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The future of the system in package market looks promising with opportunities in the automotive & transportation, healthcare, communication, aerospace & defense, industrial, and consumer electronics applications. The global system in package market is expected to grow with a CAGR of 8% to 10% from 2021 to 2026. The major drivers for this market are increasing demand for miniaturization of electronic device, increasing usage in graphic cards and processors, and high penetration of IoT.
A more than 150 page report is developed to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of system in package market report download the report brochure.

system in package