According to a new market report published by Lucintel, the future of the
interposer and fan-out WLP market looks promising with opportunities in the automotive, medical devices, smart technologies, telecommunication, military & aerospace, industrial, and consumer electronics industries. The global interposer and fan-out WLP market is expected to grow with a CAGR of 28% from 2021 to 2026. The major drivers for this market are increasing demand for advanced architecture in smartphones, tablets, gaming devices, rising trend of miniaturization of electronics devices, and increased usage of advanced wafer level packaging technologies in MEMS and sensors.
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In this market, different packaging technology of interposer and fan-out WLP, such as through-silicon vias (TSVs), interposer, and fan-out wafer-level packaging (FOWLP) are used in a wide range of industries. Lucintel forecasts that silicon vias (TSVs) will remain the largest segment due to increase in its demand for use in various smart technologies, including wearable and connected devices.
Within the interposer and fan-out WLP market, consumer electronics will remain the largest end use industry during the forecast period due to increasing demand for smartphones, tablets, and other portable computing devices.
Asia Pacific will remain the largest region during the forecast period due to increasing demand in consumer electronics and automobile industries and also the adoption of IoT devices is expected to increase in the APAC region.
Taiwan Semiconductor Manufacturing Company Ltd., Samsung Electronics Co., Ltd., Toshiba Corp., Advanced Semiconductor Engineering Group, and Amkor Technology are among the major interposer and fan-out WLP manufacturers.
Lucintel, a leading global strategic consulting and
market research firm, has analyzed growth opportunities in the global interposer and fan-out WLP market by packaging technology, application, end use industry, and region. Lucintel has prepared a comprehensive research report titled “
Growth Opportunities in the Global Interposer and Fan-Out WLP Market 2021-2026: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global interposer and fan-out WLP market by packaging technology, application, end use industry, and region as follows:
By Packaging Technology [$M shipment analysis for 2015 – 2026]:
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Through-silicon vias (TSVs)
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Interposers
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Fan-out wafer-level packaging (FOWLP)
By Application [$M shipment analysis for 2015 – 2026]:
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Logic
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Imaging & optoelectronics
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Memory
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MEMS/sensors
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LED
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Power, analog & mixed signal, RF, photonics
By End Use Industry [$M shipment analysis for 2015 – 2026]:
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Consumer electronics
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Telecommunication
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Industrial sector
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Automotive
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Military and aerospace
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Smart technologies
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Medical devices
By Region [$M shipment analysis for 2015 – 2026]:
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North America
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United States
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Canada
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Mexico
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Europe
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Germany
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United Kingdom
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France
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Italy
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Asia Pacific
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China
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Japan
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India
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South Korea
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The Rest of the World
This more than 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. We offer market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision makers in a variety of industries. For further information, visit www.lucintel.com.
