According to a new market report by Lucintel, the future of the global solder ball market looks promising with opportunities in the automotive and electronics industries. The global solder ball market is expected to decline in 2020 due to global economic recession led by COVID-19. However, the market will witness recovery in the year 2021 and it is expected to grow with a CAGR of 6% from 2020 to 2025. The major growth drivers for this market are growing demand for solder ball metal for the making of aluminum alloys that are used in the automotive industry and the growing adoption of solder balls in circuit and packaging.
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In this market, lead solder ball and lead-free solder balls are used. Lucintel forecasts that lead-free solder balls will remain the largest segment over the forecast period as the product is free of lead, which is associated with environmental concerns.
Within this market, electronics will remain the largest application over the forecast period due to growth of the consumer electronics industry.
Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to growth of the automotive and consumer electronics industries.
Emerging trends, which have a direct impact on the dynamics of the industry, include production of technologically advanced solder balls and usage of solder balls in circuit and packaging. Duksan Metal, Hitachi Metals, Nanotech, Nippon Micrometal, Indium Corporation, Senju Metal are among the major manufacturers of the global solder ball market.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global solder ball market by product type, solder type, size, end use industry, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global Solder Ball Market 2020-2025: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global solder balls by product type, solder type, size, end use industry, and region as follows:
By Product Type [$M shipment analysis for 2014 – 2025]:
Lead Solder Balls
Lead Free Solder Balls
By Solder Type [$M shipment analysis for 2014 – 2025]:
By End Use Industry [$M shipment analysis for 2014 – 2025]:
By Region [$M shipment analysis for 2014 – 2025]:
United States
Canada
Mexico
China
Japan
India
South Korea
This 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.