The global bonding wire Market is expected to grow at a CAGR of 9% by 2025


   April 7, 2021
According to a new market report by Lucintel, the future of the global bonding wire market looks promising with opportunities in the semiconductor industry. The global bonding wire market is expected to decline in 2020 due to the global economic recession led by COVID-19. However, the market will witness recovery in the year 2021 and it is expected to grow with a CAGR of 9% from 2020 to 2025. The major growth driver for this market is increasing demand for miniaturization in the semiconductor sector.

To download report brochure, please go to www.lucintel.com/bonding-wire-market.aspx and click "download brochure" tab from the menu.

In this market, gold, palldium-coated copper, copper, and silver are the materials used. Lucintel forecasts that plaldium-coated copper is expected to witness the highest growth over the forecast period due to its better properties of being high resistant to corrosion and oxidation.

Within this market, IC transistor is expected to witness the highest growth over the forecast period due to growth of the semiconductor industry.

Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to the presence of presence of several semiconductor manufacturing giants in this region

MK Electron, California Fine Wire, Heraeus, TANAKA Precious Metals, and Sumitomo are among the major manufacturers of the global bonding wire market.

Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global bonding wire market by material, application, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global Bonding Wire Market 2020-2025: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global bonding wire market by materials, application, and region as follows:

By Material [$M shipment analysis for 2014 – 2025]:



  • Gold


  • Palldium-coated Copper


  • Copper


  • Silver


By Application [$M shipment analysis for 2014 – 2025]:



  • IC Transistor


  • Others


By Region [$M shipment analysis for 2014 – 2025]:



  • North America


    • United States


    • Canada


    • Mexico




  • Europe


    • Germany


    • UK


    • Italy




  • Asia Pacific


    • China


    • Japan


    • India


    • South Korea




  • Rest of the World


 

This 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.



About Lucintel

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.


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