Teijin to Exhibit at Chinaplas 2018

Teijin Limited will participate in Chinaplas 2018 held at the National Exhibition and Convention Center (Shanghai) on April 24-27. This will mark Teijin’s 19th appearance at the event. The Teijin booth (7.2 S11) will introduce resin products and related business initiatives to provide solutions that incorporate high-performance materials and technologies. Also, seminars to introduce advanced processing technologies and solutions for components, which were well received during last year’s exhibition, will be held again this year. Displays will include PC resins with a wide range of practical applications, including high-reflective-index camera lenses, ultra-hard resin with surface strength equal to that of an H-hardness pencil, high optical diffusion resin required for LED lights, and PEN resin offering excellent heat and chemical resistance. The booth will also present highly functional SOLFIGA PPS compounds and FCX-210, an organic phosphorus compound. Visitors will also view an automotive window made of Panlite, a PC resin that is half the weight of glass but more impact-resistant, and a large, distortion-free window panel made with Teijin’s superior coating technology. The booth will also showcase PC/PP resin compounds offering high heat resistance and high strength required in fields such as healthcare and housing.