According to a new market report published by Lucintel, the future of the gallium arsenide wafer market looks attractive with opportunities in radio frequency (RF) electronics and optoelectronics. The global gallium arsenide wafer market is expected to decline in 2020 due to global economic recession led by COVID-19. However, market will witness recovery in the year 2021 and it is expected to reach an estimated $0.9 billion by 2025 with a CAGR of 5% to 7% from 2020 to 2025. The major drivers of growth for this market are increasing adoption of smartphones and growing penetration of light emitting diode (LED) in general lighting.
Browse 50 Market Data Tables and 67 Figures spread through 111 Pages and in-depth TOC on “Gallium Arsenide Wafer Market- Global Forecast to 2025”
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Vertical gradient freeze (VGF) and Liquid Encapsulated Czochralski (LEC) are the two major manufacturing technologies used to manufacture gallium arsenide wafer. VGF will remain the largest manufacturing technology, and it is expected to witness highest growth during the forecast period as it produces substrates with relatively low defect densities and higher mechanical strength.
Gallium arsenide wafer is categorized into two substrate types: semi-conducting substrte and semi-insulating. The semi-conducting substrate type is expected to remain the largest segment and witness the highest growth over the forecast period due to increased demand for LEDs, lasers, and photodiodes.
In the GaAs wafer market, optoelectronics will remain the largest application segment, and this segment is also expected to grow at highest rate during the forecast period supported by the increasing demand for LEDs and lasers.
Asia Pacific is expected to be the largest region by value and will experience the highest growth over the forecast period supported by increasing demand for smartphones and LEDs in China, Japan, Taiwan, and India.
Emerging trends, which have a direct impact on the dynamics of the industry, include growing demand for larger size GaAs wafers and reusing gallium arsenide wafers for higher performance devices. Freiberger Compound Materials GmbH, Sumitomo Electric Industries, Ltd., AXT, Inc., Mitsubishi Chemical Corporation, DOWA Electronics Materials Co., Ltd. are among the major GaAs wafer providers.
The study includes a forecast for the global gallium arsenide wafer by substrate type, manufacturing technology, application, and region as follows:
By Substrate Type [$M shipment analysis from 2014 to 2025]:
Semi-Insulating Gallium Arsenide (SI GaAs)
Semi-Conducting Gallium Arsenide (SC GaAs)
By Manufacturing Technology [$M shipment analysis from 2014 to 2025]:
Liquid Encapsulated Czochralski (LEC)
Vertical Gradient Freeze (VGF)
Others
By Application [$M shipment analysis from 2014 to 2025]:
RF Electronics
Optoelectronics
By Region [$M shipment analysis for 2014 – 2025]:
North America
United States
Canada
Mexico
Europe
Asia Pacific
The Rest of the World
This 111-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link http://www.lucintel.com/toc/gallium-arsenide-wafer-market-2019.aspx or helpdesk@lucintel.com
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