According to a new market report by Lucintel, the future of the memory packaging market looks promising with opportunities in the IT and telecom, consumer electronics, embedded systems. The global memory packaging market is expected to grow with a CAGR of 5% from 2020 to 2025. The major growth drivers for this market are increase in the demand for smartphones and demand for quantum dots in high-quality display devices.
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In this market, flip-chip, lead frame, wafer level chip scale packaging are the platforms used. Lucintel forecasts that flip-chip is expected to witness the highest growth over the forecast period due to increased adoption in the DRAM PC/server, fueled by high bandwidth requirements.
Within this market, consumer electronics is expected to witness the highest growth over the forecast period due to growth of the electronic devices, such as smartphones, PCs, music players, laptops, netbooks, and tablets.
APAC is expected to witness the highest growth over the forecast period due to a wide range of applications of memory packaging in numerous consumer electronics, mainly tablets and smartphones.
Lingsen Precision Industries Ltd, Hana Micron Inc, ASE Kaohsiung, Amkor Technology Inc, Powertech Technology Inc. are among the major manufacturers of the memory packaging market.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global memory packaging market by platform, application, end use industry and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global Memory Packaging Market 2020-2025: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global memory packaging market by platform, application, end use industry and region as follows
By Platform [$M shipment analysis for 2014 – 2025]:
Flip-chip
Lead Frame
Wafer Level Chip Scale Packaging
Others
By Application [$M shipment analysis for 2014 – 2025]:
NAND Flash Packaging
NOR Flash Packaging
DRAM Packaging
Others
By End Use Industry [$M shipment analysis for 2014 – 2025]:
IT and Telecom
Consumer Electronics
Automotive
Others
By Region [$M shipment analysis for 2014 – 2025]:
North America
United States
Canada
Mexico
Europe
Asia Pacific
China
Japan
India
South Korea
Rest of the World
This 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.