According to a new market report published by Lucintel, the future of the high-density interconnect (HDI) PCB market looks promising with opportunities in the smartphone, computer, telecom and datacom, consumer electronics, and automotive industries. The global HDI PCB market is expected to reach an estimated $19.1 billion by 2027 with a CAGR of 4.7% from 2021 to 2027. The major drivers for this market are growth in the consumer electronics market, miniaturization of electronic devices, and increasing demand for high performance devices.
In this market, 4-6 layers, 8-10 layers, and more than 10 layers (10+ layers) HDI PCBs are used in a wide range of electronic components. Lucintel forecasts that 4-6 layers will remain the largest segment due to increasing demand in smartphone and telecom and datacom. The 10+ layer HDI PCB market is expected to witness the highest growth during the forecast period due to the growing demand for smart wearables and connected devices.
Within HDI PCB market, smartphones will remain the largest end use industry due to the increasing demand for high performance PCB and growing demand for more space in smartphones for larger batteries. Automotive is expected to witness the highest growth over the forecast period due to advancement in automotive electronics.
Asia Pacific will remain the largest market, and it is also expected to witness the highest growth over the forecast period due to the increasing electronic content in automotive and growth in consumer electronic devices & telecommunication products.
Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high-speed HDI PCBs. Unimicron, AT&S, Samsung Electro-Mechanics, Tripod, Compeq, Unitech, NOK Corporation, Zhen Ding Technology, Flexium Interconnect, Fujikura, Nitto Denko, and Young Poong Electronics are among the major manufacturers of HDI PCBs.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global HDI PCB market by end use industry, technology, buildup layer count, and region. Lucintel has prepared a comprehensive research report entitled "Growth Opportunities in the Global HDI PCB Market 2022-2027: Trends, Forecast, and Opportunity Analysis." This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global HDI PCB market by end use industry, technology, build-up layer count, and region as follows:
By End Use Industry [$M and Thousand Sqm shipment analysis for 2016 – 2027]:
Smartphones
Computers
Telecom/datacom
Consumer Electronics
Automotive
Others
By Technology [$M and Thousand Sqm shipment analysis for 2016 – 2027]:
4-6 Layer
8-10 Layer
10+ Layer
By Build-Up Structure [$M and Thousand Sqm shipment analysis for 2016 – 2027]:
By Region [$M and Thousand Sqm shipment analysis for 2016 – 2027]:
North America
Europe
Asia Pacific
The Rest of the World
This 186-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. We offer market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision makers in a variety of industries. For further information, visit www.lucintel.com.