According to a new market report published by Lucintel, the future of the molded interconnected device market looks promising with opportunities in the automotive, medical, telecommunication, industrial, and consumer electronics industries. The global molded interconnected device market is expected to grow with a CAGR of 15% from 2021 to 2026. The major drivers for this market are increasing demand of miniaturization in consumer electronics segment, increasing use in medical device, and increase in the penetration of automation around all industrial verticals.
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In this market, laser direct structuring, 2-shot molding, and film techniques are the different process of molded interconnected device used in a wide range of industries. Lucintel forecasts that laser direct structuring will remain the largest segment due to rise in the demand of smartphone antennas and emergence of 5G mobile communication technology.
Within the molded interconnected device market, automotive will remain the largest end use industry during the forecast period due to increasing adoption of MID in various automotive application such as steering wheel hubs, brake sensors, position sensors, and lighting.
Asia Pacific will remain the largest region during the forecast period due to increasing demand in consumer electronics industries and significant presence of major leading players of smartphones and wearable device in the APAC region.
Molex, MacDermid, Siemens, LPKF Laser & Electronics, Fujitsu, TE Connectivity, Harting, Select Connect Technologies, JOHNAN MID Solutions, 2E mechatronic, and Multiple Dimensions are among the major molded interconnected device manufacturers.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global molded interconnected device market by process, product type, end use industry, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global Molded Interconnected Device Market 2021-2026: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global molded interconnected device market by process, product type, end use industry, and region as follows:
By Process [$M shipment analysis for 2015 – 2026]:
Laser Direct Structuring
2-Shot Molding
Film Techniques
By Product Type [$M shipment analysis for 2015 – 2026]:
Antennae & Connectivity Modules
Connectors & Switches
Sensors
Lighting
Others
By End Use Industry [$M shipment analysis for 2015 – 2026]:
Telecommunications
Consumer Electronics
Medical
Automotive
Industrial
By Region [$M shipment analysis for 2015 – 2026]:
North America
United States
Canada
Mexico
Europe
Germany
United Kingdom
France
Italy
Asia Pacific
China
Japan
India
South Korea
The Rest of the World
This more than 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
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