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The technologies in PCB market have undergone significant change in recent years, with traditional low density to advance high density PCBs. The rising wave of new technologies, such as rigid-flex and HDI are creating significant potential for advanced PCBs in smartphone and automotive applications, and driving the demand for PCB technologies.

In PCB market, various technologies, such as rigid 1-2 sided, standard multilayer, flexible circuits, rigid-flex, HDI/Microvia/build-up, and IC substrate are used in various applications. Increasing demand for PCB in the communication industry, growth in connected devices, and advancement in automotive electronics are creating new opportunities for various PCB technologies.

This report analyzes technology maturity, degree of disruption, competitive intensity, market potential, and other parameters of various technologies in the PCB market. Some insights are depicted below by a sample figure. For more details on figures, the companies researched, and other objectives/benefits on this research report, please download the report brochure.


PCB Market by Technologies


PCB Technology Trends and Forecast


PCB Technology Heatmap


The study includes technology readiness, competitive intensity, regulatory compliance, disruption potential, trends, forecasts and strategic implications for the global PCB technology by application, technology, and region as follows:

Technology Readiness by Technology Type

Competitive Intensity and Regulatory Compliance

Disruption Potential by Technology Type

Trends and Forecasts by Technology Type [$M shipment analysis from 2013 to 2024]:
  • Rigid 1-2 Sided
  • Standard Multilayer
  • Flexible Circuits
  • Rigid-flex
  • HDI/Microvia/Build-up
  • IC Substrate
Technology Trends and Forecasts by Application [$M shipment analysis from 2013 to 2024]:
  • Computer/Peripherals
    • Rigid 1-2 Sided
    • Standard Multilayer
    • Flexible Circuits
    • Rigid-flex
    • HDI/Microvia/Build-up
    • IC Substrate
  • Communications
    • Rigid 1-2 Sided
    • Standard Multilayer
    • Flexible Circuits
    • Rigid-flex
    • HDI/Microvia/Build-up
    • IC Substrate
  • Consumer Electronics
    • Rigid 1-2 Sided
    • Standard Multilayer
    • Flexible Circuits
    • Rigid-flex
    • HDI/Microvia/Build-up
    • IC Substrate
  • Industrial Electronics
    • Rigid 1-2 Sided
    • Standard Multilayer
    • Flexible Circuits
    • Rigid-flex
    • HDI/Microvia/Build-up
    • IC Substrate
  • Automotive
    • Rigid 1-2 Sided
    • Standard Multilayer
    • Flexible Circuits
    • Rigid-flex
    • HDI/Microvia/Build-up
    • IC Substrate
  • Military/Aerospace
    • Rigid 1-2 Sided
    • Standard Multilayer
    • Flexible Circuits
    • Rigid-flex
    • HDI/Microvia/Build-up
    • IC Substrate
  • Others
    • Rigid 1-2 Sided
    • Standard Multilayer
    • Flexible Circuits
    • Rigid-flex
    • HDI/Microvia/Build-up
    • IC Substrate
Technology Trends and Forecasts by Region [$M shipment analysis for 2013 to 2024]:       
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • United Kingdom
    • Germany
    • France
  • Asia Pacific
    • Japan
    • China
    • South Korea
    • India
  • The Rest of the World

Latest Developments and Innovations in the PCB Technologies
 
Companies / Ecosystems
 
Strategic Opportunities by Technology Type
 
Some of the PCB companies profiled in this report include Zhen Ding Technology Holding, NOK Corporation, TTM Technologies, Unimicron Technology, Compeq Manufacturing, Young Poong Electronics, Samsung Electro-Mechanics, Tripod Technology, and Ibiden Co.

This report answers following 9 key questions:
Q.1 What are some of the most promising and high-growth technology opportunities for the PCB market?
Q.2 Which technology will grow at a faster pace and why?
Q.3 What are the key factors affecting dynamics of different technologies? What are the drivers and challenges of these technologies in PCB market?
Q.4 What are the levels of technology readiness, competitive intensity and regulatory compliance in this technology space?
Q.5 What are the business risks and threats to these technologies in PCB market?
Q.6 What are the latest developments in PCB technologies? Which companies are leading these developments? 
Q.7 Which technologies have potential of disruption in this market?
Q.8 Who are the major players in this PCB market? What strategic initiatives are being implemented by key players for business growth?
Q.9 What are strategic growth opportunities in this PCB technology space?
Table of Contents

1. Executive Summary

2. Technology Landscape
2.1. Technology Background and Evolution
2.2. Technology and Application Mapping
2.3. Supply Chain

3. Technology Readiness
3.1. Technology Commercialization and Readiness
3.2. Drivers and Challenges in PCB Technologies
3.3. Competitive Intensity
3.4. Regulatory Compliance

4. Technology Trends and Forecasts Analysis from 2013-2024
4.1. PCB Opportunity
4.2. Technology Trends (2013-2018) and Forecasts (2019-2024)
4.2.1. Rigid 1-2 Sided
4.2.2. Standard Multilayer
4.2.3. Flexible Circuits
4.2.4. Rigid-flex
4.2.5. HDI/Microvia/Build-up
4.2.6. IC Substrate
4.3. Technology Trends (2013-2018) and Forecasts (2019-2024) by Application Segments
4.3.1. Computer/Peripherals by Technology
4.3.1.1. Rigid 1-2 Sided
4.3.1.2. Standard Multilayer
4.3.1.3. Flexible Circuits
4.3.1.4. Rigid-flex
4.3.1.5. HDI/Microvia/Build-up
4.3.1.6. IC Substrate
4.3.2. Communications by Technology
4.3.2.1. Rigid 1-2 Sided
4.3.2.2. Standard Multilayer
4.3.2.3. Flexible Circuits
4.3.2.4. Rigid-flex
4.3.2.5. HDI/Microvia/Build-up
4.3.2.6. IC Substrate
4.3.3. Consumer Electronics by Technology
4.3.3.1. Rigid 1-2 Sided
4.3.3.2. Standard Multilayer
4.3.3.3. Flexible Circuits
4.3.3.4. Rigid-flex
4.3.3.5. HDI/Microvia/Build-up
4.3.3.6. IC Substrate
4.3.4. Industrial Electronics by Technology
4.3.4.1. Rigid 1-2 Sided
4.3.4.2. Standard Multilayer
4.3.4.3. Flexible Circuits
4.3.4.4. Rigid-flex
4.3.4.5. HDI/Microvia/Build-up
4.3.4.6. IC Substrate
4.3.5. Automotive by Technology
4.3.5.1. Rigid 1-2 Sided
4.3.5.2. Standard Multilayer
4.3.5.3. Flexible Circuits
4.3.5.4. Rigid-flex
4.3.5.5. HDI/Microvia/Build-up
4.3.5.6. IC Substrate
4.3.6. Military/Aerospace by Technology
4.3.6.1. Rigid 1-2 Sided
4.3.6.2. Standard Multilayer
4.3.6.3. Flexible Circuits
4.3.6.4. Rigid-flex
4.3.6.5. HDI/Microvia/Build-up
4.3.6.6. IC Substrate
4.3.7. Others by Technology
4.3.7.1. Rigid 1-2 Sided
4.3.7.2. Standard Multilayer
4.3.7.3. Flexible Circuits
4.3.7.4. Rigid-flex
4.3.7.5. HDI/Microvia/Build-up
4.3.7.6. IC Substrate

5. Technology Opportunities (2013-2024) by Region
5.1. PCB Market by Region
5.2. North American PCB Technology Market
5.2.1. United States PCB Technology Market
5.2.2. Canadian PCB Technology Market
5.2.3. Mexican PCB Technology Market
5.3. European PCB Technology Market
5.3.1. The United Kingdom PCB Technology Market
5.3.2. German Automotive PCB Technology Market
5.3.3. French Automotive PCB Technology Market
5.4. APAC  PCB Technology Market
5.4.1. Chinese PCB System Technology Market
5.4.2. Japanese PCB System Technology Market
5.4.3. Indian PCB System Technology Market
5.4.4. South Korean PCB Technology Market
5.5. ROW PCB Technology Market

6. Latest Developments and Innovations in the PCB Technologies

7. Companies / Ecosystem
7.1. Product Portfolio Analysis
7.2. Market Share Analysis
7.3. Geographical Reach

8. Strategic Implications
8.1. Implications
8.2. Growth Opportunity Analysis
8.2.1. Growth Opportunities for the PCB Market by Technology type
8.2.2. Growth Opportunities for the PCB Market by Application
8.2.3. Growth Opportunities for the PCB Market by Region
8.3. Emerging Trends in the PCB Market
8.4. Disruption Potential
8.5. Strategic Analysis
8.5.1. New Product Development
8.5.2. Capacity Expansion of the PCB Market
8.5.3. Mergers, Acquisitions, and Joint Ventures in the PCB Market
 
9. Company Profiles of Leading Players
9.1. Zhen Ding Technology Holding
9.2. NOK Corporation
9.3. TTM Technologies
9.4. Unimicron Technology
9.5. Compeq Manufacturing
9.6. Young Poong Electronics
9.7. Samsung Electro-Mechanics
9.8. Tripod Technology
9.9. Ibiden Co
.

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Lucintel has been in the business of market research and management consulting since 1998 and has published over 750 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research for technology related published data
  • Extensive searches of different company’s product and technology development, published works, market, and database information pertaining to industry technology related news, and company press releases
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted to identify emerging technologies, technology readiness, competitive intensity, regulatory compliance, disruption potential, technology trends, and strategic implications.         

Below is a brief summary of the primary interviews that were conducted by both job function and region for this report.
 
Technology Primary Interviews by Job FunctionTechnology Primary Interviews by Region
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process.