Applied Nanotech Unveils THERCOBOND Family of Highly Thermally-Conductive Bonding Materials

may 29 2012

Applied Nanotech Holdings, Inc. informed that it has unveiled a new family of highly thermally-conductive bonding and printed materials called THERCOBOND for power electronics and photonics applications.

THERCOBOND materials are specially designed for power electronic device packaging and dielectric coating, with an optimal combination of thermal conductivity, thermal diffusivity, thermal expansion, dielectric and insulating properties, wet ability, and printability.

“The implementation of new thermal interface composites with a significantly higher level of heat dissipation performance is critical for the extreme requirements of power electronic devices today” said Dr. Nan (David) Jiang, Director of the Thermal Management Division at Applied Nanotech, Inc. “The scope of industrial and commercial applications for THERCOBOND materials is immense, starting with electronic packaging, power LEDs, and PCB assembly, just to name a few.”

THERCOBOND materials can easily be applied on various substrates by conventional screen printing, drawdown, and even inkjet and other printing approaches to form thermally conductive dielectric layers for printed circuit board (PCB) applications as well as other electronic packaging needs. The first two products in the THERCOBOND family are polymer-based (DTC-P) and ceramic-based (DTC-C).

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