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The future of the system in package market looks promising with opportunities in the automotive & transportation, healthcare, communication, aerospace & defense, industrial, and consumer electronics applications. The global system in package market is expected to grow with a CAGR of 8% to 10% from 2021 to 2026. The major drivers for this market are increasing demand for miniaturization of electronic device, increasing usage in graphic cards and processors, and high penetration of IoT.
A more than 150 page report is developed to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of system in package market report download the report brochure.
The study includes trends and forecast for the global system in package market by device type, packaging method, package type, packaging technology, application, and region as follows:
By Packaging Technology [$M shipment analysis for 2015 – 2026]:
By Package Type [$M shipment analysis for 2015 – 2026]:
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Ball Grid Array
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Surface Mount Package
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Pin Grid Array
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Flat Package
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Small Outline Package
By Packaging Method [$M shipment analysis for 2015 – 2026]:
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Fan-Out Wafer Level Packaging
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Wire Bond & Die Attach
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Flip Chip
By Device Type [$M shipment analysis for 2015 – 2026]:
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RF Front-End
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RF Power Amplifier
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Power Management Integrated Circuits
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Baseband Processor
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Application Processor
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Microelectromechanical System
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Others
By Application [$M shipment analysis for 2015 – 2026]:
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Automotive & Transportation
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Consumer Electronics
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Communication
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Industrial
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Aerospace & Defense
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Healthcare
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Others
By Region [$M shipment analysis for 2015 – 2026]:
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North America
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United States
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Canada
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Mexico
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Europe
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Germany
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United Kingdom
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France
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Italy
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Asia Pacific
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China
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Japan
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India
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South Korea
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The Rest of the World
Lucintel forecasts that RF front end device will remain the largest segment due to rising demand for compact size and high frequency transceiver solutions in various electronics products such as smartphones and tablets.
Within the system in package market, consumer electronics will remain the largest application during the forecast period due to increase in the demand for miniaturized electronic devices such as laptops, smartphones, gaming devices, smart home devices, and smart appliances.
Asia Pacific will remain the largest region during the forecast period due to increasing demand in consumer electronics and increasing presence of major players in the APAC region.
Some of the system in package companies profiled in this report includes Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group.
Features of System in Package Market
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Market Size Estimates: System in Package market size estimation in terms of value ($M)
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Trend and Forecast Analysis: Market trends (2015-2020) and forecast (2021-2026) by various segments and regions.
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Segmentation Analysis: Market size by packaging technology, device type, package type, packaging method, and application
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Regional Analysis: System in Package market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
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Growth Opportunities: Analysis on growth opportunities in different packaging technology, device type, package type, packaging method, and application, and regions for system in package market.
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Strategic Analysis: This includes M&A, new product development, and competitive landscape for the system in package market.
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Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
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This report answers following 11 key questions |
Q.1 What are some of the most promising potential, high-growth opportunities for the global system in package market by packaging technology (2D IC, 2.5D IC, 3D IC), packaging method (fan-out wafer level packaging, wire bond & die attach, and flip chip), package type (ball grid array, surface mount package, pin grid array, flat package, and small outline package), device type (RF front-end, RF power amplifier, power management integrated circuits, baseband processor, application processor, microelectromechanical system, and others), application (automotive & transportation, healthcare, communication, aerospace & defense, industrial, consumer electronics, and other), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the system in package market?
Q.5 What are the business risks and threats to the system in package market?
Q.6 What are emerging trends in the system in package market and the reasons behind them?
Q.7 What are some changing demands of customers in the system in package market?
Q.8 What are the new developments in the system in package market? Which companies are leading these developments?
Q.9 Who are the major players in the system in package market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in the system in package market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M&A activities did take place in the last five years in the system in package market? |