According to a market report by Lucintel, the future of the hermetic packaging market looks promising with opportunities in the military & defense, aeronautics & space, automotive, energy & nuclear safety, medical, telecommunication, consumer electronics, and other industries. The global hermetic packaging market is expected to grow with a CAGR of 4% from 2021 to 2026. The major drivers for this market are growing adoption of hermetic packaging for protecting highly sensitive electronic components and increasing demand for hermetically packaged products in aerospace, automotive, and electronics.
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In this market, different configuration types of hermetic packaging, such as multilayer ceramic packages, pressed ceramic packages, and metal can packages, are used in a wide range of industries. Multilayer ceramic packages will remain the largest configuration segment due to increasing demand in high-frequency applications, such as data communication, wireless communication, and optical communication.
Within the hermetic packaging market, military & defense will remain the largest end use industry during the forecast period due to increasing requirement for customized solutions in air surveillance and underwater surveillance industries.
Asia Pacific will remain the largest region during the forecast period due to increasing energy needs in emerging economies and increasing defense spending in developing economies, such as, China, India, and South Korea.
SCHOTT, AMETEK, Amkor Technology, Texas Instrument, and Kyocera Corporation are among the major hermetic packaging manufacturers.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global hermetic packaging market by configuration, type, application, end use industry, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global Hermetic Packaging Market 2021-2026: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global hermetic packaging market by configuration, type, application, end use industry, and region as follows:
By Configuration [$M shipment analysis for 2015 – 2026]:
Multilayer Ceramic Packages
Pressed Ceramic Packages
Metal Can Packages
By Type [$M shipment analysis for 2015 – 2026]:
Passivation Glass
Reed Glass
Transponder Glass
Glass-Metal Sealing (GTMS)
Ceramic-Metal Sealing (CERTM)
By Application [$M shipment analysis for 2015 – 2026]:
Transistors
Sensors
Lasers
Airbag Ignitors
Photo Diodes
Oscillating Crystals
MEMS Switch
Others
By End Use Industry [$M shipment analysis for 2015 – 2026]:
Military & Defense
Aeronautics & Space
Automotive
Energy & Nuclear Safety
Medical
Telecommunication
Consumer Electronics
Others
By Region [$M shipment analysis for 2015 – 2026]:
North America
United States
Canada
Mexico
Europe
Germany
United Kingdom
France
Italy
Asia Pacific
China
Japan
India
South Korea
The Rest of the World
This more than 150 page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
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