EUV Pellicle Market Trends and Forecast
The future of the global EUV pellicle market looks promising with opportunities in the semiconductor foundry, memory device, and consumer electronic markets. The global EUV pellicle market is expected to grow with a CAGR of 14.4% from 2025 to 2031. The major drivers for this market are the increasing demand for semiconductor devices, the rising adoption of EUV lithography, and the growing focus on advanced manufacturing.
• Lucintel forecasts that, within the material category, carbon-based is expected to witness higher growth over the forecast period.
• Within the application category, semiconductor foundry, memory device, and consumer electronic is expected to witness the highest growth.
• In terms of region, APAC is expected to witness the highest growth over the forecast period.
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Emerging Trends in the EUV Pellicle Market
The EUV pellicle market is marked by fast-paced innovation to address the stringent needs of next-generation semiconductor production. A number of emerging trends are defining its development.
• Development of High Transmission Materials: Of supreme importance is the constant seeking for materials possessing drastically higher transmission performance at EUV wavelengths (close to 13.5 nm). Traditional pellicles manufactured from polysilicon or amorphous silicon are inherent to transmission restraints. Materials researchers are turned on to fresh avenues such as single layer graphene, carbon nanotubes, and ultra-thin metal films seeking to cut the absorption of and scattering from incident photons for further enhancing the lithographic processing efficacy and capacity.
• Increasing Pellicle Toughness and Lifespan: EUV lithography equipment employs high power light sources, which place extreme thermal and radiation stress on the pellicles. One of the trends is to create tougher pellicles that can withstand these harsh conditions for longer durations without compromising transmission or mechanical strength. This includes innovations in material composition, stress engineering, and protective coatings to increase pellicle lifespan and lower replacement frequency.
• Reduction of Pellicle Defects and Particle Formation: Any particle or defect on the pellicle can be transferred to the wafer, resulting in fatal errors in the process of semiconductor device manufacturing. One of the top trends is the use of sophisticated manufacturing processes and stringent quality control practices to reduce the initial defect density of EUV pellicles and avoid particle formation during usage. These include enhanced film deposition, handling, and packaging processes.
• Scaling Up Production Capacity and Lowering Costs: As EUV lithography enters mainstream high volume production, there is a growing necessity to scale up the production capacity of high quality EUV pellicles while reducing their cost at the same time. This trend requires the establishment of effective and scalable manufacturing processes, optimized supply chains, and greater competition among pellicle suppliers to provide the increased demand at an economically acceptable price for semiconductor manufacturers.
• Larger Pellicle Size Development: The industry trend towards bigger wafer sizes in semiconductor manufacturing requires the development of EUV pellicles with similarly bigger sizes. Producing large area, defect-free, and evenly thin membranes with high transmission and endurance is a major technical challenge. Current research and development efforts target overcoming these challenges to facilitate the implementation of larger pellicles in cutting-edge EUV lithography equipment.
These trends are collectively redefining the EUV pellicle market by driving material science, manufacturing accuracy, and operational dependability to new heights. The developments in high transmission materials, high durability, defect reduction, scalable production, and bigger sizes are vital for the future success and economic attractiveness of EUV lithography as the foundation for subsequent semiconductor manufacturing.
Recent Development in the EUV Pellicle Market
New progress in the EUV pellicle market is essential for the development and mass implementation of EUV lithography in semiconductor production.
• Improved Transmission Pellicles Commercialization: One of the major breakthroughs is progress towards EUV pellicles with better transmission than previous generations on the path towards commercialization. Though individual transmission rates differ, materials and thin film deposition technology advancements are resulting in pellicles that transmit greater amounts of EUV light, enhancing wafer throughputs and lowering the energy requirements for lithography tools.
• Greater Emphasis on Pellicle Metrology and Inspection: Since pellicle quality has a direct impact on wafer yield, there is greater emphasis on creating advanced metrology and inspection equipment for EUV pellicles. These consist of advanced methods for detecting and characterizing nanoscale defects, thickness uniformity measurements of films, and determination of transmission characteristics with high precision to ensure that only high-quality pellicles are utilized in production.
• Dual-Sided Pellicle Development: One new development is the investigation of dual sided pellicles, which would serve to shield both the mask and the optics from contamination. This idea has major technical challenges in terms of manufacturing and handling but might provide improved contamination control and possibly extend the life of critical EUV lithography components.
• Standardization Initiatives In the Supply Chain: With the maturation of the EUV ecosystem, there is a growing movement towards standardization of pellicle size, mounting interfaces, and performance characteristics. This standardization works towards enhanced interoperability, cost savings, and simplification of the supply chain for EUV pellicles, enabling them to be more widely adopted by semiconductor manufacturers.
• New Entrants in the Supply Chain: Although a handful of major players have controlled the initial EUV pellicle market, growing demand and prospects for innovation are encouraging new companies to enter the supply chain. These new entrants tend to concentrate on certain areas of pellicle technology, e.g., new materials or different manufacturing methods, which could bring more competition and a greater innovation rate.
These advances are making a substantial contribution to the EUV pellicle market by overcoming key limitations associated with transmission, quality control, contamination management, and supply chain efficiency. These advances are necessary to make EUV lithography a more resilient and cost-effective technology for high volume production of advanced semiconductor devices.
Strategic Growth Opportunities in the EUV Pellicle Market
The growth of the EUV pellicle market is inherently linked to the development and growth of EUV lithography in semiconductor production. The main growth opportunities stem from the growing use of EUV for the production of advanced logic and memory devices.
• High Volume Manufacturing of Leading Edge Logic Devices: The dominant growth driver for the EUV pellicle market is the increasing application of EUV lithography for the production of leading edge logic semiconductors (such as next-generation CPUs, GPUs, and SoCs). With decreasing feature sizes, EUV becomes a requirement, calling for a guaranteed source of high performance pellicles to shield the costly and critical photomasks utilized in such processes.
• Fabrication of High-end DRAM and NAND Flash Memory: EUV lithography is also being widely embraced for fabrication of high-end Dynamic Random Access Memory (DRAM) and NAND flash memory chips. The challenging patterning demands for high-density memory devices find much benefit from the high-resolution capability of EUV, pushing the need for EUV pellicles into memory fabs.
• Increasing EUV Lithography to Additional Layers: Early on, EUV lithography was applied to a few select critical layers of semiconductor device manufacturing. As the technology continues to develop and pellicle performance gets better, the trend is toward applying EUV to more layers. The increased use of EUV per wafer immediately correlates to increased demand for EUV pellicles.
• Retrofitting existing EUV Lithography Tools: Already invested customers from semiconductor firms for EUV lithography equipment form a promising market for upgrade and replacement pellicles. As pellicle technology continuously evolves with more transmission and better lifetimes, there will also be a permanent possibility to retro-fit existing machines with these superior pellicles in order to improve productivity at lower operating cost.
• Future Applications in Advanced Packaging: Although presently targeting front end wafer processing, future developments in EUV lithography and pellicle technology may open up future applications in advanced packaging processes, which increasingly play a vital role in combining complex semiconductor devices. This might generate new opportunities for EUV pellicles in the long term.
These strategic opportunities for growth, which are largely based on the growing use of EUV lithography in the production of next-generation logic and memory devices and its extension to additional layers, highlight the importance of EUV pellicles in making semiconductor technologyÄX%$%Xs future possible. The necessity for these protective films will keep growing with the advancement and implementation of EUV lithography.
EUV Pellicle Market Driver and Challenges
The EUV pellicle industry is a vital facilitator to the development of semiconductor production, fueled by the inherent need to shield costly photomasks against contamination at EUV wavelengths. Technological advancement in EUV lithography automatically fuels the demand for high performance pellicles. Economic factors, including the price of pellicles and their effect on wafer yield, have significant impacts on adoption rates. Though direct regulatory drivers are not so dominant, the overall trend toward smaller, higher-powered, and energy-saving electronic devices indirectly stimulates the demand for sophisticated lithography and its consumables such as EUV pellicles. Managing the intricate interplay among these drivers and challenges is pivotal to the expansion and viability of the EUV pellicle market.
The factors responsible for driving the EUV pellicle market include:
1. EUV Lithography Technology Advancements: Ongoing advancements and growing usage of EUV lithography for the production of advanced semiconductor nodes are the key drivers of the EUV pellicle market. With chipmakers driving feature size reduction, EUV becomes unavoidable, generating direct and increasing demand for pellicles to provide defect-free wafer patterning.
2. Importance of High Wafer Yield for Semiconductor Production: High wafer yields are more important in economically demanding semiconductor fabrication. EUV pellicles are important as they help mask photomask protection from contamination by particles that result in destructive defects on the wafer to yield loss. The need for yield maximization directly translates into the demand for efficient pellicle solutions.
3. Increasing Complexity of Semiconductor Devices: The escalating complexity of modern semiconductor devices demands more complex and costly photomasks. Defending these valuable masks from damage and contamination with EUV pellicles is economically beneficial because the cost to repair or replace the mask is many times greater than the cost of the pellicle.
4. Higher Performance Computing and Electronics Demand: Ongoing worldwide demand for higher performance computing, next-generation mobile devices, and AI applications requires the manufacture of semiconductors with decreasingly small feature sizes, which is dependent on EUV lithography and, by extension, on EUV pellicles.
5. Growing Number of EUV Lithography Tool Shipments: The mounting shipments and installations of EUV lithography tools in semiconductor fabrication facilities across the globe go hand in hand with the increasing demand for EUV pellicles as an essential consumable for these next-generation fabrication systems.
Challenges in the EUV pellicle market are:
1. Pellicle Technical Complexity: Fabricating EUV pellicles to the extreme demands of high transmission, high EUV radiation endurance, low defectivity, and thermal stability poses a very substantial technological challenge. These barriers can be overcome through breakthroughs in material science and precision process manufacturing.
2. High Cost of EUV Pellicles: EUV pellicles are currently very costly, affecting the overall production cost of wafer manufacturing by EUV lithography. The cost of making pellicles with high performance at a reduced cost is critical to wider and more cost-effective adoption of EUV technology.
3. Limited Number of Suppliers: The EUV pellicle market at present has a limited number of major suppliers, which can lead to supply chain weaknesses and potentially slow the rate of innovation and cost reduction as a result of a lack of fierce competition.
The key drivers such as the advances in EUV lithography, the importance of high wafer yield, complexity in semiconductor devices, demand for high-performance electronics, and rise in EUV tool deployments are generating powerful growth momentum in the EUV pellicle market. Yet, while the technical nuances of pellicle development and their expense account for some concern, the only real challenge today is the sparse number of companies that supply the equipment, given the high demand for EUV lithography coupled with the requirement for sustained long-term growth combined with widespread applicability.
List of EUV Pellicle Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies EUV pellicle companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the EUV pellicle companies profiled in this report include-
• ASML Holding
• Mitsui Chemicals
• Shin-Etsu Chemical
• FUJIFILM Holdings Corporation
• Toppan
• SÜSS MicroTec
• Entegris
• AGC
• Sumitomo Chemical
• SKC
EUV Pellicle Market by Segment
The study includes a forecast for the global EUV pellicle market by material, application, and region.
EUV Pellicle Market by Material [Value from 2019 to 2031]:
• Silicon-based
• Carbon-based
EUV Pellicle Market by Application [Value from 2019 to 2031]:
• Semiconductor Foundries
• Memory Devices
• Consumer Electronics
• Others
EUV Pellicle Market by Region [Value from 2019 to 2031]:
• North America
• Europe
• Asia Pacific
• The Rest of the World
Country Wise Outlook for the EUV Pellicle Market
Recent trends in the EUV pellicle market are directly related to the progress in extreme ultraviolet (EUV) lithography, a key technology for the production of next generation semiconductor devices with increasingly diminishing feature sizes. The pellicle, a thin membrane strung over the photomask, shields the mask from particle contamination, which is absolutely essential at EUV wavelengths. As EUV lithography evolves and its use increases in high volume production, the need for high performance EUV pellicles with high transmission, mechanical durability, and thermal stability is growing. This has created intense R&D activity worldwide, with an emphasis on material science, manufacturing technology, and integration approaches.
• United States: The United States is a key market for the EUV pellicle market, driven by dominant semiconductor leadersÄX%$%X demand and research institutionsÄX%$%X contributions to material science development. Recent activity involves cooperation between industry and research labs to increase pellicle transmission and minimize defects. Robust pellicles that can handle the high power EUV light sources utilized in leading-edge lithography tools are also being developed.
• China: ChinaÄX%$%Xs stake in the EUV pellicle market is expanding as it expands its plans in semiconductor fabrication. Current activity includes mounting investment in indigenous R&D of EUV-related technologies, including pellicles. Although it has technological challenges, Chinese companies are aggressively developing material and manufacturing process advancements to build a place in the supply chain for vital lithography parts.
• Germany: Germany is contributing to the EUV pellicle market with its significant presence in semiconductor manufacturing equipment and materials. Recent activity includes German companies contributing to the supply chain for EUV lithography tools, which indirectly fuels innovation and demand for high-quality pellicles. Research institutions are also contributing to materials science aspects pertinent to EUV pellicle development.
• India: Indian participation in the EUV pellicle market is presently restricted, given the fact that the countryÄX%$%Xs semiconductor manufacturing facilities are still in the early stages of development. That said, growing government interest in establishing a local semiconductor ecosystem in the future may witness India emerge as a viable consumer and perhaps even a participant in the supply chain for EUV lithography equipment, including pellicles.
• Japan: Japan plays a prominent role in the EUV pellicle market, with major material suppliers and equipment makers playing active roles in the design and manufacture of these essential components. Recent advances include the development of ultra-thin membrane materials, improved manufacturing accuracy to reduce defects, and attempts to improve pellicle lifetime and thermal stability to address the high demands of high volume EUV lithography.
Features of the Global EUV Pellicle Market
Market Size Estimates: EUV pellicle market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2019 to 2024) and forecast (2025 to 2031) by various segments and regions.
Segmentation Analysis: EUV pellicle market size by material, application, and region in terms of value ($B).
Regional Analysis: EUV pellicle market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different materials, applications, and regions for the EUV pellicle market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the EUV pellicle market.
Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
FAQ
Q1. What is the growth forecast for EUV pellicle market?
Answer: The global EUV pellicle market is expected to grow with a CAGR of 14.4% from 2025 to 2031.
Q2. What are the major drivers influencing the growth of the EUV pellicle market?
Answer: The major drivers for this market are the increasing demand for semiconductor devices, the rising adoption of EUV lithography, and the growing focus on advanced manufacturing.
Q3. What are the major segments for EUV pellicle market?
Answer: The future of the EUV pellicle market looks promising with opportunities in the semiconductor foundry, memory device, and consumer electronic markets.
Q4. Who are the key EUV pellicle market companies?
Answer: Some of the key EUV pellicle companies are as follows:
• ASML Holding
• Mitsui Chemicals
• Shin-Etsu Chemical
• FUJIFILM Holdings Corporation
• Toppan
• SÜSS MicroTec
• Entegris
• AGC
• Sumitomo Chemical
• SKC
Q5. Which EUV pellicle market segment will be the largest in future?
Answer: Lucintel forecasts that, within the material category, carbon-based is expected to witness higher growth over the forecast period.
Q6. In EUV pellicle market, which region is expected to be the largest in next 5 years?
Answer: In terms of region, APAC is expected to witness the highest growth over the forecast period.
Q7. Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.
This report answers following 11 key questions:
Q.1. What are some of the most promising, high-growth opportunities for the EUV pellicle market by material (silicon-based and carbon-based), application (semiconductor foundries, memory devices, consumer electronics, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?
For any questions related to EUV Pellicle Market, EUV Pellicle Market Size, EUV Pellicle Market Growth, EUV Pellicle Market Analysis, EUV Pellicle Market Report, EUV Pellicle Market Share, EUV Pellicle Market Trends, EUV Pellicle Market Forecast, EUV Pellicle Companies, write Lucintel analyst at email: helpdesk@lucintel.com. We will be glad to get back to you soon.