Report Feature
The future of the global outsourced semiconductor assembly and test (OSAT) market looks promising with opportunities in the computer & networking, consumer electronics, industrial electronics, and telecom industries. The global OSAT market is expected to reach an estimated $39.7 billion by 2025 with a CAGR of 4.4% from 2020 to 2025. The major drivers for this market are increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices, and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.
Emerging trend, which has a direct impact on the dynamics of the industry, includes miniaturization and higher functionality of semiconductors.
A total of 157 figures / charts and 132 tables are provided in this 250-page report to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of OSAT market report download the report brochure.
The study includes a trend and forecast for the global OSAT market by service type, packaging type, end use industries, and region as follows:
By Service Type [$M analysis for 2014 – 2025]:
Lucintel forecasts that wire bond will remain the largest packaging type over the forecast period, as wire bond packaging is cost effective solution for low to medium pin count applications. The wafer level packaging segment is expected to witness the highest growth during the forecast period due to increasing demand for high performance and reliable packaging in mobile communication applications.
Within this market, computer and networking will remain the largest end use industry for OSAT services due to increasing demand of semiconductors in data centers, network infrastructure and storage applications. Consumer electronics is expected to witness the highest growth over the forecast period due to the increasing demand for internet connected device.
Asia Pacific will remain the largest region over the forecast period and it is also expected to witness the highest growth over the over the forecast period due to a growing adoption of IoT (internet of things), increasing electronic content per vehicles, and growing industrial automation in countries such as China, Taiwan, and India.
Some of the features of “Global OSAT Market: Trends, Forecast and Competitive Analysis” Include:
Q.1 What are some of the most promising potential, high-growth opportunities for the global OSAT market by service type (assembly/packaging and testing), end use industry (telecommunication & devices, computer & networking, consumer electronics, industrial electronics, others), packaging type (wire bond, flip chip, wafer level, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q. 2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to the market?
Q.6 What are emerging trends in this market and the reasons behind them?
Q.7 What are some changing demands of customers in the market?
Q.8 What are the new developments in the market? Which companies are leading these developments?
Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M & A activities did take place in the last five years in this market?
Emerging trend, which has a direct impact on the dynamics of the industry, includes miniaturization and higher functionality of semiconductors.
A total of 157 figures / charts and 132 tables are provided in this 250-page report to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of OSAT market report download the report brochure.
By Service Type [$M analysis for 2014 – 2025]:
- Assembly & Packaging
- Testing
- Wire bond
- Flip Chip
- Wafer level
- Others
- Telecommunication
- Computer & networking
- Consumer electronics
- Industrial electronics
- Others
-
North America
- United States
- Canada
- Mexico
-
Europe
- United Kingdom
- Germany
-
Asia Pacific
- Japan
- China
- South Korea
- The Rest of the World
Lucintel forecasts that wire bond will remain the largest packaging type over the forecast period, as wire bond packaging is cost effective solution for low to medium pin count applications. The wafer level packaging segment is expected to witness the highest growth during the forecast period due to increasing demand for high performance and reliable packaging in mobile communication applications.
Within this market, computer and networking will remain the largest end use industry for OSAT services due to increasing demand of semiconductors in data centers, network infrastructure and storage applications. Consumer electronics is expected to witness the highest growth over the forecast period due to the increasing demand for internet connected device.
Asia Pacific will remain the largest region over the forecast period and it is also expected to witness the highest growth over the over the forecast period due to a growing adoption of IoT (internet of things), increasing electronic content per vehicles, and growing industrial automation in countries such as China, Taiwan, and India.
Some of the features of “Global OSAT Market: Trends, Forecast and Competitive Analysis” Include:
- Market size estimates: OSAT market size estimation in terms of value ($M) shipment.
- Trend and forecast analysis: Market trend (2014-2019) and forecast (2020-2025) by service type, packaging type, and end use industry.
- Segmentation analysis: OSAT market size by various segments, such as service type, packaging type, and end use industry in terms of value shipment.
- Regional analysis: OSAT market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
- Growth opportunities: Analysis on growth opportunities in different applications and regions for OSAT market.
- Strategic analysis: This includes M&A, new product development, and competitive landscape for OSAT market.
- Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
Q.1 What are some of the most promising potential, high-growth opportunities for the global OSAT market by service type (assembly/packaging and testing), end use industry (telecommunication & devices, computer & networking, consumer electronics, industrial electronics, others), packaging type (wire bond, flip chip, wafer level, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q. 2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to the market?
Q.6 What are emerging trends in this market and the reasons behind them?
Q.7 What are some changing demands of customers in the market?
Q.8 What are the new developments in the market? Which companies are leading these developments?
Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M & A activities did take place in the last five years in this market?
Methodology
Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
- In-depth interviews of the major players in this market
- Detailed secondary research from competitors’ financial statements and published data
- Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
- A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process.
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