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The future of the Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) market looks promising with opportunities in graphics, high performance computing, networking, and data center applications. The global HMC and HBM market is expected to reach an estimated $6.2 billion by 2027 with a CAGR of 28% from 2021 to 2027. The major drivers for this market are growing need for high bandwidth, low power consumption, highly scalable memories in various applications, growth in artificial intelligence, and miniaturization of electronic devices. 
 
Emerging trends, which have a direct impact on the dynamics of the industry, include development of advanced technology with new packaging options and increasing demand for HBM for enhancing virtual reality and augmented reality experience. Micron Technology (United States), Samsung Electronics (South Korea), and SK Hynix (South Korea) are among the major HMC and HBM manufacturers.
 
A total of 60 figures / charts and 62 tables are provided in this 130-page report to help in your business decisions. A sample figure with insights is shown below. To learn the scope of benefits, companies researched, and other details of the HMC and HBM market report, please download the report brochure.

 
HMC and HBM Market by Memory, Application, and Device
 
In this market, high performance computing is the largest application market, whereas graphics processing units is the largest device type segment. Growth in various segments of the HMC and HBM market is shown in the figure given below.
 
HMC and HBM Market by Segment
 
The study includes trends and forecast for the global HMC and HBM market by memory type, application, device type, and region are as follows:
 
By Memory Type [$M shipment analysis for 2016 – 2027]:
  • HMC (Hybrid Memory Cube)
  • HBM (High Bandwidth Memory)
By Application [$M shipment analysis for 2016 – 2027]:
  • Graphics
  • High Performance Computing
  • Networking 
  • Data Centers and Others 
By Device Type [$M shipment analysis for 2016 – 2027]:
  • CPU
  • GPU
  • FPGA
  • APU
  • ASIC and Others 
By Region [$M shipment analysis for 2016 – 2027]:
  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World
Micron Technology (United States), Samsung Electronics (South Korea), and SK Hynix (South Korea) are among the major HMC and HBM manufacturers.
 
Lucintel forecasts that HBM will remain the largest segment during the forecast period due to increasing demand for advanced Graphics Processing Unit (GPU) and Central Processing Unit (CPU) in the high performance computing market.
 
High performance computing will remain the largest application segment during the forecast period due to growing adoption of artificial intelligence in retail, manufacturing, transportation, financial institution, and healthcare sectors. 
Asia Pacific will remain the largest region by value during the forecast period due to growth in enterprise storage and consumer electronics sectors and increasing number of data centers and servers. 
 
 
Features of HMC and HBM Market
  • Market Size Estimates: HMC and HBM market size estimation in terms of value ($M)
  • Trend and Forecast Analysis: Market trends (2016-2021) and forecast (2022-2027) by various segments and regions.
  • Segmentation Analysis: Market size by memory type, application, and device type
  • Regional Analysis: HMC and HBM market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in various applications, memory types, device types, and regions for HMC and HBM market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the HMC and HBM market.
  • Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
 
 
This report answers following 11 key questions
 
Q.1 What are some of the most promising potential, high-growth opportunities for the global HMC and HBM market by memory type (hybrid memory cube and high bandwidth memory), application (graphics, high performance computing, networking, and data centers and others), device type (CPU, GPU, FPGA, APU, and ASIC and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the HMC and HBM market?
Q.5 What are the business risks and threats to the HMC and HBM market?
Q.6 What are the emerging trends in this HMC and HBM market and the reasons behind them?
Q.7 What are some changing demands of customers in the HMC and HBM market?
Q.8 What are the new developments in the HMC and HBM market? Which companies are leading these developments?
Q.9 Who are the major players in the HMC and HBM market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in the HMC and HBM market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M&A activities did take place in the last five years in the HMC and HBM market?
 

Table of Contents
 
1. Executive Summary
 
2. Market Background and Classifications
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
 
3. Market Trends and Forecast Analysis from 2016 to 2027
3.1: Macroeconomic Trends (2016-2021) and Forecast (2022-2027)
3.2: Global HMC and HBM Market Trends (2016-2021) and Forecast (2022-2027)
3.3: Global HMC and HBM Market by Memory Type 
3.3.1: HMC
3.3.2: HMB 
3.4: Global HMC and HBM Market by Application 
3.4.1: Graphics 
3.4.2: HPC
3.4.3: Networking
3.4.4: Data Centers and Others 
3.5: Global HMC and HBM Market by Device Type 
3.5.1: FPGA
3.5.2: CPU
3.5.3: GPU
3.5.4: APU
3.5.5: ASIC and Others 
 
4. Market Trends and Forecast Analysis by Region from 2016 to 2027
4.1: Global HMC and HBM Market by Region
4.2: North American HMC and HBM Market
4.2.1: Market by Application
4.2.2: Market by Device Type
4.3: European HMC and HBM Market
4.3.1: Market by Application
4.3.2: Market by Device Type
4.4: APAC HMC and HBM Market
4.4.1: Market by Application
4.4.2: Market by Device Type
4.5: ROW HMC and HBM Market
4.5.1: Market by Application
4.5.2: Market by Device Type
 
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Geographical Reach
5.3: Porter’s Five Forces Analysis
 
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global HMC and HBM Market by Application
6.1.2: Growth Opportunities for the Global HMC and HBM Market by Device Type
6.1.3: Growth Opportunities for the Global HMC and HBM Market by Memory Type
6.1.4: Growth Opportunities for the Global HMC and HBM Market by Region 
6.2: Emerging Trends in the Global HMC and HBM Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global HMC and HBM Market
6.3.3: Mergers and Acquisitions in the Global HMC and HBM Industry
 
7. Company Profiles of Leading Players
7.1: Micron Technology 
7.2: Samsung Electronics
7.3: SK Hynix 
 
.

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Full Report: Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market: Trends, Opportunities and Competitive Analysis Full Report $ 4,850
60 figures/charts and 62 tables are provided in this 130 - page report
Lucintel has been in the business of market research and management consulting since 1998 and has published over 600 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team.

The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted in the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts in HMC and HBM  market. Major manufacturers of HMC and HBM are Micron Technology, Samsung Electronics, SK Hynix , and others.

Below is a brief summary of the primary interviews that were conducted by job function for this report.
 
Primary Interviews by Job Function Primary Interviews by Region

Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process.
 
Lucintel' s methodology for market research
 

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