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The future of the advanced IC packaging market looks promising with opportunities in the consumer & communication, automotive, industrial, healthcare, and aerospace & defense industries. The global advanced IC packaging market is expected to reach an estimated $50 billion by 2026 with a CAGR of 8% from 2020 to 2026. The major drivers for this market are growing semiconductor industry, increasing miniaturization of electronic devices, demand for higher speed and smaller pitch size, and increasing penetration of 2.5D/3D packaging technology.
 
Emerging trends, which have a direct impact on the dynamics of the advanced IC packaging industry, include development of packaging solutions for AI and IoT and introduction of new IC packaging technologies, such as fan out and 2.5D/3D.  
 
A total of 74 figures / charts and 41 tables are provided in this 138-page report to help in your business decisions. Sample figures with insights are shown below. To learn the scope of benefits, companies researched, and other details of the advanced IC packaging market report, please download the report brochure.
 
Advanced IC Packaging market trends and forecast

 
Advanced IC Packaging market drivers, challenges, regional insights, and market leaders
 
The study includes trends and forecasts for the global advanced IC packaging market by packaging type, end use industry, and region as follows:
 
By Packaging Type [$M shipment analysis for 2015 – 2026]:
  • Flip-Chip
  • Fan-in Wafer Level (WLP) Packaging
  • Embedded-Die
  • Fan-Out
  • 2.5D/3D
By End Use Industry [$M shipment analysis for 2015 – 2026]:
  • Consumer and Communication
  • Automotive
  • Industrial
  • Healthcare
  • Aerospace and Defense
  • Others
By Region [$M shipment analysis for 2015 – 2026]:
  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World
Some of the advanced IC packaging companies profiled in this report include Amkor, Taiwan Semiconductor, Advanced Semiconductor Engineering Technology, Intel, and Samsung.
 
Lucintel forecasts that flip-chip will remain the largest segment due to rise in demand for high speed portable devices and increasing need for high packaging density. 
 
Consumer and communication will remain the largest end-use industry during the forecast period. Increasing demand for smartphones, connected and high performance consumer devices with AI technology, and demand for high performance computing are driving the demand for advanced IC packaging in the consumer and communication market.
 
Asia Pacific will remain the largest region over the forecast period due to the presence of large foundries and manufacturing hub for electronic devices. Economic growth, growing urbanization, growing disposable income, and increasing adoption of digital technologies, such as  5G, Internet of things (IoT), and artificial intelligence (AI) are driving the demand for advanced IC packaging market in this region.
 
 
Features of the advanced IC packaging Market

 
  • Market Size Estimates: Advanced IC Packaging market size estimation in terms of value ($M).
  • Trend and Forecast Analysis: Market trends (2015-2020) and forecast (2021-2026) by various segments and regions.
  • Segmentation Analysis: Advanced IC Packaging market size by various segments, such as packaging type and end use industry in terms of value.
  • Regional Analysis: Advanced IC Packaging market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different packaging type, end use industry, and regions for the advanced IC packaging market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the advanced IC packaging market.
  • Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
 
 
This report answers following 11 key questions
 
Q.1 What are some of the most promising potential, high-growth opportunities for the global advanced IC packaging market by packaging type (flip-chip, fan-in wafer level packaging, embedded-die, fan-out, and 2.5D/3D) end use industry (consumer and communication, automotive, industrial, healthcare, aerospace and defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the advanced IC packaging market?
Q.5 What are the business risks and threats to the advanced IC packaging market?
Q.6 What are emerging trends in the advanced IC packaging market and the reasons behind them?
Q.7 What are some changing demands of customers in the advanced IC packaging market?
Q.8 What are the new developments in the advanced IC packaging market? Which companies are leading these developments?
Q.9 Who are the major players in the advanced IC packaging market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in the advanced IC packaging market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M&A activities did take place in the last five years in the advanced IC packaging market?


Report Scope

Key Features Description
Base Year for Estimation 2020
Trend Period
(Actual Estimates)
2015-2020
Forecast Period 2021-2026
Pages 138
Market Representation / Units Revenue in US $ Million
Report Coverage Market Trends & Forecasts, Competitor Analysis, New Product Development, Company Expansion, Merger Acquisitions & Joint Venture, and Company Profiling
Market Segments By Packaging Type (Flip-Chip, Fan-In Wafer Level Packaging, Embedded-Die, Fan-Out, and 2.5D/3D) and End Use Industry (Consumer and Communication, Automotive, Industrial, Healthcare, Aerospace and Defense, and Others)
Regional Scope North America, Europe, Asia Pacific, and ROW
Customization 10% Customization Without any Additional Cost
 

Table of Contents
 
 
1. Executive Summary
 
2. Market Background and Classifications
2.1: Introduction, Background and Classification
2.2: Supply Chain
2.3: Industry Drivers and Challenges
 
3. Market Trends and Forecasts Analysis from 2015-2026
3.1: Macroeconomic Trends and Forecasts
3.2: Global Advanced IC Packaging Market Trends and Forecast
3.3: Global Advanced IC Packaging Market by Packaging Type
3.3.1: Flip-Chip
3.3.2: Fan-in Wafer Level (WLP) Packaging
3.3.3: Embedded-Die
3.3.4: Fan-Out
3.3.5: 2.5 Dimensional/3 Dimensional (2.5D/3D)
3.4: Global Advanced IC Packaging Market by End Use Industry
3.4.1: Consumer and Communication
3.4.2: Automotive
3.4.3: Industrial
3.4.4: Healthcare
3.4.5: Aerospace and Defense
3.4.6: Others
 
4. Market Trends and Forecast Analysis from 2015 to 2026
4.1: Global Advanced IC Packaging Market by Region
4.2: North American Advanced IC Packaging Market Trends and Forecast  
4.3: European Advanced IC Packaging Market Trends and Forecast  
4.4: APAC Advanced IC Packaging Market Trends and Forecast  
4.5: ROW Advanced IC Packaging Market Trends and Forecast  
 
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operation Integration
5.3: Geographical Reach
5.4: Porter’s Five Forces Analysis
 
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global Advanced IC Packaging Market by Packaging Type
6.1.2: Growth Opportunities for the Global Advanced IC Packaging Market by End Use Industry
6.1.3: Growth Opportunities for the Global Advanced IC Packaging Market by Region
6.2: Emerging Trends in the Global Advanced IC Packaging Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global Advanced IC Packaging Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Advanced IC Packaging Market
 
7. Company Profiles of Leading Players
7.1: Amkor Technology
7.2: Taiwan Semiconductor
7.3: Advanced Semiconductor Engineering Technology
7.4: Intel Corporation
7.5: Samsung Electronics
7.6: JCET Group
7.7: Texas Instruments
7.8: Toshiba Corporation
7.9: Renesas
 
 
List of Figures
 
Chapter 2. Market Background and Classifications
Figure 2.1: Advanced IC Packaging
Figure 2.2: Evolution of IC Packaging
Figure 2.3: 2.5D Packaging
Figure 2.4: 3D IC Packaging
Figure 2.5: Chip First Fan-Out
Figure 2.6: Chip Last Fan-Out
Figure 2.7: Flip Chip Packaging
Figure 2.8: Embedded Die Packaging
Figure 2.9: Fan-In Wafer Level Packaging
Figure 2.10: System-In-Package
Figure 2.11: Consumer Electronics
Figure 2.12: Automotive
Figure 2.13: Industrial
Figure 2.14: Healthcare
Figure 2.15: Aerospace and Defense
Figure 2.16: Classification of the Advanced IC Packaging Market by Packaging Type and End Use Industry
Figure 2.17: Increasing Capability and Complexity in Advanced IC Packaging
Figure 2.18: Technology Roadmap from Nano Scale to Micro Scale
Figure 2.19: Advanced IC Packaging Node From Nano Scale to Micro Scale
Figure 2.20: Supply Chain of the Global Advanced IC Packaging Market
Figure 2.21: Major Drivers and Challenges for the Global Advanced IC Packaging Market
 
Chapter 3. Market Trends and Forecasts Analysis from 2015-2026
Figure 3.1: Trends of the Global GDP Growth Rate
Figure 3.2: Trends of the Global Population Growth Rate
Figure 3.3: Trends of the Global Inflation Rate
Figure 3.4: Trends of the Global Unemployment Rate
Figure 3.5: Trends of the Regional GDP Growth Rate
Figure 3.6: Trends of the Regional Population Growth Rate
Figure 3.7: Trends of the Regional Inflation Rate
Figure 3.8: Trends of the Regional Unemployment Rate
Figure 3.9: Regional Per Capita Income Trends
Figure 3.10: Forecast for the Global GDP Growth Rate
Figure 3.11: Forecast for the Global Population Growth Rate
Figure 3.12: Forecast for the Global Inflation Rate
Figure 3.13: Forecast for the Global Unemployment Rate
Figure 3.14: Forecast for the Regional GDP Growth Rate
Figure 3.15: Forecast for the Regional Population Growth Rate
Figure 3.16: Forecast for the Regional Inflation Rate
Figure 3.17: Forecast for the Regional Unemployment Rate
Figure 3.18: Forecast for the Regional Per Capita Income
Figure 3.19: Addressable Market for Advanced IC Packaging Market in 2020
Figure 3.20: Trends and Forecast for the Global Advanced IC Packaging Market (2015-2026)
Figure 3.21: Trends of the Global Advanced IC Packaging Market ($M) by Packaging Type (2015-2020)
Figure 3.22: Forecast for the Global Advanced IC Packaging Market ($M) by Packaging Type (2021-2026)
Figure 3.23: Trends and Forecast for Flip-Chip in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.24: Trends and Forecast for Fan-in Wafer Level Packaging in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.25: Trends and Forecast for Embedded-Die in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.26: Trends and Forecast for Fan-Out in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.27: Trends and Forecast for 2.5 Dimensional/3 Dimensional in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.28: Trends of the Global Advanced IC Packaging Market ($M) by End Use Industry (2015-2020)
Figure 3.29: Forecast for the Global Advanced IC Packaging Market ($M) by End Use Industry (2021-2026)
Figure 3.30: Trends and Forecast for Consumer and Communication in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.31: Trends and Forecast for Automotive in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.32: Trends and Forecast for Industrial in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.33: Trends and Forecast for Healthcare in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.34: Trends and Forecast for Aerospace and Defense in the Global Advanced IC Packaging Market (2015-2026)
Figure 3.35: Trends and Forecast for Others in the Global Advanced IC Packaging Market (2015-2026)
 
Chapter 4. Market Trends and Forecast Analysis from 2015 to 2026
Figure 4.1: Trends of the Global Advanced IC Packaging Market ($M) by Region (2015-2020)
Figure 4.2: Forecast for the Global Advanced IC Packaging Market ($M) by Region (2021-2026)
Figure 4.3: Trends and Forecast for the North American Advanced IC Packaging Market (2015-2026)
Figure 4.4: Trends and Forecast for the European Advanced IC Packaging Market (2015-2026)
Figure 4.5: Trends and Forecast for the APAC Advanced IC Packaging Market (2015-2026)
Figure 4.6: Trends and Forecast for the ROW Advanced IC Packaging Market (2015-2026)
 
Chapter 5. Competitor Analysis
Table 5.1: Product Mapping of Global Advanced IC Packaging Suppliers Based on Markets Served
Figure 5.2: Foundries Capable of Developing Different Node Capacities
Figure 5.3: Headquarter Locations of Major Global Advanced IC Packaging Suppliers
Figure 5.4: Porter’s Five Forces Industry Analysis of the Global Advanced IC Packaging Industry
 
Chapter 6. Growth Opportunities and Strategic Analysis
Figure 6.1: Growth Opportunities for the Global Advanced IC Packaging Market by Packaging Type (2021-2026)
Figure 6.2: Growth Opportunities for the Global Advanced IC Packaging Market by End Use Industry (2021-2026)
Figure 6.3: Growth Opportunities for the Global Advanced IC Packaging Market by Region (2021-2026)
Figure 6.4: Technology Heat Map by Factors
Figure 6.5: Technology Heat Map by End Use Industry
Figure 6.6: Strategic Implication for Advanced IC Packaging Market
Figure 6.7: Emerging Trends in the Advanced IC Packaging Market
Figure 6.8: Capacity Building by Major Players during the Trend Period (Source: Lucintel)
 
 
List of Tables
 
Chapter 1. Executive Summary
Table 1.1: Global Advanced IC Packaging Market Parameters and Attributes
 
Chapter 3. Market Trends and Forecasts Analysis from 2015-2026
Table 3.1: Trends of the Global Advanced IC Packaging Market (2015-2020)
Table 3.2: Forecast for the Global Advanced IC Packaging Market (2021-2026)
Table 3.3: Market Size and CAGR of Packaging Types of the Global Advanced IC Packaging Market by Value (2015-2020)
Table 3.4: Market Size and CAGR of Packaging Types of the Global Advanced IC Packaging Market by Value (2021-2026)
Table 3.5: Trends of Flip-Chip in the Global Advanced IC Packaging Market (2015-2020)
Table 3.6: Forecast for Flip-Chip in the Global Advanced IC Packaging Market (2021-2026)
Table 3.7: Trends of Fan-in Wafer Level Packaging in the Global Advanced IC Packaging Market (2015-2020)
Table 3.8: Forecast for Fan-in Wafer Level Packaging in the Global Advanced IC Packaging Market (2021-2026)
Table 3.9: Trends of Embedded-Die in the Global Advanced IC Packaging Market (2015-2020)
Table 3.10: Forecast for Embedded-Die in the Global Advanced IC Packaging Market (2021-2026)
Table 3.11: Trends of Fan-Out in the Global Advanced IC Packaging Market (2015-2020)
Table 3.12: Forecast for Fan-Out in the Global Advanced IC Packaging Market (2021-2026)
Table 3.13: Trends of 2.5 Dimensional/3 Dimensional in the Global Advanced IC Packaging Market (2015-2020)
Table 3.14: Forecast for 2.5 Dimensional/3 Dimensional in the Global Advanced IC Packaging Market (2021-2026)
Table 3.15: Market Size and CAGR of Various End Use Industries of the Global Advanced IC Packaging Market by Value (2015-2020)
Table 3.16: Market Size and CAGR of Various End Use Industries of the Global Advanced IC Packaging Market by Value (2021-2026)
Table 3.17: Trends of Consumer and Communication in the Global Advanced IC Packaging Market (2015-2020)
Table 3.18: Forecast for Consumer and Communication in the Global Advanced IC Packaging Market (2021-2026)
Table 3.19: Trends of Automotive in the Global Advanced IC Packaging Market (2015-2020)
Table 3.20: Forecast for Automotive in the Global Advanced IC Packaging Market (2021-2026)
Table 3.21: Trends of Industrial in the Global Advanced IC Packaging Market (2015-2020)
Table 3.22: Forecast for Industrial in the Global Advanced IC Packaging Market (2021-2026)
Table 3.23: Trends of Healthcare in the Global Advanced IC Packaging Market (2015-2020)
Table 3.24: Forecast for Healthcare in the Global Advanced IC Packaging Market (2021-2026)
Table 3.25: Trends of Aerospace and Defense in the Global Advanced IC Packaging Market (2015-2020)
Table 3.26: Forecast for Aerospace and Defense in the Global Advanced IC Packaging Market (2021-2026)
Table 3.27: Trends of Others in the Global Advanced IC Packaging Market (2015-2020)
Table 3.28: Forecast for Others in the Global Advanced IC Packaging Market (2021-2026)
 
Chapter 4. Market Trends and Forecast Analysis from 2015 to 2026
Table 4.1: Market Size and CAGR of Various Regions in the Global Advanced IC Packaging Market by Value (2015-2020)
Table 4.2: Market Size and CAGR of Various Regions in the Global Advanced IC Packaging Market (2021-2026)
Table 4.3: Trends of the North American Advanced IC Packaging Market (2015-2020)
Table 4.4: Forecast for the North American Advanced IC Packaging Market (2021-2026)
Table 4.5: Trends of the European Advanced IC Packaging Market (2015-2020)
Table 4.6: Forecast for the European Advanced IC Packaging Market (2021-2026)
Table 4.7: Trends of the APAC Advanced IC Packaging Market (2015-2020)
Table 4.8: Forecast for the APAC Advanced IC Packaging Market (2021-2026)
Table 4.9: Trends of the ROW Advanced IC Packaging Market (2015-2020)
Table 4.10: Forecast for the ROW Advanced IC Packaging Market (2021-2026)
 
Chapter 5. Competitor Analysis
Table 5.1: Operational Integration of Advanced IC Packaging Suppliers
 
Chapter 6. Growth Opportunities and Strategic Analysis
Table 6.1: New Product Development by Major Advanced IC Packaging Producers During the Trend Period (2015-2020)
 
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Lucintel has been in the business of market research and management consulting since 2000 and has published over 600 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted in the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts in the Advanced IC Packaging market. The major manufacturers of advanced IC packaging are Taiwan Semiconductor, UMC, Global Foundries, Tower Jazz, Samsung Electronics, Texas Instruments, and others.
 
Below is a brief summary of the primary interviews that were conducted by job function for this report.
 

 
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process.
 

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