• helpdesk@Lucintel.com
  • |
  • +1 972 636 5056
  • |
  • Login
  • |
  • Register
  • |
...

The Impact of COVID-19 is included in HDI PCB Market Trends. Buy it today to get an advantage.

Request the impact of COVID-19 on your product or industry


The future of the high-density interconnect (HDI) PCB market looks promising with opportunities in the smartphone, computer, telecom and datacom, consumer electronics, and automotive industries. The global HDI PCB market is expected to reach an estimated $19.1 billion by 2027 with a CAGR of 4.7% from 2021 to 2027. The major drivers for this market are growth in consumer electronics market, miniaturization of electronic devices, and increasing demand for high performance devices.
Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high-speed HDI PCBs. 
 
A total of 99 figures / charts and 76 tables are provided in this 195-page report to help in your business decisions. Sample figures with insights are shown below. To learn the scope of benefits, companies researched, and other details of the high density interconnect (HDI) PCB market report, please download the report brochure.
 
HDI PCB Market by End Use Industry, Technology, and Build-Up Layer Count
  
In this market, smartphones and tablets is the largest end use industry, whereas 4-6 layer HDI is the largest technology market. Growth in various segments of the HDI PCB market is shown in the figure below.
 
HDI PCB Market by Segments
  
The study includes trends and forecast for the global high density interconnect (HDI) PCB market by end use industry, technology, build-up layer count, and region as follows:
 
By End Use Industry [$M and Thousand Sqm shipment analysis for 2016 – 2027]: 
  • Smartphones and Tablets 
  • Computers 
  • Telecom/Datacom
  • Consumer Electronics
  • Automotive 
  • Others
By Technology [$M and Thousand Sqm shipment analysis for 2016 – 2027]:
  • 4-6 Layer
  • 8-10 Layer 
  • 10+ Layer 
By Build-Up Structure [$M and Thousand Sqm shipment analysis for 2016 – 2027]:   
  • 1+n+1
  • 2+n+2 
  • 3+n+3
  • Others
By Region [$M and Thousand Sqm shipment analysis for 2016 – 2027]:
  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World
Some of the high density interconnect (HDI) PCB companies profiled in this report include Unimicron, AT&S, Samsung Electro-Mechanics, Tripod, Compeq, Unitech, NOK Corporation, Zhen Ding Technology, Flexium Interconnect, Fujikura, Nitto Denko, and Young Poong Electronics. 
 
Lucintel forecasts that 4-6 layers will remain the largest segment due to increasing demand in smartphones and telecommunication equipment. The 10+ layer HDI PCB market is expected to witness the highest growth during the forecast period due to the growing demand for smart wearables and connected devices. 
 
Smartphones will remain the largest end use industry due to the increasing demand for high performance PCB and growing demand for more space in smartphones for larger batteries. Automotive is expected to witness the highest growth over the forecast period due to advancement in automotive electronics.
 
Asia Pacific will remain the largest market, and it is also expected to witness the highest growth over the forecast period due to the increasing electronic content in automotive and growth in consumer electronic devices & telecommunication products.
 
 
Features of the High Density Interconnect (HDI) PCB Market
 
  • Market Size Estimates: High Density Interconnect (HDI) PCB market size estimation in terms of value ($M) and Volume (Thousand Sqm)
  • Trend and Forecast Analysis: Market trends (2016-2021) and forecast (2022-2027) by various segments and regions.
  • Segmentation Analysis: High Density Interconnect (HDI) PCB market size by various segments, such as end use industry, technology, and built-up structure, in terms of value and volume.
  • Regional Analysis: High Density Interconnect (HDI) PCB market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in various end use industries, technologies, built-up structures, and regions for the high density interconnect (HDI) PCB market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the high density interconnects (HDI) PCB market.
  • Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
 
 
This report answers following 11 key questions
 
Q.1 What are some of the most promising potential, high-growth opportunities for the global high density interconnect (HDI) PCB market by end use industry (smartphones and tablets, computers, telecom/datacom, consumer electronics, automotive and others), technology (4-6 layer, 8-10 layer, 10+ layer), build-up layer count (1+n+1, 2+n+2, 3+n+3, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the High Density Interconnect (HDI) PCB market?
Q.5 What are the business risks and threats to the high density interconnect (HDI) PCB market?
Q.6 What are the emerging trends in the high density interconnect (HDI) PCB market and the reasons behind them?
Q.7 What are some changing demands of customers in the high density interconnect (HDI) PCB market?
Q.8 What are the new developments in the high density interconnect (HDI) PCB market? Which companies are leading these developments?
Q.9 Who are the major players in the high density interconnect (HDI) PCB market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in the high density interconnect (HDI) PCB market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M&A activities did take place in the last five years in the high density interconnect (HDI) PCB market?

Report Scope

Key Features Description
Base Year for Estimation 2021
Trend Period
(Actual Estimates)
2016-2021
Forecast Period 2022-2027
Pages 186
Market Representation / Units Revenue in US $ Million and Volume (Square Meter)
Report Coverage Market Trends & Forecast, Competitor Analysis, New Product Development, Company Expansion, Mergers, Acquisitions, & Joint Ventures, and Company Profiling
Market Segments End Use Industry (Smartphones and Tablets, Computers, Telecom/Datacom, Consumer Electronics, Automotive, and Others), Technology (4-6 Layer, 8-10 Layer, and 10+ Layer), Build-Up Strucutre (1+N+1, 2+N+2, 3+N+3, and others),
Regional Scope North America, Europe, Asia Pacific, and ROW
Customization 10% Customization Without any Additional Cost
 

Table of Contents
 
1. Executive Summary
 
2. Market Background and Classifications
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
 
3. Market Trends and Forecast Analysis from 2016 to 2027
3.1: Macroeconomic Trends (2016-2021) and Forecast (2022-2027)
3.2: Global High Density Interconnect (HDI) PCB Market Trends (2016-2021) and Forecast (2022-2027)
3.3: Global High Density Interconnect (HDI) PCB Market by End Use Industry 
3.3.1: Smartphones and Tablets
3.3.2: Computers
3.3.3: Telecom/Datacom
3.3.4: Consumer Electronics
3.3.5: Automotive
3.3.6: Others
3.4: Global High Density Interconnect (HDI) PCB Market by Technology 
3.4.1: 4-6 Layer HDI PCBs
3.4.2: 8-10 Layer HDI PCBs
3.4.3: 10+ Layer HDI PCBs
3.5: Global High Density Interconnect (HDI) PCB Market by Built-Up Structure 
3.5.1: 1+N+1 HDI PCBs
3.5.2: 2+N+2 HDI PCBs
3.5.3: 3+N+3 HDI PCBs
3.5.4: Others
 
4. Market Trends and Forecast Analysis by Region from 2016 to 2027
4.1: Global High Density Interconnect (HDI) PCB Market by Region
4.2: North American High Density Interconnect (HDI) PCB Market
4.2.1: Market by End Use Industry 
4.2.2: Market by Technology 
4.2.3: Market by Built-Up Structure 
4.3: European High Density Interconnect (HDI) PCB Market
4.3.1: Market by End Use Industry 
4.3.2: Market by Technology 
4.3.3: Market by Built-Up Structure 
4.4: APAC High Density Interconnect (HDI) PCB Market
4.4.1: Market by End Use Industry 
4.4.2: Market by Technology 
4.4.3: Market by Built-Up Structure 
4.5: ROW High Density Interconnect (HDI) PCB Market
4.5.1: Market by End Use Industry 
4.5.2: Market by Technology 
4.5.3: Market by Built-Up Structure 
 
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Geographical Reach
5.3: Porter’s Five Forces Analysis
 
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by End Use Industry 
6.1.2: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Technology 
6.1.3: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Built-Up Structure 
6.1.4: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Region 
6.2: Emerging Trends in the Global High Density Interconnect (HDI) PCB Market
6.3: Strategic Analysis
6.3.1: New Product Development in the Global High Density Interconnect (HDI) PCB Market 
6.3.2: Capacity Expansions in the Global High Density Interconnect (HDI) PCB Market 
6.3.3: Mergers and Acquisitions in the Global High Density Interconnect (HDI) PCB Market
6.3.4: Technology Development of the Global High Density Interconnect (HDI) PCB Market
 
7. Company Profiles of Leading Players
7.1: TTM Technologies, Inc.
7.2: Tripod Technology Corporation
7.3: AT&S 
7.4: Kingboard Holdings Ltd.
7.5: CCTC
7.6: DG Shengyi Electronics
7.7: Dynamic Electronics Co. Ltd.
7.8: Gold Circuit Electronics
7.9: Olympic
7.10: DAP
7.11: Unimicron Technology Corp.
7.12: Compeq Manufacturing Co., Ltd.
7.13: Ibiden Co., Ltd.
7.14: Zhen Ding Technology Holding Limited
7.15: Unitech
7.16: Samsung Electro-Mechanics
7.17: Meiko Electronics Co. Ltd
 
.

Buy full report or by chapter as follows

Price by License Type:
[-] Hide Chapter Details
[Chapter Number] [Chapter Name] [Chapter Number Of Pages] [Chapter Price]
Title/Chapter Name Pages Price
Full Report: HDI PCB Market Trends: Trends, Opportunities and Competitive Analysis Full Report $ 4,850
99 figures/charts and 76 tables are provided in this 195 - page report
Lucintel has been in the business of market research and management consulting since 2000 and has published over 600 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted in the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts in the HDI printed circuit board (HDI PCB) market. Some of the HDI printed circuit board manufacturers are TTM Technologies, Inc., Tripod Technology Corporation, AT&S, Kingboard Holdings Ltd., CCTC, DG Shengyi Electronics, Dynamic Electronics Co. Ltd. and others.
 
Below is a brief summary of the primary interviews that were conducted by job function for this report.
 
 
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process.

Please sign in below to get report brochure - HDI PCB Market Trends.

At Lucintel, we respect your privacy and maintain the confidentiality of information / data provided by you
(Please enter your corporate email. * These fields are mandatory )