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HDI PCB Market Trends: Trends, Opportunities and Competitive Analysis

Trends, opportunities and forecast in high density interconnect PCB market to 2027 by end use industry (smartphones and tablets, computers, telecom/datacom, consumer electronics, automotive, and others), technology (4-6 layer, 8-10 layer, and 10+ layer), build-up layer count (1+n+1, 2+n+2, 3+n+3, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)