Teijin Automotive Technologies broke ground to expand the capabilities at its Huntington, Indiana, facility, adding a topcoat line and assembly area. These additions enhance the capabilities of the company’s Huntington facility, which currently include compression molding, bonding, water jetting, sanding, and priming.Specifically, Teijin Automotive Technologies purchased 30 acres in the new Riverfork West Industrial Center and will be building a 164,400 square-foot facility on this site to house a new paint line and assembly capabilities. The new facility is expected to be complete, including all equipment installation, by December 2023.“As demand for our innovative, lightweight components continues to grow, we have the opportunity to add capabilities and capacity to meet current and future customer needs,” said Steve Rooney, Teijin Automotive Technologies CEO, and general manager of Teijin’s Composites Business Unit.”Teijin Automotive Technologies and its parent company Teijin Limited are making an investment of more than $100 million, including the land, building and equipment, to support future growth and maintain its Competitive Advantage.For identifying growth opportunities for Automotive Semiconductor Market: Trends, Opportunities and Competitive Analysis, please visit https://www.lucintel.com/automotive-semiconductor-market.aspx
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