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The future of the system in package market looks promising with opportunities in the automotive & transportation, healthcare, communication, aerospace & defense, industrial, and consumer electronics applications. The global system in package market is expected to grow with a CAGR of 8% to 10% from 2021 to 2026. The major drivers for this market are increasing demand for miniaturization of electronic device, increasing usage in graphic cards and processors, and high penetration of IoT.
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