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The future of the global bonding wire market looks promising with opportunities in the semiconductor industry. The global bonding wire market is expected to decline in 2020 due to the global economic recession led by COVID-19. However, the market will witness recovery in the year 2021 and it is expected to grow with a CAGR of 8% to 10% from 2020 to 2025. The major growth driver for this market is increasing demand for miniaturization in the semiconductor sector.
 
A total of XX figures / charts and XX tables are provided in more than 150 pages report is developed to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of global bonding wire market report download the report brochure.
 
bonding wire
 
Growth in various segments of the bonding wire market are given below
 
bonding wire
 
The study includes trends and forecast for the global bonding wire market by materials, application, and region as follows
 
By Material [$M shipment analysis for 2014 – 2025]:
  • Gold
  • Palldium-coated Copper
  • Copper
  • Silver
By Application [$M shipment analysis for 2014 – 2025]:
  • IC Transistor
  • Others
By Region [$M shipment analysis for 2014 – 2025]:
  • North America
  • United States
  • Canada
  • Mexico
  • Europe
  • Germany
  • UK
  • Italy
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Rest of the World
Some of the bonding wire manufacturers profiled in this report include, MK Electron, California Fine Wire, Heraeus, TANAKA Precious Metals, and Sumitomo.
 
Lucintel forecasts that plaldium-coated copper is expected to witness the highest growth over the forecast period due to its better properties of being high resistant to corrosion and oxidation.
 
Within this market, IC transistor is expected to witness the highest growth over the forecast period due to growth of the semiconductor industry. 
 
Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to the presence of presence of several semiconductor manufacturing giants in this region.
 
 
Features of the Global Bonding Wire Market
  • Market size estimates: Global bonding wire market size estimation in terms of value ($M) shipment.
  • Trend and forecast analysis: Market trend (2014-2019) and forecast (2020-2025) by end use industry
  • Segmentation analysis: Market size by various segments such as by materials, application, and region
  • Regional analysis: Global bonding wire market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth opportunities: Analysis on growth opportunities in different materials, application and regions for the global bonding wire market.
  • Strategic analysis: This includes M&A, new product development, and competitive landscape of the global bonding wire market.
  • Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
 
 
This report answers following 11 key questions
Q.1 What are some of the most promising potential, high-growth opportunities for the global bonding wire market by material (gold, palldium-coated copper, copper, and silver), by application (IC transistor and others), and region (North America, Europe, Asia Pacific (APAC), and Rest of the World (ROW)?                                                                                              
Q. 2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to the global bonding wire market?
Q.6 What are emerging trends in global bonding wire market and the reasons behind them?
Q.7 What are some changing demands of customers in the global bonding wire market?
Q.8 What are the new developments in the bonding wire market? Which companies are leading these developments?
Q.9 Who are the major players in this global bonding wire market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this global bonding wire market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M & A activities did take place in the last five years in this, global bonding wire market?
 
Report Scope

Key Features Description
Base Year for Estimation 2019
Trend Period
(Actual Estimates)
2014-2019
Forecast Period 2020-2025
Pages 150
Market Representation / Units Revenue in US $ Million
Report Coverage Market Trends & Forecasts, Competitor Analysis, New Product Development, Company Expansion, Merger Acquisitions & Joint Venture, and Company Profiling
Market Segments By Material (Gold, Palldium-Coated Copper, Copper, and Silver), By Application (IC Transistor and Others)
Regional Scope North America, Europe, Asia Pacific, and RoW
Customization 10% Customization Without any Additional Cost
 

Table of Contents
 
1. Executive Summary
 
2. Market Background and Classification
2.1: Introduction, Background, and Classification
2.2: Supply Chain
2.3: Industry Drivers and Challenges
 
3. Market Trends and Forecast Analysis from 2014 to 2025
3.1: Macroeconomic Trends and Forecast
3.2: Global Bonding Wire Market Trends and Forecast
3.3: Global Bonding Wire Market by Material
3.3.1: Gold
3.3.2: Palldium-coated copper
3.3.3: Copper
3.3.4: Silver
3.4: Global Bonding Wire Market by Application
3.4.1: IC Transistor
3.4.2: Others
 
4. Market Trends and Forecast Analysis by Region              
4.1: Global Bonding Wire Market by Region
4.2: North American Bonding Wire Market 
4.2.1: Market by Material: Gold, Palldium-coated copper, Copper, and Silver.
4.2.2: Market by Application: IC Transistor, and Others
4.2.3: United States Bonding Wire Market
4.2.4: Canadian Bonding Wire Market
4.2.5: Mexican Bonding Wire Market
4.3: European Bonding Wire Market
4.3.1: Market by Material: Gold, Palldium-coated copper, Copper, and Silver.
4.3.2: Market by Application: IC Transistor, and Others
4.3.3: Germany Bonding Wire Market
4.3.4: UK Bonding Wire Market
4.3.5: Italy Bonding Wire Market
4.4: APAC Bonding Wire Market
4.4.1: Market by Material: Gold, Palldium-coated copper, Copper, and Silver.
4.4.2: Market by Application: IC Transistor, and Others
4.4.3: China Bonding Wire Market
4.4.4: Japan Bonding Wire Market
4.4.5: South Korea Bonding Wire Market
4.4.6: India Bonding Wire Market
4.5: ROW Bonding Wire Market
4.5.1: Market by Material: Gold, Palldium-coated copper, Copper, and Silver.
4.5.2: Market by Application: IC Transistor, and Others
 
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Market Share Analysis
5.3: Operational Integration
5.4: Geographical Reach
5.5: Porter’s Five Forces Analysis
 
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for Global Bonding Wire by Material
6.1.2: Growth Opportunities for Global Bonding Wire Market by Application
6.1.3: Growth Opportunities for Global Bonding Wire Market by Region
6.2: Emerging Trends in Bonding Wire Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of Global Bonding Wire Market
6.3.3: Mergers, Acquisitions and Joint Ventures in the Global Bonding Wire Market
 
7. Company Profiles of Leading Players
7.1: MK Electron 
7.2: California Fine Wire
7.3: Heraeus 
7.4: TANAKA Precious Metals
7.7: Sumitomo 
 
.

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Full Report: Bonding Wire Market: Market Size, Trends and Growth Analysis Full Report $ 4,850
150 - page report
Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Below is a brief summary of the primary interviews that were conducted by job function for this report.
 

 
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process.
 
 

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