SAMPE Asia 2012 Puts Attendees at the Forefront of Expanding Region

february 27 2012

SAMPE’s third SAMPE Asia Conference and Exhibition succeeded in bringing together international delegates for an advanced materials and processes gathering in Kuala Lumpur, Malaysia. This event received strong endorsement from Kementerian Tenaga Teknologi Hijau Dan Air (KeTTHA), Persatuan Industri Komposit (PIK), Malaysian Industry-Government Group for High Technology (MIGHT), Aerospace Malaysia Innovation Centre (AMIC), and Ministry of International Trade and Industry (MITI).

“We’re excited to have brought SAMPE Asia back to Kuala Lumpur,” said Anthony J. Vizzini, PhD, SAMPE President and Dean of the College of Engineering and Applied Sciences at Western Michigan University. "In addition to the support of influential associations, we’ve enjoyed international participation that has enhanced the value of this event. Our delegates have a common interest - advancing materials and processes - and doing so here, in Asia, demonstrates their knowledge of the benefits this region and SAMPE have to offer."

The conference began Tuesday with sessions and panels balancing research with practical applications. Wednesday’s program included a keynote presentation on “Composites and Engineered Materials – Opportunities and Challenges” given by Dr. Tia Benson-Tolle, Air Force Research Laboratory, and SAMPE Past President and SAMPE Fellow. On Thursday, a forum exploring green application challenges and opportunities generated insightful discussions and unique points of view between forum leaders and attendees.

Alongside the conference was the SAMPE Asia Exhibition. Exhibiting companies included Spirit AeroSystems, CTRM, Heatcon, Henkel, and Hexcel. The exhibit hall was a primary attraction for many attendees eager to do business and gain a better footing in the Asian marketplace.

The next international SAMPE Conference will take place at the Hotel Mercure Paris Porte de Versaille Expo in Paris France 26-27 March.

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