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According to market forecasts, the global semiconductor adhesive paste and film market is poised for growth at 5.9% CAGR over the next five years to reach $1.

3 billion in 2017. The global semiconductor adhesive paste and film market for packaging industry is on the threshold of significant growth. Asia was the top continent in terms of total adhesive paste and film manufacturing and consumption; however, North America and Europe saw the highest growth rate because of rapidly increasing demand in developed economies and increasing demand for semiconductor devices.

Lucintel's study encompasses the industry’s major drivers. Innovation and capital are the most significant drivers for the semiconductor packaging industry. Manufacturing semiconductor devices require enormous capital investments and a highly skilled workforce. Major manufacturers are investing in extensive R&D for developing more innovative products. Thinner devices are now manufactured for enhancing device performance and in turn, increase the demand for adhesive paste and films.

A total of 55 figures / charts and 16 tables are provided in this 107-page report to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of the semiconductor adhesive paste and film market report, download the report brochure.


Lucintel discusses the various challenges and opportunities faced by the global semiconductor adhesive paste and film market. One major challenge is the increased price of resins and other raw materials. Semiconductor adhesive pastes and films are used for three basic applications in the semiconductor devices: dicing, back-grinding, and die-attach. These days, devices with both analog and digital components are manufactured.

This report highlights different aspects of the global semiconductor adhesive paste and film market. Due diligence has been given to the current market scenario, technological, and monetary benefits of manufacturing adhesive pastes and films globally. Asia is the leader in both manufacturing and consuming adhesive pastes and films.

This unique report from Lucintel will provide you with valuable information, insights, and tools needed to identify new growth opportunities and operate your business successfully in this market. This report will save hundreds of hours of your own personal research time and will significantly benefit you in expanding your business in this market. In today’s stringent economy, you need every advantage that you can find.

To make business, investment, and strategic decisions, you need timely, useful information. This market report fulfills this core need and is an indispensable reference guide for multinational materials suppliers, product manufacturers, investors, executives, distributors, and many more that operate in this market.

Some of the features of this report:
 
  • Porter’s Five Forces analysis for global semiconductor adhesive paste and film market.
  • Global thin film semiconductor adhesive paste and film market size by  region and by application in terms of value and  volume
  • Drivers and challenges for global semiconductor adhesive paste and film market.
  • Regional analysis of the global semiconductor adhesive paste and film market by the key regions of North America, Europe, Asia Pacific, and Rest of the World in terms of value  and volume
  • Global semiconductor adhesive paste and film market trend (2006-2011) & forecast (2012-2017) by region and  by application in terms of  value  and volume
  • Growth opportunities and emerging trends in global semiconductor adhesive paste and film market.
  • More than 55 figures/charts and 16 tables are provided in this roughly- 107page report.

Table of Contents

1. Executive Summary    

2. Adhesive Paste and Film Industry Background and Classifications    
2.1: Adhesive Paste and Film Industry Background    
2.2: Organic adhesives for semiconductor packaging    
2.2.1: Classification of adhesives on the basis of the electrical conductivity    
2.2.2: Classification of adhesives on the basis of the polymer used    
2.2.3: Classification of adhesives on the basis of its state    
2.3: Applications    
2.4: Semiconductor wafer processing steps    
2.5: Difficulties in adhesive paste and film usage    
2.6: Industry classification    

3. Global Adhesive Paste and Film Industry Market Analysis  
3.1: Adhesive paste and film market overview    
3.2: Market concentration    
3.3: Competitive analysis    
3.3.1: Product mapping: breadth of product offerings    
3.4: Regional analysis    
3.5: Global adhesive paste and film market by segments    

4. Adhesive Paste and Film Market Trends  
4.1: Industry challenges in recent years    
4.1.1: The semiconductor cost squeeze    
4.2: Trends in global adhesive paste and film industry    
4.2.1: Market trends by region    
4.2.2: Market trends by applications    
4.3: Trends in North American adhesive paste and film market    
4.4: Trends in European adhesive paste and film market    
4.5: Trends in Asian adhesive paste and film market    
4.6: Trends in ROW adhesive paste and film market    
4.7: Adhesive paste market trend by resin type    
4.8: Adhesive paste and film market profitability analysis    
4.9: Cost structure for global adhesive paste and film industry: 2006-2011    
4.9.1: Regional trend: cost structure for adhesive paste and film industry
4.10: Integrated circuits export and import trend for APAC    
 
5. Adhesive Paste and Film Market Forecast    
5.1: Market forecast    
5.1.1: Growth drivers and challenges    
5.1.2: Challenges    
5.1.3: Global forecast adhesive paste and films market    
5.1.4: Forecast from the material suppliers’ perspective    
5.1.5: Forecasts from the adhesive paste and film users’ perspective    
 
6. Growth Opportunities and Emerging Adhesive Paste and Film Applications    
6.1: Growth opportunities    
6.2: Emerging trends in the global adhesive paste and film market    
6.2.1: Emergence of mid end companies and movement toward higher integration and higher pin outs    
6.2.2: Number of technologies simultaneously under development    
6.2.3: Alliances between existing players, packagers, and chip manufacturers    
6.2.4: R&D investments are increasing in lower cost regions such as APAC    
6.2.5: The profit margin erosion    
6.3: New materials development
6.3.1: Thermoplastic tape specifically designed for QFN assembly    
6.3.2: Thermally conductive, double-sided silicone adhesive tape    
6.3.3: Dicing die-attach film    
6.3.4: Film over wire    
6.3.5: Wafer backside coating    
6.3.6: Conductive die-attach films    
6.3.7: Self-filleting die-attach adhesive pastes    
 
List of Figures


Chapter 1. Executive Summary
Figure 1.1: Porter’s Five Forces industry analysis for adhesive paste and film

Chapter 2. Adhesive Paste and Film Industry Background and Classifications
Figure 2.1: Adhesive paste and film for die-attachment application
Figure 2.2: Adhesive paste and film evolution (1960-2012)
Figure 2.3: Adhesives in semiconductor packaging application
Figure 2.4: Die-attachment with adhesive paste
Figure 2.5: Basic schematic for back-grinding rotational grinder
Figure 2.6: Die-attach films
Figure 2.7: Basic schematic single chip die-attachment
Figure 2.8: Basic schematic multichip die-attachment
Figure 2.9: Basic understanding of steps in wafer processing
Figure 2.10: Applications of adhesive paste and films

Chapter 3. Global Adhesive Paste and Film Industry Market Analysis
Figure 3.1: Global adhesive paste and film demand ($M) compared to total packaging materials demand in 2011
Figure 3.2: Market share in terms of dollar value by top five suppliers in adhesive paste and film industry in 2011
Figure 3.3: Global adhesive paste and film market distribution by region ($ shipment) in 2011
Figure 3.4: Global adhesive paste and film market distribution ($ shipment) in 2011
Figure 3.5: Global adhesive paste distribution (%, $M) in 2011 by major resin segments
Figure 3.6: Global adhesive paste distribution (%, m pounds) in 2011 by major resin segments
Figure 3.7: Global adhesive film distribution (%, $M) in 2011 by major applications
Figure 3.8: Global adhesive film distribution (%, million square meters) in 2011 by major applications

Chapter 4. Adhesive Paste and Film Market Trends
Figure 4.1: Global adhesive paste and film market growth trends (2006-2011) in $M
Figure 4.2: Global adhesive paste and film growth trends by form (2006-2011) in $M
Figure 4.3: Global semiconductor revenue trend ($B): 2005-2011
Figure 4.4: Global adhesive paste market CAGR trends by resin type (2006-2011) in $M
Figure 4.5: Global adhesive paste market growth trends (2006-2011) in M Pounds
Figure 4.6: Global adhesive film market growth trends (2006-2011) in million square meters
Figure 4.7: CAGR for global adhesive paste and film market by form: 2006-2011
Figure 4.8: CAGR in global adhesive paste and film market ($M) by region 2006-2011
Figure 4.9: Comparative global GDP growth trend: 2006-2011
Figure 4.10: CAGR for global adhesive film market by application: 2006-2011
Figure 4.11: Global adhesive film market growth trends by application in million square meters (2006-2011)
Figure 4.12: Global adhesive paste market ($M) by resin type in 2006
Figure 4.13: Global adhesive paste market ($M) by resin type in 2011
Figure 4.14: Global adhesive paste market (M Pounds) by resin type in 2006
Figure 4.15: Global adhesive paste market (M Pounds) by resin type in 2011
Figure 4.16: Adhesive paste and film profit margin 2006-2011 (%)
Figure 4.17: Cost structure of global adhesive paste and film industry 2006-2011
Figure 4.18: Cost structure in North America adhesive paste and film market 2006-2011
Figure 4.19: Cost structure in Europe adhesive paste and film market 2006-2011
Figure 4.20: Cost structure in APAC adhesive paste and film market 2006-2011
Figure 4.21: Cost structure in ROW adhesive paste and film market 2006-2011
Figure 4.22: Trend in integrated circuits export market for last 20 years in APAC
Figure 4.23: Trend in integrated circuits import market for last 20 years in APAC

Chapter 5.  Adhesive Paste and Film Market Forecast
Figure 5.1: Global adhesive paste and film market drivers and challenges
Figure 5.2: Growth forecast in global adhesive paste and film shipment value ($M) 2012-2017
Figure 5.3: Growth forecast in global adhesive paste and film shipment value by form    ($M) 2012-2017
Figure 5.4: Growth forecast in global semiconductor revenue value ($M) 2012-2017
Figure 5.5: CAGR forecast in global adhesive paste and film shipment by region 2012-2017
Figure 5.6: Growth forecast of regional contribution in the global adhesive paste and film market 2012-2017

Chapter 6. Growth Opportunities and Emerging Adhesive Paste and Film Applications
Figure 6.1: Opportunities in adhesive paste and film market by form 2012-2017
Figure 6.2: Opportunities in adhesive paste and film market in the semiconductor packaging industry by region 2012-2017
Figure 6.3: Emerging trends adhesive paste and film market
Figure 6.4: Details of alliances between existing players, packagers, and chip manufacturers
Figure 6.5: Drivers for the R&D and cost trend in the semiconductor industry
Figure 6.6: Shin-Etsu’s TC-20SAS thermally conductive double-sided silicone adhesive tape
Figure 6.7: Henkel’s conductive die-attach film

List of Tables

Chapter 1 Executive Summary
Table 1.1: Adhesive paste and film market parameters and attributes – materials perspective
Table 1.2: Adhesive paste and film market parameters and attributes – end product market perspective

Chapter 2 Adhesive Paste and Film Industry Background and Classifications
Table 2.1: Advantages and disadvantages of conductive epoxies
Table 2.2: Comparison of die-attach film with die-attach paste
Table 2.3: Comparison of advantages of solder, thermoset, and thermoplastic adhesives
Table 2.4: Comparison of disadvantages of solder, thermoset, and thermoplastic adhesives

Chapter 3 Global Adhesive Paste and Film Industry Market Analysis
Table 3.1: Industry adhesive paste and film product map based on form type
Table 3.2: Industry adhesive paste product map based on resin type
Table 3.3: Industry adhesive paste product map based on application type

Chapter 4 Adhesive Paste and Film Market Trends
Table 4.1: Market trends (2006-2011) in global adhesive paste and film shipments
Table 4.2: Average growth rates for 1, 3, and 5 years in the global adhesive paste and film industry in terms of $ shipments
Table 4.3: Average annual growth rates in various regions of the global adhesive paste and film industry
Table 4.4: Market trends (2006-2011) in North American adhesive paste and film shipments
Table 4.5: Market trends (2006-2011) in European adhesive paste and film shipments
Table 4.6: Market trends (2006-2011) in APAC adhesive paste and film shipments
Table 4.7: Market trends (2006-2011) in ROW adhesive paste and film shipments
.

Buy full report or by chapter as follows

Price by License Type:
[-] Hide Chapter Details
[Chapter Number] [Chapter Name] [Chapter Number Of Pages] [Chapter Price]
Title/Chapter Name Pages Price
Full Report: Adhesive Paste and Film Market In Semiconductor Packaging Market: Market Size, Trends and Growth Analysis Full Report $ 4,850
More than 55 figures/charts and 16 tables are provided in this roughly- 107page report
Chapter - 1: Executive Summary 12 $ 435
1. Executive Summary
Chapter - 2: Adhesive Paste and Film Industry Background and Classifications 17 $ 218
2. Adhesive Paste and Film Industry Background and Classifications 
2.1 Adhesive Paste and Film Industry Background
2.2 Organic Adhesives for Semiconductor Packaging 
2.2.1 Classification of Adhesives on the basis of the Electrical Conductivity
2.2.2 Classification of Adhesives on the basis of the polymer used 
2.2.3 Classification of Adhesives on the basis of its state 
2.3 Applications 
2.4 Semiconductor Wafer Processing Steps 
2.5 Difficulties in Adhesive Paste and Film Usage 
2.6 Industry Classification 
Chapter - 3: Market Trend and Forecast Analysis 10 $ 3,698
3. Global Adhesive Paste and Film Industry Market Analysis 
3.1 Adhesive Paste and Film Market Overview 
3.2 Market Concentration 
3.3 Competitive Analysis
3.3.1 Product Mapping: Breadth of Product Offerings 
3.4 Regional Analysis
3.5 Global Adhesive Paste and Film Market by Segments
Chapter - 4: Competitor Analysis 26 $ 943
4. Adhesive Paste and Film Market Trends 
4.1 Industry Challenges in Recent Years
4.1.1 The Semiconductor Cost Squeeze 
4.2 Trends in Global Adhesive Paste and Film Industry 
4.2.1 Market Trends by Region
4.2.2 Market Trends by Applications 
4.3 Trends in North American Adhesive Paste and Film Market 
4.4 Trends in European Adhesive Paste and Film Market 
4.5 Trends in Asian Adhesive Paste and Film Market 
4.6 Trends in ROW Adhesive Paste and Film Market 
4.7 Adhesive Paste Market Trend by Resin Type
4.8 Adhesive Paste and Film Market Profitability Analysis 
4.9 Cost Structure for Global Adhesive Paste and Film Industry: 2006-2011 
4.9.1 Regional Trend: Cost Structure for Adhesive Paste and Film Industry
4.10 Integrated Circuits Export and Import Trend for APAC 
Chapter - 5: Growth Opportunity and Strategic Analysis 9 $ 1,088
5. Adhesive Paste and Film Market Forecast 
5.1 Market Forecast
5.1.1 Growth Drivers and Challenges 
5.1.2 Challenges 
5.1.3 Global Forecast Adhesive Paste and Films Market
5.1.4 Forecast from the Material Suppliers’ Perspective 
5.1.5 Forecasts from the Adhesive Paste and Film Users’ Perspective
Chapter - 6: Company Profiles of Leading Players 14 $ 870
6. Growth Opportunities and Emerging Adhesive Paste and Film Applications
6.1 Growth Opportunities 
6.2 Emerging Trends in the Global Adhesive Paste and Film Market 
6.2.1 Emergence of Mid End Companies and Movement toward Higher Integration and Higher Pin Outs 
6.2.2 Number of Technologies Simultaneously Under Development 
6.2.3 Alliances between Existing Players, Packagers, and Chip Manufacturers .
6.2.4 R&D Investments are Increasing in Lower Cost Regions such as APAC 
6.2.5 The Profit Margin Erosion .
6.3 New Materials Development
6.3.1 Thermoplastic Tape Specifically Designed For QFN Assembly 
6.3.2 Thermally Conductive, Double-Sided Silicone Adhesive Tape 
6.3.3 Dicing Die-attach Film 
6.3.4 Film over wire 
6.3.5 Wafer Backside Coating 
6.3.6 Conductive Die-attach Films 
6.3.7 Self-Filleting Die-attach Adhesive Pastes 
 
Lucintel has been in the business of market research and management consulting since 2000 and has published over 600 market intelligence reports in various markets / applications and served 1,000+ clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data
  • Extensive search of published works, market and database information with industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted in the supply chain of this market to estimate market share, market size, trends, drivers, challenges and forecasts in the market. Below is a brief summary of primary interviews conducted by both job function and region.


Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis on it. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of the Lucintel research process.

 

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