According to a new market report by Lucintel, the future of the global semiconductor packaging materials market looks promising with opportunities in consumer electronics, aerospace & defense, healthcare, communication, and automotive industries. The global semiconductor packaging materials market is expected to decline in 2020 due to global economic recession led by COVID-19. However, the market will witness recovery in the year 2021 and it is expected to grow with a CAGR of 9% from 2020 to 2025. The major growth drivers for this market are a growing trend of miniaturization of the electronic devices across the world and high demand for mobile phones, tablets, and other communication devices.
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In this market, substrates, leadframes, bonding wires, encapsulants, underfill materials, die attach, solder balls, and wafer level packaging dielectrics are the types of products used. Lucintel forecasts that substrates will remain the largest segment over the forecast period due to demand for system-in-package (SIP) and high-performance devices.
Within this market, consumer electronics is expected to witness the highest growth over the forecast period due to an increasing number of smartphones.
Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to the high demand for electronic packaging materials and for consumer electronics in China, Taiwan, and India.
Henkel, Hitachi Chemical, Sumitomo Chemical, Kyocera Chemical, and Toray Industries are among the major manufacturers of the global semiconductor packaging materials market.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global semiconductor packaging materials market by product type, technology, end use industry, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global Semiconductor Packaging Materials Market 2020-2025: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global semiconductor packaging materials market by product type, technology, end use industry, and region as follows:
By Product Type [$M shipment analysis for 2014 – 2025]:
Substrates
Leadframes
Bonding Wires
Encapsulants
Underfill Materials
Die Attach
Solder Balls
Wafer Level Packaging Dielectrics
Others
By Technology [$M shipment analysis for 2014 – 2025]:
Grid Array
Small Outline Package
Dual Flat No-Leads
Quad Flat Package
Dual In-Line Package
Others
By End Use Industry [$M shipment analysis for 2014 – 2025]:
Consumer Electronics
Aerospace & Defense
Healthcare
Communication
Automotive
Others
By Region [$M shipment analysis for 2014 – 2025]:
United States
Canada
Mexico
China
Japan
India
South Korea
This 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.