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Copper Foil for IC Substrate Trends and Forecast

The future of the global copper foil for IC substrate market looks promising with opportunities in the personal computer, smart phone, and wearable device markets. The global copper foil for IC substrate market is expected to grow with a CAGR of 5.3% from 2024 to 2030. The major drivers for this market are rising demand for smartphones & laptops, transition towards adoption of electric vehicles, and increasing uptake of 5G technology.
Copper Foil for IC Substrate Trends and Forecast

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.
Copper Foil for IC Substrate by Segment

Copper Foil for IC Substrate by Segment

The study includes a forecast for the global copper foil for IC substrate by type, application, and region.

Copper Foil for IC Substrate Market by Type [Shipment Analysis by Value from 2018 to 2030]:


• Below 8 μm
• 8-18 μm

Copper Foil for IC Substrate Market by Application [Shipment Analysis by Value from 2018 to 2030]:


• Personal Computer
• Smart Phone
• Wearable Device
• Others

Copper Foil for IC Substrate Market by Region [Shipment Analysis by Value from 2018 to 2030]:


• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Copper Foil for IC Substrate Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies copper foil for IC substrate companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the copper foil for IC substrate companies profiled in this report include-
• Kingboard Holdings Limited
• Nan Ya Plastics Corporation
• Chang Chun Group
• Mitsui Mining & Smelting
• Tongling Nonferrous Metal Group
• Furukawa Electric
• Co-Tech
• Jx Nippon Mining & Metal
• Jinbao Electronics
• LYCT

Copper Foil for IC Substrate Market Insights

Lucintel forecasts that below 8 μm is expected to witness the higher growth.
Within this market, personal computer is expected to witness the highest growth.
APAC is expected to witness highest growth

Features of the Global Copper Foil for IC Substrate Market

Market Size Estimates: Copper foil for IC substrate market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: Copper foil for IC substrate market size by type, application, and region in terms of value ($B).
Regional Analysis: Copper foil for IC substrate market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the copper foil for IC substrate market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the copper foil for IC substrate market.
Analysis of competitive intensity of the industry based on Porter’s Five Forces model.

FAQ

Q1. What is the growth forecast for copper foil for IC substrate market?
Answer: The global copper foil for IC substrate market is expected to grow with a CAGR of 5.3% from 2024 to 2030.
Q2. What are the major drivers influencing the growth of the copper foil for IC substrate market?
Answer: The major drivers for this market are rising demand for smartphones & laptops, transition towards adoption of electric vehicles, and increasing uptake of 5G technology.
Q3. What are the major segments for copper foil for IC substrate market?
Answer: The future of the copper foil for IC substrate market looks promising with opportunities in the personal computer, smart phone, and wearable device markets.
Q4. Who are the key copper foil for IC substrate market companies?
Answer: Some of the key copper foil for IC substrate companies are as follows:
• Kingboard Holdings Limited
• Nan Ya Plastics Corporation
• Chang Chun Group
• Mitsui Mining & Smelting
• Tongling Nonferrous Metal Group
• Furukawa Electric
• Co-Tech
• Jx Nippon Mining & Metal
• Jinbao Electronics
• LYCT
Q5. Which copper foil for IC substrate market segment will be the largest in future?
Answer: Lucintel forecasts that below 8 μm is expected to witness the higher growth.
Q6. In copper foil for IC substrate market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness highest growth
Q7. Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

Q.1. What are some of the most promising, high-growth opportunities for the copper foil for IC substrate market by type (below 8 μm and 8-18 μm), application (personal computer, smart phone, wearable device, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

For any questions related to Copper Foil for IC Substrate Market, Copper Foil for IC Substrate Market Size, Copper Foil for IC Substrate Market Growth, Copper Foil for IC Substrate Market Analysis, Copper Foil for IC Substrate Market Report, Copper Foil for IC Substrate Market Share, Copper Foil for IC Substrate Market Trends, Copper Foil for IC Substrate Market Forecast, Copper Foil for IC Substrate Companies, write Lucintel analyst at email: helpdesk@lucintel.com. We will be glad to get back to you soon.
Table of Contents

1. Executive Summary
2. Global Copper Foil for IC Substrate Market : Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges 
3. Market Trends and Forecast Analysis from 2018 to 2030
3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
3.2. Global Copper Foil for IC Substrate Market Trends (2018-2023) and Forecast (2024-2030)
3.3: Global Copper Foil for IC Substrate Market by Type
3.3.1: Below 8 μm
3.3.2: 8-18 μm
3.4: Global Copper Foil for IC Substrate Market by Application
3.4.1: Personal Computer
3.4.2: Smart Phone
3.4.3: Wearable Device
3.4.4: Others
4. Market Trends and Forecast Analysis by Region from 2018 to 2030
4.1: Global Copper Foil for IC Substrate Market by Region
4.2: North American Copper Foil for IC Substrate Market
4.2.1: North American Copper Foil for IC Substrate Market by Type: Below 8 μm and 8-18 μm
4.2.2: North American Copper Foil for IC Substrate Market by Application: Personal Computer, Smart Phone, Wearable Device, and Others
4.3: European Copper Foil for IC Substrate Market
4.3.1: European Copper Foil for IC Substrate Market by Type: Below 8 μm and 8-18 μm
4.3.2: European Copper Foil for IC Substrate Market by Application: Personal Computer, Smart Phone, Wearable Device, and Others
4.4: APAC Copper Foil for IC Substrate Market
4.4.1: APAC Copper Foil for IC Substrate Market by Type: Below 8 μm and 8-18 μm
4.4.2: APAC Copper Foil for IC Substrate Market by Application: Personal Computer, Smart Phone, Wearable Device, and Others
4.5: ROW Copper Foil for IC Substrate Market
4.5.1: ROW Copper Foil for IC Substrate Market by Type: Below 8 μm and 8-18 μm
4.5.2: ROW Copper Foil for IC Substrate Market by Application: Personal Computer, Smart Phone, Wearable Device, and Others
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global Copper Foil for IC Substrate Market by Type
6.1.2: Growth Opportunities for the Global Copper Foil for IC Substrate Market by Application
6.1.3: Growth Opportunities for the Global Copper Foil for IC Substrate Market by Region
6.2: Emerging Trends in the Global Copper Foil for IC Substrate Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global Copper Foil for IC Substrate Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Copper Foil for IC Substrate Market
6.3.4: Certification and Licensing
7. Company Profiles of Leading Players
7.1: Kingboard Holdings Limited
7.2: Nan Ya Plastics Corporation
7.3: Chang Chun Group
7.4: Mitsui Mining & Smelting
7.5: Tongling Nonferrous Metal Group
7.6: Furukawa Electric
7.7: Co-Tech
7.8: Jx Nippon Mining & Metal
7.9: Jinbao Electronics
7.10: LYCT
.

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Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
 
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