According to a market report by Lucintel, the future of the semiconductor manufacturing equipment market looks promising with opportunities in 2D, 5D, and 3D dimensions. The global semiconductor manufacturing equipment market is expected to grow with a CAGR of 9% from 2021 to 2026. The major drivers for this market are increasing demand for electric and hybrid vehicles, high demand for chips to provide computation power and connectivity for AI applications, and trend of miniaturization and technology migration.
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In this market, different back-end equipment of semiconductor manufacturing, such as assembly & packaging, dicing, bonding, metrology, and testing, are used in a wide range of industries. Assembly and packaging will remain the largest back-end equipment segment due to increasing penetration of major foundries, such as GlobalFoundries (US) and Intel Corporation, in the APAC region, which will increase the activities of assembly and packaging equipment.
Within the semiconductor manufacturing equipment market, 2D ICs will remain the largest dimension segment during the forecast period due to low initial cost.
Asia Pacific will remain the largest region during the forecast period due to increasing demand for consumer electronics market share in the APAC region due to penetration of major competitors in this region.
Tokyo Electron, LAM Research, ASML, Applied Materials, and KLA-Tencor are among the major semiconductor manufacturing equipment manufacturers.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global semiconductor manufacturing equipment market by front-end equipment, back-end equipment, product, dimension type, supply chain participant, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global Semiconductor Manufacturing Equipment Market 2021-2026: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global semiconductor manufacturing equipment market by front-end equipment, back-end equipment, product, dimension type, supply chain participant, and region as follows:
By Front-End Equipment [$M shipment analysis for 2015 – 2026]:
Lithography
Wafer Surface Conditioning
Deposition
Cleaning
Others
By Back-End Equipment [$M shipment analysis for 2015 – 2026]:
Assembly and Packaging
Dicing
Bonding
Metrology
Testing
By Product [$M shipment analysis for 2015 – 2026]:
Memory
Foundry
Logic
MPU
Discrete
Analog, MEMS, and Others
By Dimension Type [$M shipment analysis for 2015 – 2026]:
By Supply Chain Participant [$M shipment analysis for 2015 – 2026]:
OSAT Companies
IDM Firms
Foundries
By Region [$M shipment analysis for 2015 – 2026]:
North America
United States
Canada
Mexico
Europe
Germany
United Kingdom
France
Italy
Asia Pacific
China
Japan
India
South Korea
The Rest of the World
This more than 150 page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. We offer market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision makers in a variety of industries. For further information, visit www.lucintel.com.