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The future of the substrate-like PCB market looks promising with opportunities in the automotive, medical, computing & telecommunication, military aerospace & defense, industrial, and consumer electronics applications. The global substrate-like PCB market is expected to grow with a CAGR of 15% to 17% from 2021 to 2026. The major drivers for this market are the growing demand for smart consumer electronics and wearable devices and high adoption by leading OEMs.
 
A more than 150 page report is developed to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of substrate-like PCB market report download the report brochure.
 




 
 
The study includes trends and forecast for the global substrate-like PCB market by line/space, application, inspection technologies, and region as follows:
 
By Line/Space [$M shipment analysis for 2015 – 2026]:
  • 25/25 & 30/30 ìm
  • Less than 25/25 ìm
By Inspection Technologies [$M shipment analysis for 2015 – 2026]:
  • Automated Optical Inspection
  • Direct Imaging
  • Automated Optical Shaping
By Application [$M shipment analysis for 2015 – 2026]:
  • Consumer Electronics
  • Computing & Telecommunications
  • Automotive
  • Medical
  • Industrial
  • Military, Defense, & Aerospace
By Region [$M shipment analysis for 2015 – 2026]:
  • North America
  • United States
  • Canada
  • Mexico
  • Europe
  • Germany
  • United Kingdom
  • France
  • Italy
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • The Rest of the World
Optical inspection will remain the largest segment due to increased interest of SLP manufacturers in adopting advanced inspection technologies and rising demand in consumer electronics, telecommunication, and other end use industries.
 
Consumer electronics will remain the largest application during the forecast period due to high penetration of internet and adoption of smartphones and other smart appliances.
 
Asia Pacific will remain the largest region during the forecast period due to increasing demand for connectivity solutions, expansion of telecommunications infrastructure, and increasing adoption of smartphone in this region.
 
Some of the substrate-like PCB companies profiled in this report include AT & S, TTM Technologies, Samsung Electro-Mechanics, Korea Circuit, Kinsus Interconnect Technology, Zhen Ding Technology, Unimicron, Compeq,Ibiden, Tripod Technology Corporation, and LG Innotek.
 
 
Features of Substrate-Like PCB Market
 
  • Market Size Estimates: Substrate-Like PCB market size estimation in terms of value ($M)
  • Trend and Forecast Analysis: Market trends (2015-2020) and forecast (2021-2026) by various segments and regions.
  • Segmentation Analysis: Market size by inspection technologies, line/space, and application
  • Regional Analysis: Substrate-Like PCB market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different inspection technologies, line/space, and application, and regions for substrate-like PCB market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the substrate-like PCB market.
  • Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
 
 
 
This report answers following 11 key questions
 
Q.1 What are some of the most promising potential, high-growth opportunities for the global substrate-like PCB market by line/space (25/25 & 30/30 im and less than 25/25 im), inspection technologies (automated optical inspection, direct imaging, and automated optical shaping), application (automotive, medical, computing & telecommunication, military aerospace & defense, industrial, consumer electronics), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the substrate-like PCB market?
Q.5 What are the business risks and threats to the substrate-like PCB market?
Q.6 What are emerging trends in this substrate-like PCB market and the reasons behind them?
Q.7 What are some changing demands of customers in the substrate-like PCB market?
Q.8 What are the new developments in the substrate-like PCB market? Which companies are leading these developments?
Q.9 Who are the major players in the substrate-like PCB market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in the substrate-like PCB market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M&A activities did take place in the last five years in the substrate-like PCB market?
 
 

Table of Contents
 
  • Executive Summary
  • Market Background and Classifications
    • Introduction, Background, and Classifications
    • Supply Chain
    • Industry Drivers and Challenges
  • Market Trends and Forecast Analysis from 2015 to 2026
    • Macroeconomic Trends (2015-2020) and Forecast (2021-2026)
    • Global Substrate-Like PCB Market Trends (2015-2020) and Forecast (2021-2026)
    • Global Substrate-Like PCB Market by Application
      • Consumer Electronics
      • Computing & Telecommunications
      • Automotive
      • Medical
      • Industrial
      • Military, Defense, & Aerospace
    • Global Substrate-Like PCB Market by Inspection Technologies
      • Automated Optical Inspection
      • Direct Imaging
      • Automated Optical Shaping
    • Global Substrate-Like PCB Market by Line/Space
      • 25/25 & 30/30 ìm
      • Less than 25/25 ìm
  • Market Trends and Forecast Analysis by Region from 2015 to 2026
    • Global Substrate-Like PCB Market by Region
    • North American Substrate-Like PCB Market
      • Market by Application
      • Market by Inspection Technologies
      • The US Substrate-Like PCB Market
      • The Canadian Substrate-Like PCB Market
      • The Mexican Substrate-Like PCB Market
    • European Substrate-Like PCB Market
      • Market by Application
      • Market by Inspection Technologies
      • German Substrate-Like PCB Market
      • United Kingdom Substrate-Like PCB Market
      • French Substrate-Like PCB Market
      • Italian Substrate-Like PCB Market
    • APAC Substrate-Like PCB Market
      • Market by Application
      • Market by Inspection Technologies
      • Chinese Substrate-Like PCB Market
      • Japanese Substrate-Like PCB Market
      • Indian Substrate-Like PCB Market
      • South Korean Substrate-Like PCB Market
    • ROW Substrate-Like PCB Market
      • Market by Application
      • Market by Inspection Technologies
  • Competitor Analysis
    • Product Portfolio Analysis
    • Geographical Reach
    • Porter’s Five Forces Analysis
  • Growth Opportunities and Strategic Analysis
    • Growth Opportunity Analysis
      • Growth Opportunities for the Global Substrate-Like PCB Market by Application
      • Growth Opportunities for the Global Substrate-Like PCB Market by Inspection Technologies
      • Growth Opportunities for the Global Substrate-Like PCB Market by Line/Space
      • Growth Opportunities for the Global Substrate-Like PCB Market by Region
    • Emerging Trends in the Global Substrate-Like PCB Market
    • Strategic Analysis
      • New Product Development
      • Capacity Expansion of the Global Substrate-Like PCB Market
      • Technology Development
      • Mergers and Acquisitions in the Global Substrate-Like PCB Industry
  • Company Profiles of Leading Players
    • AT & S
    • TTM Technologies
    • Samsung Electro-Mechanics
    • Korea Circuit
    • Kinsus Interconnect Technology
    • Zhen Ding Technology
    • Unimicron
    • Compeq
    • Ibiden
    • Tripod Technology Corporation
    • LG Innotek

.

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150 - page report
Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
 
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process. 
 

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