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The technologies in flexible PCB market have undergone significant change in recent years, with traditional single sided flexible circuit to advanced multi-layer and rigid-flex flexible circuit. The rising wave of rigid-flex circuit technology are creating significant potential in various telecommunication and medical applications, and driving the demand for flexible PCB technologies.

In flexible PCB market, various technologies, such as single sided, double sided, multi-layer, and rigid flex circuits are used in various applications. Increasing demand for FPC in the telecommunication industry, growth in connected device, and advancement in automotive electronics are creating new opportunities for various flexible PCB technologies.

This report analyzes technology maturity, degree of disruption, competitive intensity, market potential, and other parameters of various technologies in the flexible PCB market. Some insights are depicted below by a sample figure. For more details on figures, the companies researched, and other objectives/benefits on this research report, please download the report brochure.


Global Flexible PCB Market by Technology Type


Technology Trends in Global Flexible PCB Market


Flexible PCB Technology Heat Map


The study includes technology readiness, competitive intensity, regulatory compliance, disruption potential, trends, forecasts and strategic implications for the global flexible PCB technology by application, technology, and region as follows:

Technology Readiness by Technology Type

Competitive Intensity and Regulatory Compliance  

Disruption Potential by Technology Type
 
. Trends and Forecasts by Technology Type [$M shipment analysis for 2013 to 2024]:         
  • Single Sided
  • Double Sided
  • Multi-Layer Flex
  • Rigid Flex Circuits
Trends and Forecasts by Application [$M shipment analysis for 2013 to 2024]:
  • Aerospace
    • Single Sided
    • Double Sided
    • Multi-Layer Flex
    • Rigid Flex Circuits
  • Telecommunications
    • Single Sided
    • Double Sided
    • Multi-Layer Flex
    • Rigid Flex Circuits
  • Automotive
    • Single Sided
    • Double Sided
    • Multi-Layer Flex
    • Rigid Flex Circuits
  • Medical
    • Single Sided
    • Double Sided
    • Multi-Layer Flex
    • Rigid Flex Circuits
  • Consumer Electronics
    • Single Sided
    • Double Sided
    • Multi-Layer Flex
    • Rigid Flex Circuits
Trends and Forecasts by Region [$M shipment analysis for 2013 to 2024]:                   
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • United Kingdom
    • Germany
    • France
  • Asia Pacific
    • Japan
    • China
    • South Korea
    • India
  • The Rest of the World
Latest Developments and Innovations Flexible PCB Technologies

Companies / Ecosystems

Strategic Opportunities by Technology Type

Some of the companies profiled in this report include LG Innotek, Amphenol APC, Multi Circuit Boards Ltd., Epec, Austria Technologie & Systemtechnik, Würth Elektronik GmbH & Co., Flexible Circuit Technologies, Inc., 3M, and Cirexx International

This report answers following 9 key questions:
Q.1 What are some of the most promising and high-growth technology opportunities for the flexible PCB market?
Q.2 Which technology will grow at a faster pace and why?
Q.3 What are the key factors affecting dynamics of different technologies? What are the drivers and challenges of these technologies in flexible PCB market?
Q.4 What are the levels of technology readiness, competitive intensity and regulatory compliance in this technology space?
Q.5 What are the business risks and threats to these technologies in flexible PCB market?
Q.6 What are the latest developments in flexible PCB technologies? Which companies are leading these developments? 
Q.7 Which technologies have potential of disruption in this market?
Q.8 Who are the major players in this flexible PCB market? What strategic initiatives are being implemented by key players for business growth?
Q.9 What are strategic growth opportunities in this flexible PCB technology space?
 
Table of Contents

1. Executive Summary

2. Technology Landscape
2.1. Technology Background and Evolution
2.2. Technology and Application Mapping
2.3. Supply Chain

3. Technology Readiness
3.1. Technology Commercialization and Readiness
3.2. Drivers and Challenges in Flexible PCB Technologies
3.3. Competitive Intensity
3.4. Regulatory Compliance

4. Technology Trends and Forecasts Analysis from 2013-2024
4.1. Flexible PCB Opportunity
4.2. Technology Trends (2013-2018) and Forecasts (2019-2024)
4.2.1. Single Sided
4.2.2. Double Sided
4.2.3. Multi-Layer Flex
4.2.4. Rigid Flex Circuits
4.3. Technology Trends (2013-2018) and Forecasts (2019-2024) by Application Segments
4.3.1. Aerospace
4.3.1.1. Single Sided
4.3.1.2. Double Sided
4.3.1.3. Multi-Layer Flex
4.3.1.4. Rigid Flex Circuits
4.3.2. Telecommunications
4.3.2.1. Single Sided
4.3.2.2. Double Sided
4.3.2.3. Multi-Layer Flex
4.3.2.4. Rigid Flex Circuits
4.3.3. Automotive
4.3.3.1. Single Sided
4.3.3.2. Double Sided
4.3.3.3. Multi-Layer Flex
4.3.3.4. Rigid Flex Circuits
4.3.4. Medical Systems    
4.3.4.1. Single Sided
4.3.4.2. Double Sided
4.3.4.3. Multi-Layer Flex
4.3.4.4. Rigid Flex Circuits
4.3.5. Industrial & Instrumentation
4.3.5.1. Single Sided
4.3.5.2. Double Sided
4.3.5.3. Multi-Layer Flex
4.3.5.4. Rigid Flex Circuits
4.3.6. Semiconductors
4.3.6.1. Single Sided
4.3.6.2. Double Sided
4.3.6.3. Multi-Layer Flex
4.3.6.4. Rigid Flex Circuits
4.3.7. Consumer Electronics
4.3.7.1. Single Sided
4.3.7.2. Double Sided
4.3.7.3. Multi-Layer Flex
4.3.7.4. Rigid Flex Circuits

5. Technology Opportunities (2013-2024) by Region
5.1. Flexible PCB Market by Region
5.2. North American Double Sided Flexible PCB Technology Market
5.2.1. United States Flexible PCB Technology Market
5.2.2. Canadian Flexible PCB Technology Market
5.2.3. Mexican Flexible PCB Technology Market
5.3. European Double Sided Flexible PCB Technology Market
5.3.1. The United Kingdom Flexible PCB Technology Market
5.3.2. German Flexible PCB Technology Market
5.3.3. French Flexible PCB Technology Market
5.4. APAC Double Sided Flexible PCB Technology Market
5.4.1. Chinese Flexible PCB Technology Market
5.4.2. Japanese Flexible PCB Technology Market
5.4.3. Indian Flexible PCB Technology Market
5.4.4. South Korean Flexible PCB Technology Market
5.5. ROW Double Sided Flexible PCB Technology Market

6. Latest Developments and Innovations in the Flexible PCB Technologies

7. Companies / Ecosystem
7.1. Product Portfolio Analysis
7.2. Market Share Analysis
7.3. Geographical Reach

8. Strategic Implications
8.1. Implications
8.2. Growth Opportunity Analysis
8.2.1. Growth Opportunities for the Flexible PCB Market by Technology
8.2.2. Growth Opportunities for the Flexible PCB Market by Application
8.2.3. Growth Opportunities for the Flexible PCB Market by Region
8.3. Emerging Trends in the Flexible PCB Market
8.4. Disruption Potential
8.5. Strategic Analysis
8.5.1. New Product Development
8.5.2. Capacity Expansion of the Flexible PCB Market
8.5.3. Mergers, Acquisitions, and Joint Ventures in the Flexible PCB Market
 
9. Company Profiles of Leading Players            
9.1. LG Innotek
9.2. Amphenol APC
9.3. Multi Circuit Boards Ltd.
9.4. Epec
9.5. Austria Technologie & Systemtechnik
9.6. Würth Elektronik GmbH & Co.
9.7. Flexible Circuit Technologies, Inc.
9.8. 3M
9.9. Cirexx International
.

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Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
 
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process. 
 

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