Report Feature
The future of the 3D IC and 2.5D IC market looks promising with opportunities in the consumer electronics, telecommunication, industrial, automotive, military and aerospace, smart technology, and medical device industries. The global 3D IC and 2.5D IC market is expected to decline in 2020 due to the global economic recession led by the COVID-19 pandemic. However, the market will witness recovery in the year 2021, and it is expected grow with a CAGR of 37% to 39% from 2020 to 2025. The major drivers for this market are increasing demand for advanced architecture in electronics products and miniaturization of electronic devices
A more than 150 page report is developed to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of 3D sensor market report download the report brochure.
The study includes trends and forecasts for the global 3D IC and 2.5D IC market by technology, application, end use industry, and region as follows:
By Technology [$M shipment analysis for 2014 – 2025]:
- 3D Wafer-Level Chip-Scale Packaging
- 3D TSV
- 2.5D
By End Use Industry [$M shipment analysis for 2014 – 2025]:
- Consumer Electronics
- Telecommunication
- Industrial
- Automotive
- Military and Aerospace
- Smart Technologies
- Medical Devices
By Application [$M shipment analysis for 2014 – 2025]
- Logic
- Imaging & Optoelectronics
- Memory
- MEMS/Sensors
- LED
- Power, Analog & Mixed Signal, RF, Photonics
By Region [$M shipment analysis for 2014 – 2025]:
-
North America
- United States
- Canada
- Mexico
-
Europe
- Germany
- United Kingdom
- France
- Italy
-
Asia Pacific
- China
- Japan
- India
- South Korea
- The Rest of the World
Some of the 3D IC and 2.5D IC companies profiled in this report include Taiwan Semiconductor Manufacturing Company Ltd., Samsung Electronics, Toshiba Corp., Advanced Semiconductor Engineering Group, and Amkor Technology
Lucintel forecasts that logic will remain the largest application segment over the forecast period due to growing demand for 3D IC and 2.5D IC owing to high product availability.
Asia Pacific will remain the largest region during the forecast period due to growing demand for 3D IC and 2.5D IC in various consumer electronics products.
|
Features of 3D IC and 2.5D IC Market |
|
|
This report answers following 11 key questions |
|
Q.1 What are some of the most promising potential, high-growth opportunities for the global 3D IC and 2.5D IC market by technology (3D wafer-level chip-scale packaging, 3D TSV, and 2.5D), end use industry (consumer electronics, telecommunication, industrial, automotive, military and aerospace, smart technologies, medical devices), application (logic, imaging & optoelectronics, memory, MEMS/sensors, LED, and power, analog & mixed signal, RF, photonics), and region (North America, Europe, Asia Pacific, and the Rest of the World)? Q.2 Which segments will grow at a faster pace and why? Q.3 Which regions will grow at a faster pace and why? Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the 3D IC and 2.5D IC market? Q.5 What are the business risks and threats to the 3D IC and 2.5D IC market? Q.6 What are emerging trends in this 3D IC and 2.5D IC market and the reasons behind them? Q.7 What are some changing demands of customers in the 3D IC and 2.5D IC market? Q.8 What are the new developments in the 3D IC and 2.5D IC market? Which companies are leading these developments? Q.9 Who are the major players in the 3D IC and 2.5D IC market? What strategic initiatives are being implemented by key players for business growth? Q.10 What are some of the competitive products and processes in the 3D IC and 2.5D IC market, and how big of a threat do they pose for loss of market share via material or product substitution? Q.11 What M&A activities did take place in the last five years in the 3D IC and 2.5D IC market? |
Table of Contents
1. Executive Summary
6.2 Emerging Trends in the Global 3D IC and 2.5D IC Market
6.1.1 Growth Opportunities for the Global 3D IC and 2.5D IC Market by End Use Industry
6.1.2 Growth Opportunities for the Global 3D IC and 2.5D IC Market by Technology
6.1.3 Growth Opportunities for the Global 3D IC and 2.5D IC Market by Application
6.1.4 Growth Opportunities for the Global 3D IC and 2.5D IC Market by Region
Methodology
Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
- In-depth interviews of the major players in this market
- Detailed secondary research from competitors’ financial statements and published data
- Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
- A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process.
Buy Now
Choose a license that fits your team. Instant PDF delivery.
Prices exclude taxes. Instant delivery. Custom licensing available on request.
