According to a new market report published by Lucintel, the future of the system in package market looks promising with opportunities in the automotive & transportation, healthcare, communication, aerospace & defense, industrial, and consumer electronics applications. The global system in package market is expected to grow with a CAGR of 9% from 2021 to 2026. The major drivers for this market are increasing demand for miniaturization of electronic device, increasing usage in graphic cards and processors, and high penetration of IoT.
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In this market, different device types of system in package, such RF front-end, RF power amplifier, power management integrated circuits, baseband processor, application processor, and microelectromechanical system are used in a wide range of industries. Lucintel forecasts that RF front end device will remain the largest segment due to rising demand for compact size and high frequency transceiver solutions in various electronics products such as smartphones and tablets.
Within the system in package market, consumer electronics will remain the largest application during the forecast period due to increase in the demand for miniaturized electronic devices such as laptops, smartphones, gaming devices, smart home devices, and smart appliances.
Asia Pacific will remain the largest region during the forecast period due to increasing demand in consumer electronics and increasing presence of major players in the APAC region.
Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group are among the major system in package manufacturers.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global system in package market by device type, packaging method, package type, packaging technology, application, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global System in Package Market 2021-2026: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global system in package market by device type, packaging method, package type, packaging technology, application, and region as follows:
By Packaging Technology [$M shipment analysis for 2015 – 2026]:
By Package Type [$M shipment analysis for 2015 – 2026]:
Ball Grid Array
Surface Mount Package
Pin Grid Array
Flat Package
Small Outline Package
By Packaging Method [$M shipment analysis for 2015 – 2026]:
Fan-Out Wafer Level Packaging
Wire Bond & Die Attach
Flip Chip
By Device Type [$M shipment analysis for 2015 – 2026]:
RF Front-End
RF Power Amplifier
Power Management Integrated Circuits
Baseband Processor
Application Processor
Microelectromechanical System
Others
By Application [$M shipment analysis for 2015 – 2026]:
Automotive & Transportation
Consumer Electronics
Communication
Industrial
Aerospace & Defense
Healthcare
Others
By Region [$M shipment analysis for 2015 – 2026]:
North America
United States
Canada
Mexico
Europe
Germany
United Kingdom
France
Italy
Asia Pacific
China
Japan
India
South Korea
The Rest of the World
This more than 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. We offer market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision makers in a variety of industries. For further information, visit www.lucintel.com.