According to a market report by Lucintel, the future of the bonding film market looks promising with opportunities in the electrical & electronics, transportation, and packaging industries. The bonding film market is expected to grow with a CAGR of 8% from 2019 to 2024. The major growth drivers for this market are increased usage of bonding films in transportation and aerospace industries and growing preference over conventional adhesives in high end applications.
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In this market, epoxy, acrylic, and polyurethane are the major polymer type used in the bonding film market.
Within the bonding film market, electrical & electronics, transportation, and packaging are the major end use industries. Electrical & electronics is the largest end use segment for bonding films.
Thermally cured and pressure cured are the major technology used in the bonding film market.
Asia Pacific is projected to remain the largest region over the forecast period due to increasing demand for bonding films from various end use industries, such as electrical & electronics and transportation.
Rogers Corporation, Plitek, LLC, Pontacol AG, Formplast, Fastel Adhesives & Substrate Products, Dai Nippon Printing Co., Ltd., Flextech Srl, Chemtech Co., Ltd., Gluetex GmbH, HMT Manufacturing, Inc., Optimum Plastics., Nihon Matai Co., Ltd., Everad Adhesives, and Specialty Adhesive Film Co, Inc. are among the major manufacturers of bonding films.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the bonding film market by end use industry, polymer type, technology, and region. Lucintel has prepared a comprehensive research report entitled "Bonding Film Market 2019-2024: Trends, Forecast, and Opportunity Analysis". This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the bonding film market by end use industry, polymer type, technology, and region as follows:
By Polymer Type [$M shipment analysis for 2013 – 2024]:
Epoxy
Acrylic
Polyurethane
Others
By Technology [$M shipment analysis for 2013 – 2024]:
Thermally Cured
Pressure Cured
Others
By End Use Industry [$M shipment analysis for 2013 – 2024]:
Electrical & Electronics
Transportation
Packaging
Others
By Region [$M shipment analysis for 2013 – 2024]:
North America
Europe
Germany
Spain
France
United Kingdom
Russia
Asia Pacific
China
Japan
India
South Korea
Thailand
The Rest of the World
This 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/bonding-film-market.aspx or helpdesk@lucintel.com.
About Lucintel
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