Table of Contents
1. Executive Summary
2. Market Background and Classifications
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
3. Market Trends and Forecast Analysis from 2016 to 2027
3.1: Macroeconomic Trends (2016-2021) and Forecast (2022-2027)
3.2: Global High Density Interconnect (HDI) PCB Market Trends (2016-2021) and Forecast (2022-2027)
3.3: Global High Density Interconnect (HDI) PCB Market by End Use Industry
3.3.1: Smartphones and Tablets
3.3.2: Computers
3.3.3: Telecom/Datacom
3.3.4: Consumer Electronics
3.3.5: Automotive
3.3.6: Others
3.4: Global High Density Interconnect (HDI) PCB Market by Technology
3.4.1: 4-6 Layer HDI PCBs
3.4.2: 8-10 Layer HDI PCBs
3.4.3: 10+ Layer HDI PCBs
3.5: Global High Density Interconnect (HDI) PCB Market by Built-Up Structure
3.5.1: 1+N+1 HDI PCBs
3.5.2: 2+N+2 HDI PCBs
3.5.3: 3+N+3 HDI PCBs
3.5.4: Others
4. Market Trends and Forecast Analysis by Region from 2016 to 2027
4.1: Global High Density Interconnect (HDI) PCB Market by Region
4.2: North American High Density Interconnect (HDI) PCB Market
4.2.1: Market by End Use Industry
4.2.2: Market by Technology
4.2.3: Market by Built-Up Structure
4.3: European High Density Interconnect (HDI) PCB Market
4.3.1: Market by End Use Industry
4.3.2: Market by Technology
4.3.3: Market by Built-Up Structure
4.4: APAC High Density Interconnect (HDI) PCB Market
4.4.1: Market by End Use Industry
4.4.2: Market by Technology
4.4.3: Market by Built-Up Structure
4.5: ROW High Density Interconnect (HDI) PCB Market
4.5.1: Market by End Use Industry
4.5.2: Market by Technology
4.5.3: Market by Built-Up Structure
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Geographical Reach
5.3: Porter’s Five Forces Analysis
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by End Use Industry
6.1.2: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Technology
6.1.3: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Built-Up Structure
6.1.4: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Region
6.2: Emerging Trends in the Global High Density Interconnect (HDI) PCB Market
6.3: Strategic Analysis
6.3.1: New Product Development in the Global High Density Interconnect (HDI) PCB Market
6.3.2: Capacity Expansions in the Global High Density Interconnect (HDI) PCB Market
6.3.3: Mergers and Acquisitions in the Global High Density Interconnect (HDI) PCB Market
6.3.4: Technology Development of the Global High Density Interconnect (HDI) PCB Market
7. Company Profiles of Leading Players
7.1: TTM Technologies, Inc.
7.2: Tripod Technology Corporation
7.3: AT&S
7.4: Kingboard Holdings Ltd.
7.5: CCTC
7.6: DG Shengyi Electronics
7.7: Dynamic Electronics Co. Ltd.
7.8: Gold Circuit Electronics
7.9: Olympic
7.10: DAP
7.11: Unimicron Technology Corp.
7.12: Compeq Manufacturing Co., Ltd.
7.13: Ibiden Co., Ltd.
7.14: Zhen Ding Technology Holding Limited
7.15: Unitech
7.16: Samsung Electro-Mechanics
7.17: Meiko Electronics Co. Ltd