The hybrid memory cube (HMC) and high-bandwidth memory (HBM) market is expected to grow at a CAGR of 33% by 2024


   October 1, 2019
According to a market report by Lucintel, the future of the hybrid memory cube (HMC) and high-bandwidth memory (HBM) market looks promising with opportunities in the graphics, high-performance computing, networking, and data center markets. The hybrid memory cube (HMC) and high-bandwidth memory (HBM) market is expected to grow with a CAGR of 33% from 2019 to 2024. The major drivers for this market are increasing adoption of artificial intelligence, miniaturization of electronic devices; and growing need for high-bandwidth, low power consuming, and highly scalable memories.

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In this market, graphics processing unit (GPU), central processing unit (CPU), accelerated processing unit (APU), field-programmable gate array (FPGA), and application-specific integrated circuit (ASIC) are the major device type. Within the hybrid memory cube (HMC) and high-bandwidth memory (HBM) market, graphics, high-performance computing, networking, and data centers are the major applications.

Hybrid memory cube (HMC) and high-bandwidth memory (HBM) are the major memory types of this market.

APAC will remain the largest market over the forecast period.

Micron, Samsung, SK Hynix, Advanced Micro Devices, Intel, Xilinx, Fujitsu, Nvidia, IBM, Open-Silicon, and others are among the major manufacturers of hybrid memory cube (HMC) and high-bandwidth memory (HBM).

Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the hybrid memory cube (HMC) and high-bandwidth memory (HBM) market by memory type, device type, application, and region. Lucintel has prepared a comprehensive research report entitled “Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market 2019-2024: Trends, Forecast, and Opportunity Analysis. This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the hybrid memory cube (HMC) and high-bandwidth memory (HBM) market by memory type, device type, application, and region as follows:

By Memory Type [$M shipment analysis for 2013 – 2024]:



  • Hybrid Memory Cube (HMC)


  • High-bandwidth memory (HBM)


By Device Type [$M shipment analysis for 2013 – 2024]:



  • Graphics Processing Unit (GPU)


  • Central Processing Unit (CPU)


  • Accelerated Processing Unit (APU)


  • Field-programmable Gate Array (FPGA)


  • Application-specific Integrated Circuit (ASIC)


By Application [$M shipment analysis for 2013 – 2024]:



  • Graphics


  • High-performance Computing


  • Networking


  • Data Centers


By Region [$M shipment analysis for 2013 – 2024]:



  • North America


    • United States


    • Canada


    • Mexico




  • Europe


    • UK


    • Germany


    • Italy




  • Asia Pacific


    • China


    • Japan


    • India




  • Rest of the World


This 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/hybrid-memory-cube-and-high-bandwidth-memory.aspx or helpdesk@lucintel.com.

About Lucintel

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.


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