Report Feature
The future of the fan-out packaging market looks promising with opportunities in the outsourced semiconductor assembly and testing (OSAT), foundry, and integrated device manufacturer (IDM) markets. The global fan-out packaging market is expected to decline in 2020 due to the global economic recession led by the COVID-19 pandemic. However, the market will witness recovery in the year 2021, and it is expected grow with a CAGR of 18% to 21% from 2020 to 2025. The major drivers for this market are growing applications in footprint sensitive devices, such as smartphones, owing to requirement of high performing, energy efficient, thin, and small form factor packages.
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The study includes trends and forecasts for the global fan-out packaging market by type, carrier type, business model, and region as follows:
By Type [$M shipment analysis for 2014 – 2025]:
Core Fan-Out
High-Density Fan-Out
By Carrier Type [$M shipment analysis for 2014 – 2025]:
200 mm
300 mm
Panel
By Business Model [$M shipment analysis for 2014 – 2025]:
OSAT
Foundary
IDM
By Region [$M shipment analysis for 2014 – 2025]:
North America
United States
Canada
Mexico
Europe
Germany
United Kingdom
France
Italy
Asia Pacific
China
Japan
India
South Korea
The Rest of the World
Some of the fan-out packaging companies profiled in this report include Taiwan Semiconductor Manufacturing Company, Jiangsu Changjiang Electronics, Amkor Technology, Samsung Electro-Mechanics, and Powertech Technology
Core fan-out and high density fan-out packaging are the two major types used in the OSAT, foundary and integrated device manufacturer (IDM) markets. Core fan-out packaging will remain the largest type segment over the forecast period.
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Features of Fan-Out Packaging Market |
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This report answers following 11 key questions |
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Q.1 What are some of the most promising potential, high-growth opportunities for the global fan-out packaging market by type (core fan-out and high-density fan-out), carrier type (200 mm, 300 mm, and panel), business model (OSAT, foundary, and IDM), and region (North America, Europe, Asia Pacific, and the Rest of the World)? Q.2 Which segments will grow at a faster pace and why? Q.3 Which regions will grow at a faster pace and why? Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the fan-out packaging market? Q.5 What are the business risks and threats to the fan-out packaging market? Q.6 What are emerging trends in this fan-out packaging market and the reasons behind them? Q.7 What are some changing demands of customers in the fan-out packaging market? Q.8 What are the new developments in the fan-out packaging market? Which companies are leading these developments? Q.9 Who are the major players in the fan-out packaging market? What strategic initiatives are being implemented by key players for business growth? Q.10 What are some of the competitive products and processes in the fan-out packaging market, and how big of a threat do they pose for loss of market share via material or product substitution? Q.11 What M&A activities did take place in the last five years in the fan-out packaging market? |
Table of Contents
1. Executive Summary
6.2 Emerging Trends in the Global Fan-Out Packaging Market
6.1.1 Growth Opportunities for the Global Fan-Out Packaging Market by Type
6.1.2 Growth Opportunities for the Global Fan-Out Packaging Market by Carrier Type
6.1.3 Growth Opportunities for the Global Fan-Out Packaging Market by Business Model
6.1.4 Growth Opportunities for the Global Fan-Out Packaging Market by Region
Methodology
Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
- In-depth interviews of the major players in this market
- Detailed secondary research from competitors’ financial statements and published data
- Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
- A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process.
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