D TSV and 2.5D Market
4.3: European 3D TSV and 2.5D Market 
4.3.1: Market by Packaging Type: 3D Stacked Memory, 2.5D Interposer, CIS with TSV, 3D SoC, and Others
4.3.2: Market by End Use Industy: Consumer Electronics, Automotive, High-Performance Computing and Networking, and Others
4.3.3: Germany 3D TSV and 2.5D Market
4.3.4: UK 3D TSV and 2.5D Market
4.3.5: Spain 3D TSV and 2.5D Market
4.3.6: France 3D TSV and 2.5D Market
4.4: APAC 3D TSV and 2.5D Market
4.4.1: Market by Packaging Type: 3D Stacked Memory, 2.5D Interposer, CIS with TSV, 3D SoC, and Others
4.4.2: Market by End Use Industry: Consumer Electronics, Automotive, High-Performance Computing and Networking, and Others
4.4.3: China 3D TSV and 2.5D Market
4.4.4: Japan 3D TSV and 2.5D Market
4.4.5: South Korea 3D TSV and 2.5D Market
4.4.6: India 3D TSV and 2.5D Market
4.5: ROW 3D TSV and 2.5D Market
4.5.1: Market by Packaging Type: 3D Stacked Memory, 2.5D Interposer, CIS with TSV, 3D SoC, and Others
4.5.2: Market by End Use Industry: Consumer Electronics, Automotive, High-Performance Computing and Networking, and Others
4.5.3: Brazil 3D TSV and 2.5D Market
 
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Market Share Analysis
5.3: Operational Integration
5.4: Geographical Reach
5.5: Porter’s Five Forces Analysis
 
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for Global 3D TSV and 2.5D Market by Packaging Type
6.1.2: Growth Opportunities for Global 3D TSV and 2.5D Market by End-Use Industry
6.1.3: Growth Opportunities for Global 3D TSV and 2.5D Market by Region
6.2: Emerging Trends in Global 3D TSV and 2.5D Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of Global 3D TSV and 2.5D Market
6.3.3: Mergers, Acquisitions and Joint Ventures in the Global 3D TSV and 2.5D Market
 
 
7. Company Profiles of Leading Players
7.1: Taiwan Semiconductor Manufacturing Company 
7.2: Samsung Electronics 
7.3: Toshiba 
7.4: ASE Group
7.5: Amkor Technology
 
.

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Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Below is a brief summary of the primary interviews that were conducted by job function for this report.