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The Impact of COVID-19 is included in Technology Landscape, Trends and Semiconductor and IC Packaging Material Market. Buy it today to get an advantage.

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The technologies in semiconductor and IC packaging materials has undergone significant change in recent years, with traditional dual in line packaging to advanced integrated circuit packaging. The rising wave of new technologies such as grid array (GA) is creating significant potential for semiconductor and IC packaging materials in consumer electronics, aerospace and defense, and communications and telecom applications to protect and insulate electronic components from external threats.

In semiconductor and IC packaging material market, various technologies such as SOP (Small Outline Package), GA (Grid Array), QFP (Quad Flat Package), and DIP(Dual In-Line Package) technologies are used in the consumer electronics, aerospace and defense, medical devices, communications and telecom, automotive industry, and energy and lighting applications. Increasing demand for consumer electronics and increasing R&D by key players towards making the electronic packaging materials are creating new opportunities for various semiconductor and IC packaging material technologies.

This report analyzes technology maturity, degree of disruption, competitive intensity, market potential, and other parameters of various technologies in the semiconductor and IC packaging material market. Some insights are depicted below by a sample figure. For more details on figures, the companies researched, and other objectives/benefits on this research report, please download the report brochure.

Global Semiconductor and IC Packaging Material Market by Technology Type

Technology Trends in Global Semiconductor and IC Packaging Material Market


Semiconductor and IC Packaging Material Technology Heat Map


The study includes technology readiness, competitive intensity, regulatory compliance, disruption potential, trends, forecasts and strategic implications for the global semiconductor and IC packaging material technology by application, technology, and region as follows:

Technology Readiness by Technology Type

Competitive Intensity and Regulatory Compliance

Disruption Potential by Technology Type
 
Trends and Forecasts by Technology Type [$M shipment analysis from 2013 to 2024]:
  • SOP (Small Outline Package)
  • GA (Grid Array)
  • QFP (Quad Flat Package)
  • DIP(Dual In-Line Package)
  • Others
Technology Trends and Forecasts by Application [$M shipment analysis from 2013 to 2024]:
  • Consumer Electronics
    • SOP (Small Outline Package)
    • GA (Grid Array)
    • QFP (Quad Flat Package)
    • DIP(Dual In-Line Package)
    • Others
  •  Aerospace and Defense
    • SOP (Small Outline Package)
    • GA (Grid Array)
    • QFP (Quad Flat Package)
    • DIP(Dual In-Line Package)
    • Others
  •  Medical Devices
    • SOP (Small Outline Package)
    • GA (Grid Array)
    • QFP (Quad Flat Package)
    • DIP(Dual In-Line Package)
    • Others
  • Communications and Telecom
    • SOP (Small Outline Package)
    • GA (Grid Array)
    • QFP (Quad Flat Package)
    • DIP(Dual In-Line Package)
    • Others
  •  Automotive Industry
    • SOP (Small Outline Package)
    • GA (Grid Array)
    • QFP (Quad Flat Package)
    • DIP(Dual In-Line Package)
    • Others
  •  Energy and Lighting
    • SOP (Small Outline Package)
    • GA (Grid Array)
    • QFP (Quad Flat Package)
    • DIP(Dual In-Line Package)
    • Others
Technology Trends and Forecasts by Region [$M shipment analysis for 2013 to 2024]:
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • United Kingdom
    • Germany
    • France
  • Asia Pacific
    • Japan
    • China
    • South Korea
    • India
  • The Rest of the World

Latest Developments and Innovations in the Semiconductor and IC Packaging Material Technologies

Companies / Ecosystems

Strategic Opportunities by Technology Type
 
Some of the semiconductor and IC packaging material companies profiled in this report include Hitachi Chemical, BASF SE, Henkel AG & Company, Sumitomo Chemical, Alent, and Kyocera Chemical.
 
This report answers following 9 key questions:
Q.1 What are some of the most promising and high-growth technology opportunities for the semiconductor and IC packaging material market?
Q.2 Which technology will grow at a faster pace and why?
Q.3 What are the key factors affecting dynamics of different technologies? What are the drivers and challenges of these technologies in semiconductor and IC packaging material market?
Q.4 What are the levels of technology readiness, competitive intensity and regulatory compliance in this technology space?
Q.5 What are the business risks and threats to these technologies in semiconductor and IC packaging material market?
Q.6 What are the latest developments in semiconductor and IC packaging material technologies? Which companies are leading these developments? 
Q.7 Which technologies have potential of disruption in this market?
Q.8 Who are the major players in this semiconductor and IC packaging material market? What strategic initiatives are being implemented by key players for business growth?
Q.9 What are strategic growth opportunities in this semiconductor and IC packaging material technology space?
Table of Contents

1. Executive Summary

2. Technology Landscape
2.1. Technology Background and Evolution
2.2. Technology and Application Mapping
2.3. Supply Chain

3. Technology Readiness
3.1. Technology Commercialization and Readiness
3.2. Drivers and Challenges in Semiconductor and IC Packaging Material Technologies
3.3. Competitive Intensity
3.4. Regulatory Compliance

4. Technology Trends and Forecasts analysis from 2013-2024
4.1. Semiconductor and IC Packaging Material Opportunity
4.2. Technology Trends (2013-2018) and Forecasts (2019-2024)
4.2.1. SOP (Small Outline Package)
4.2.2. GA (Grid Array)
4.2.3. QFP (Quad Flat Package)
4.2.4. DIP(Dual In-Line Package)
4.2.5. Others
4.3. Technology Trends (2013-2018) and Forecasts (2019-2024) by Application Segments
4.3.1. Consumer Electronics
4.3.1.1. SOP (Small Outline Package)
4.3.1.2. GA (Grid Array)
4.3.1.3. QFP (Quad Flat Package)
4.3.1.4. DIP(Dual In-Line Package)
4.3.1.5. Others
4.3.2. Aerospace and Defense
4.3.2.1. SOP (Small Outline Package)
4.3.2.2. GA (Grid Array)
4.3.2.3. QFP (Quad Flat Package)
4.3.2.4. DIP(Dual In-Line Package)
4.3.2.5. Others
4.3.3. Medical Devices
4.3.3.1. SOP (Small Outline Package)
4.3.3.2. GA (Grid Array)
4.3.3.3. QFP (Quad Flat Package)
4.3.3.4. DIP(Dual In-Line Package)
4.3.3.5. Others
4.3.4. Communications and Telecom
4.3.4.1. SOP (Small Outline Package)
4.3.4.2. GA (Grid Array)
4.3.4.3. QFP (Quad Flat Package)
4.3.4.4. DIP(Dual In-Line Package)
4.3.4.5. Others
4.3.5. Automotive Industry
4.3.5.1. SOP (Small Outline Package)
4.3.5.2. GA (Grid Array)
4.3.5.3. QFP (Quad Flat Package)
4.3.5.4. DIP(Dual In-Line Package)
4.3.5.5. Others
4.3.6. Energy and Lighting
4.3.6.1. SOP (Small Outline Package)
4.3.6.2. GA (Grid Array)
4.3.6.3. QFP (Quad Flat Package)
4.3.6.4. DIP(Dual In-Line Package)
4.3.6.5. Others

5. Technology Opportunities (2013-2024) by Region
5.1. Semiconductor and IC Packaging Material Market by Region
5.2. North American Semiconductor and IC Packaging Material Market
5.2.1. United States Semiconductor and IC Packaging Material Market
5.2.2. Canadian Semiconductor and IC Packaging Material Market
5.2.3. Mexican Semiconductor and IC Packaging Material  Market
5.3. European Semiconductor and IC Packaging Material Market
5.3.1. The United Kingdom Semiconductor and IC Packaging Material Market
5.3.2. German Semiconductor and IC Packaging Material Market
5.3.3. French Semiconductor and IC Packaging Material Market
5.4. APAC Semiconductor and IC Packaging Material Market
5.4.1. Chinese Semiconductor and IC Packaging Material Market
5.4.2. Japanese Semiconductor and IC Packaging Material Market
5.4.3. Indian Semiconductor and IC Packaging Material Market
5.4.4. South Korean Semiconductor and IC Packaging Material Market
5.5. ROW Semiconductor and IC Packaging Material Technology Market

6. Latest Development and Innovation in Semiconductor and IC Packaging Material Technologies

7. Companies / Ecosystem
7.1. Product Portfolio Analysis
7.2. Market Share Analysis
7.3. Geographical Reach

8. Strategic Implications
8.1. Implications
8.2. Growth Opportunity Analysis
8.2.1. Growth Opportunities for the Semiconductor and IC Packaging Material Market by Technology
8.2.2. Growth Opportunities for the Semiconductor and IC Packaging Material Market by Application
8.2.3. Growth Opportunities for the Semiconductor and IC Packaging Material Market by Region
8.3. Emerging Trends in the Semiconductor and IC Packaging Material Market
8.4. Disruption Potential
8.5. Strategic Analysis
8.5.1. New Product Development
8.5.2. Capacity Expansion of the Semiconductor and IC Packaging Material Market
8.5.3. Mergers, Acquisitions, and Joint Ventures in the Semiconductor and IC Packaging Material Market

9. Company Profiles of Leading Players            
9.1. Hitachi Chemical
9.2. BASF SE
9.3. Henkel AG & Company
9.4. Sumitomo Chemical
9.5. Alent
9.6. Kyocera Chemical
.

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Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
 
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process. 
 

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