According to a new market report published by Lucintel, the future of the Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) market looks promising with opportunities in graphics, high performance computing, networking, and data center applications. The global HMC and HBM market is expected to reach an estimated $6.2 billion by 2027 with a CAGR of 28% from 2021 to 2027. The major drivers for this market are growing need for high bandwidth, low power consumption, highly scalable memories in various applications, growth in artificial intelligence, and miniaturization of electronic devices.
In this market, Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) are two memory types that are used in a wide range of applications. Lucintel forecasts that HBM will remain the largest segment during the forecast period due to increasing demand for Advanced Graphics Processing Unit (GPU) and Central Processing Unit (CPU) in the high performance computing market.
Within the HMC and HBM market, high performance computing will remain the largest application segment during the forecast period due to growing adoption of artificial intelligence in retail, manufacturing, transportation, financial institution, and healthcare sectors.
Asia Pacific will remain the largest region by value during the forecast period due to growth in the enterprise storage and consumer electronics sectors and increasing number of data centers and servers.
Emerging trends, which have a direct impact on the dynamics of the industry, include development of advanced technology with new packaging options and increasing demand for HBM for enhancing virtual reality and augmented reality experience. Micron Technology, Samsung Electronics, and SK Hynix are among the major HMC and HBM manufacturers.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global HMC and HBM market by device type, application, memory type, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global HMC and HBM Market 2022-2027: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global HMC and HBM market by device type, application, memory type, and region as follows:
By Memory Type [$M shipment analysis for 2016 – 2027]:
HMC (Hybrid Memory Cube)
HBM (High-bandwidth Memory)
By Application [$M shipment analysis for 2016 – 2027]:
Graphics
High Performance Computing
Networking
Data Centers and Others
By Device Type [$M shipment analysis for 2016 – 2027]:
CPU
GPU
FPGA
APU
ASIC and Others
By Region [$M shipment analysis for 2016 – 2027]:
North America
Europe
Asia Pacific
The Rest of the World
This more than 130 page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
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