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According to a new market report published by Lucintel, the future of the high density packaging market looks promising with opportunities in the consumer electronics, aerospace & defense, healthcare, IT & telecom, automotive, energy & utility industries. The global high density packaging market is expected to grow with a CAGR of 12% from 2020 to 2025. The major drivers for this market are favorable government regulations in the developing countries and high application in the consumer electronics segment.

To download report brochure, please go to https://www.lucintel.com/high-density-packaging-market.aspx and click "download brochure" tab from the menu



In this market, MCM, MCP, SIP, 3D-TSV are the major packaging techniques used,

Within this market, consumer electronics is expected to witness the highest growth over the forecast period as to its high density semiconductor packaing have given rise to smaller, lighter, and more portable devices, such as tablets, smartphones, and the emerging IoT devices.

Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to growth of the consumer electronics market.

Emerging trends, which have a direct impact on the dynamics of the industry, include high application in the consumer electronics segment to augment the market growth. Toshiba, IBM, Fujitsu, Hitachi, Mentor are among the major suppliers in the global high density packaging market.

Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global high density packaging market by packaging technique, end use industry, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global High Density Packaging Market 2020-2025: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global high density packaging market by packaging technique, end use industry, and region as follows:

By Packaging Technique [Value ($ Million) shipment analysis for 2014 – 2025]:



  • MCM


  • MCP


  • SIP


  • 3D-TSV


By End Use Industy [Value ($ Million) shipment analysis for 2014 – 2025]:



  • Consumer Electronics


  • Aerospace & Defense


  • Healthcare


  • IT & Telecom


  • Automotive


  • Energy and Utility


  • Others


By Region [Value ($ Million) shipment analysis for 2014 – 2025]:



  • North America




  • United States


  • Canada


  • Mexico




  • Europe




  • United Kingdom


  • Spain


  • Germany


  • France




  • Asia Pacific




  • China


  • India


  • Japan


  • South Korea




  • The Rest of the World




  • Brazil


 

A more than 150 pages research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.

About Lucintel

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision makers in a variety of industries. For further information, visit www.lucintel.com.