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The future of the 3D TSV device market looks promising with opportunities in the consumer electronics, information and communication technology, automotive, military, aerospace, and defense industries. The global 3D TSV device market is expected to grow with a CAGR of 6% to 8% from 2021 to 2026. The major drivers for this market are miniaturization of electronic devices, increasing need of saving space in package, and shorter reaction time.
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