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The futures of the global die attach materials market looks promising with opportunities in the semiconductor industry. The global die attach materials market is expected to decline in 2020 due to global economic recession led by COVID-19. However, the market will witness recovery in the year 2021 and it is expected to grow with a CAGR of 3% to 4% from 2020 to 2025. The major growth drivers for this market are the growing demand of adhesive in a wide range of applications ranging from industrial to commercial, and the rising demand for die attach films in packaging.

A total of XX figures / charts and XX tables are provided in more than 150 pages report is developed to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of global die attach materials Market report download the report brochure.

 
 
Die Attach Materials Market by Product Type, Material Type and Form

 
Growth in various segments of the die attach materials market are given below

 
Die Attach Materials Market by Segments

 
The study includes trends and forecast for the global die attach materials market by product type, material type, form, and region as follows

By Product Type [$M shipment analysis for 2014 – 2025]:
  • Adhesives
  • Films
  • Sintering
  • Solder
  • Other

By Material Type [$M shipment analysis for 2014 – 2025]:
  • Polymer Adhesives 
  • Eutectic Die Attach Materials
  • Other

By Form [$M shipment analysis for 2014 – 2025]:
  • Powder 
  • Pastes 
  • Wires 

By Region [$M shipment analysis for 2014 – 2025]:
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
  • Rest of the World

Some of the die attach materials manufacturers profiled in this report include, Dow, Hybond Inc., Henkel, Alpha Assembly Solutions, and Creative Materials. 
Lucintel forecasts that films is expected to witness the highest growth over the forecast period.

Within this market, polymer die attach materials is expected to witness the highest growth over the forecast period due to its excellent adhesion properties, they form the the prime focus area of manufacturers.

Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to an increasing demand for semiconductor industry.


 
Features of the Global Die Attach Materials Market
  • Market size estimates: Global die attach materials market size estimation in terms of value ($M) shipment.
  • Trend and forecast analysis: Market trend (2014-2019) and forecast (2020-2025) by various segments and regions.
  • Segmentation analysis: Market size by various segments such as by product type, form, material type, and region
  • Regional analysis: Global die attach materials Market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth opportunities: Analysis on growth opportunities in different product type, form, material type and regions for global die attach materials market.
  • Strategic analysis: This includes M&A, new product development, and competitive landscape of the global die attach materials market.
  • Analysis of competitive intensity of the industry based on Porter’s Five Forces model.



 
This report answers following 11 key questions
 
Q.1 What are some of the most promising potential, high-growth opportunities for the global die attach materials market by  product type (adhesives, films, sintering, solder, and others), material (polymer adhesives, eutectic die attach materials, and others), form (powder, pastes, and wires), and region (North America, Europe, Asia Pacific (APAC), and Rest of the World (ROW)?                                                                                              
Q. 2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to the global die attach materials market?
Q.6 What are emerging trends in global die attach materials market and the reasons behind them?
Q.7 What are some changing demands of customers in the global die attach materials market?
Q.8 What are the new developments in the die attach materials market? Which companies are leading these developments?
Q.9 Who are the major players in this global die attach materials market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this global die attach materials market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M & A activities did take place in the last five years in this, global die attach materials market?


Report Scope


Key Features Description
Base Year for Estimation 2019
Trend Period
(Actual Estimates)
2014-2019
Forecast Period 2020-2025
Pages 150
Market Representation / Units Revenue in US $ Million
Report Coverage Market Trends & Forecasts, Competitor Analysis, New Product Development, Company Expansion, Merger Acquisitions & Joint Venture, and Company Profiling
Market Segments By  Product Type (Adhesives, Films, Sintering, Solder, and Others), Material Type (Polymer Adhesives, Eutectic Die Attach Materials, and Others), Form (Powder, Pastes, and Wires)
Regional Scope North America, Europe, Asia Pacific, and RoW
Customization 10% Customization Without any Additional Cost
 

Table of Contents
 
1. Executive Summary

2. Market Background and Classification
2.1: Introduction, Background, and Classification
2.2: Supply Chain
2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2014 to 2025
3.1: Macroeconomic Trends and Forecast
3.2: Global Die Attach Materials Market Trends and Forecast
3.3: Global Die Attach Materials Market by Product Type
3.3.1: Adhesives
3.3.2: Films
3.3.3: Sintering
3.3.4: Solder
3.3.5: Others
3.4: Global Die Attach Materials Market by Material Type
3.4.1: Polymer Adhesives 
3.4.2: Eutectic Die Attach Materials
3.4.3: Other
3.5: Global Die Attach Materials Market By Form
3.5.1: Powder 
3.5.2: Pastes 
3.5.3: Wires

4. Market Trends and Forecast Analysis by Region
4.1: Global Die Attach Materials Market by Region
4.2: North American Die Attach Materials Market 
4.2.1: Market by Product Type: Adhesives, Films, Sintering, Solder, and Other Market 
4.2.2: Market by Material Type: Polymer Adhesives, Eutectic Die Attach Materials, and Other
4.2.3: Market by Form: Powder, Pastes, and Wires
4.2.4: United States Die Attach Materials Market
4.2.5: Canadian Die Attach Materials Market
4.2.6: Mexican Die Attach Materials Market
4.3: European Die Attach Materials Market
4.3.1: Market by Product Type: Adhesives, Films, Sintering, Solder, and Other Market 
4.3.2: Market by Material Type: Polymer Adhesives, Eutectic Die Attach Materials, and Other
4.3.3: Market by Form: Powder, Pastes, and Wires
4.3.4: Germany Die Attach Materials Market
4.3.5: UK Die Attach Materials Market
4.3.6: Italy Die Attach Materials Market
4.4: APAC Die Attach Materials Market
4.4.1: Market by Product Type: Adhesives, Films, Sintering, Solder, and Other Market 
4.4.2: Market by Material Type: Polymer Adhesives, Eutectic Die Attach Materials, and Other
4.4.3: Market by Form: Powder, Pastes, and Wires
4.4.4: China Die Attach Materials Market
4.4.5: Japan Die Attach Materials Market
4.4.6: South Korea Die Attach Materials Market
4.4.7: India Die Attach Materials Market
4.5: ROW Die Attach Materials Market
4.5.1: Market by Product Type: Adhesives, Films, Sintering, Solder, and Other Market 
4.5.2: Market by Material Type: Polymer Adhesives, Eutectic Die Attach Materials, and Other
4.5.3: Market by Form: Powder, Pastes, and Wires

5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Market Share Analysis
5.3: Operational Integration
5.4: Geographical Reach
5.5: Porter’s Five Forces Analysis

6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for Global Die Attach Materials by Product Type
6.1.2: Growth Opportunities for Global Die Attach Materials Market by Material Type
6.1.3: Growth Opportunities for Global Die Attach Materials Market by Foam
6.1.4: Growth Opportunities for Global Die Attach Materials Market by Region
6.2: Emerging Trends in Die Attach Materials Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of Global Die Attach Materials Market
6.3.3: Mergers, Acquisitions and Joint Ventures in the Global Die Attach Materials Market
6.3.4: Certification and Licensing

7. Company Profiles of Leading Players
7.1: DOW 
7.2: Hybond
7.3: Henkel
7.4: Alpha Assembly Solutions
7.5: Creative Materials Inc.
 
.

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