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DuPont to Introduce Epoxy Based Pyralux HP Laminate Adhesive System January 17 2022

2022 Lucintel Composites Market Insights, January 17, 2022

DuPont Interconnect Solutions (ICS), a business within the Electronics & Industrial segment, will introduce the Pyralux HP laminate adhesive system at the 2022 Institute for Printed Circuits (IPC) APEX Exposition to be held in San Diego, CA from January 25 - 27, 2022.

To improve the performance of these devices, DuPont developed the epoxy-based Pyralux HP laminate adhesive system that combines best-in-class insertion loss performance with increased functionality and processing. This engineered solution was specifically designed for Original Equipment Manufacturers (OEMs) and Printed Circuit Board (PCB) manufacturers to address the needs in high-performance and high-reliability applications in the telecommunications, networking, medical, industrial, military and aerospace markets.

The Pyralux HP laminate adhesive system possesses robust processability while maintaining excellent electrical performance to optimize signal integrity in demanding and extreme environment PCB applications.

For identifying opportunities for epoxy resin in the global composites market: growth trends, forecast and competitive analysis, please visit
https://www.lucintel.com/epoxy-resin-in-composites-industry.aspx