According to a new market report by Lucintel, the future of the power module packaging market looks promising with opportunities in the electric vehicle (EV)/hybrid electric vehicle (HEV), motor, rail traction, wind turbine, and solar photovoltaic industries. The global power module packaging market is expected to grow with a CAGR of 10% from 2020 to 2025. The major growth drivers for this market growth of the electric vehicle and solar PV industries.
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In this market, die attach, baseplate, substrate attach, substrate, encapsulation, and interconnection are the major packaging solutions used. Lucintel forecasts that baseplate will remain the largest segment over the forecast period due to the growth of the electric vehicle market.
Within this market, electric vehicle is expected to witness the highest growth over the forecast period due to increasing focus of various countries towards reduction of carbon emissions.
APAC is expected to witness highest growth over the forecast period due to growth of the renewable capacity expansion, which continues to be driven mostly by new installations of solar and wind energy.
Fuji Electric Co. Ltd, Infineon Technologies AG, Mitsubishi Electric Corporation (Powerex Inc.), Amkor Technology Inc., Hitachi Ltd among the major manufacturers of the power module packaging market.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the power module packaging market by packaging solution, end use industry, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global Power Module Packaging Market 2020-2025: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global power module packaging market by packaging solution, end use industry, and region as follows
By Packaging Solution [$M shipment analysis for 2014 – 2025]:
Die attach
Baseplate
Substrate Attach
Substrate
Encapsulation
Interconnection
Others
By End Use Industry [$M shipment analysis for 2014 – 2025]:
Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
Motors
Rail Tractions
Wind Turbines
Solar Photovoltaic
Others
By Region [$M shipment analysis for 2014 – 2025]:
United States
Canada
Mexico
China
Japan
India
South Korea
This 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.