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3D Semiconductor Packaging Market Trends and Forecast
The future of the global 3D semiconductor packaging market looks promising with opportunities in the consumer electronic, industrial, automotive, healthcare, IT & telecommunication, and aerospace & defense industries. The global 3D semiconductor packaging market is expected to reach an estimated $8.7 billion by 2028 with a CAGR of 19% from 2023 to 2028. The major growth drivers for this market are high demand for miniaturized consumer electronics, increasing sales of electric vehicles, and the requirement of less space, high efficiency, and low power loss.