Lucintel anticipates that Asia Pacific will be the fastest growing region in the camera modules market

   September 30, 2019
According to a market report by Lucintel, the future of the camera modules market looks promising with opportunities in the consumer electronics, security and surveillance, automotive, industrial, and aerospace and defense industries. The camera module market is expected to grow with a CAGR of 10% from 2019 to 2024. The major drivers for this market are growing demand for camera in the consumer electronics market, enhancement in the image resolution of sensors, technological advancement in camera module components and design, and increased application of camera in automotive sector.         

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In this market, consumer electronics, security and surveillance, automotive, aerospace and defense, and industrial are the major application. Within the camera module market, COB (chip-on-board) camera module and flip-chip camera modules are the major process types. Flip-chip camera modules are the largest segment.

APAC will remain the largest region over the forecast period.         

LG Electronics, Samsung Electro-Mechanics, Sharp Corporation, Lite-On Technology, Cowell e Holdings, Sunny Optical Technology, Toshiba Corporation, Chiconey Electronics, and Foxconn Electronics are among the major manufacturers of the camera module.          

Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the camera module market by component, process, application, and region. Lucintel has prepared a comprehensive research report entitled "Growth Opportunity in the Camera Module Market 2019-2024: Trends, Forecast, and Opportunity Analysis."  This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the camera modules market by component, process, application, and region as follows :

By Component  [$M shipment analysis for 2013 – 2024]:

  • Image Sensor

  • Lens Module

  By Application [$M shipment analysis for 2013 – 2024]:

  • Consumer Electronics

  • Security & Surveillance

  • Automotive

  • Aerospace & Defense

  • Industrial

By Process [$M shipment analysis for 2013 – 2024]:

  • Flip-Chip

  • Chip-On-Board (COB) Camera Module

By Region [$M shipment analysis for 2013 – 2024]:

  • North America

    • United States

    • Canada

    • Mexico

  • Europe

    • UK

    • Germany

    • Italy

  • Asia Pacific

    • China

    • Japan

    • India

  • Rest of the World

This 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link or

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