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According to a new market report by Lucintel, the future of the silicon carbide (SiC) market looks promising with opportunities in the telecommunications, energy and power, automotive, renewable power generation, defense, and power electronics industries. The silicon carbide market is expected to grow with a CAGR of 17% from 2019 to 2024. The major drivers for this market are increasing demand for motor drives, growing application of SiC devices in RF and cellular base station, and increasing use of SiC in semiconductor to perform at high temperature and high voltage environment.

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In this market, silicon carbide is used for manufacturing of SiC discrete devices and SiC bare die. Lucintel forecasts that SiC discrete device will remain the largest segment over the forecast period.

Within the silicon carbide market, RF device and cellular base station, power grid device, flexible AC transmission systems (FACTS), high-voltage direct current (HVDC), and power supply and inverter are the major applications. Lucintel forecasts that RF device and cellular base station will remain the largest region over the forecast period.

Infineon Technologies, Cree (Wolfspeed), RoHM Semiconductor, STMicroelectronics, ON Semiconductor, Toshiba, General Electric, Saint-Gobain Silicon Carbide, Fuji Electric, Ltd., and Renesas Electronics are among the major suppliers in the silicon carbide.

Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the silicon carbide market by SiC based device, application, wafer size, end use industry, and region. Lucintel has prepared a comprehensive research report entitled “Silicon Carbide Market 2019-2024: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the silicon carbide market by device, application, wafer size, and end use industry, and region as follows:

 By SiC based Device [$M shipment analysis for 2013 – 2024]:

  • SiC Discrete Devices

    • SiC MOSFET

    • SiC Diode

    • SiC Module

  • SiC Bare Die

By Wafer Size [$M shipment analysis for 2013 – 2024]:

  • 2 Inch

  • 4 Inch

  • 6-Inch and above

By Application [$M shipment analysis for 2013 – 2024]:

  • RF Device and Cellular Base Station

  • Power Grid Device

  • Flexible AC Transmission Systems (FACTS)

  • High-Voltage, Direct Current (HVDC)

  • Power Supply and Inverter

  • Lighting Control

  • Industrial Motor Drive

  • Others

By End Use Industry [$M shipment analysis for 2013 – 2024]:

  • Telecommunications

  • Energy & Power

  • Automotive

  • Renewable Power Generation

  • Defense

  • Power Electronics

  • Others

By Region [$M shipment analysis for 2013 – 2024]:

  • North America

    • United States

    • Canada

    • Mexico

  • Europe

    • UK

    • Germany

    • Italy

  • Asia Pacific

    • China

    • Japan

    • India

  • Rest of the World

This 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link or

About Lucintel

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit