SABIC’s THERMOCOMP HMD-D Compounds for the Americas and Europe

May 14 2018

SABIC has introduced its next-generation THERMOCOMP HMD-D compounds to the Americas and Europe at NPE2018. Initially launched in Asia, these materials expand SABIC’s THERMOCOMP portfolio of specialty compounds with high-performance, glass-reinforced polycarbonate (PC) materials.

The new series of six grades delivers a unique combination of high modulus and ductility to enable lighter, thinner and stronger parts that advance design innovation and ease of use. They are engineered for challenging structural components in the consumer electronics, healthcare and transportation sectors.

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