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Radiation Hardened Electronics Trends and Forecast
The future of the global radiation hardened electronics market looks promising with opportunities in the space, aerospace & defense, nuclear power plant, and medical markets. The global radiation hardened electronics market is expected to reach an estimated $2.1 billion by 2030 with a CAGR of 3.6% from 2024 to 2030. The major drivers for this market are rising intelligence, surveillance, and reconnaissance (ISR) activities, technology advancements in multicore processors used for military and space-grade applications, and increasing demand for radiation-hardened electronics in commercial satellites.
A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.
Radiation Hardened Electronics by Segment
The study includes a forecast for the global radiation hardened electronics by component, manufacturing technique, product type, application, and region
Radiation Hardened Electronics Market by Component [Shipment Analysis by Value from 2018 to 2030]:
• Mixed Signal ICs
• Processors & Controllers
• Memory
• Power Management
Radiation Hardened Electronics Market by Manufacturing Technique [Shipment Analysis by Value from 2018 to 2030]:
• Radiation-Hardening by Design (RHBD)
• Radiation-Hardening by Process (RHBP)
Radiation Hardened Electronics Market by Product Type [Shipment Analysis by Value from 2018 to 2030]:
• Commercial-off-the-Shelf (COTS)
• Custom Made
Radiation Hardened Electronics Market by Application [Shipment Analysis by Value from 2018 to 2030]:
• Space
• Aerospace & Defense
• Nuclear Power Plant
• Medical
• Others
Radiation Hardened Electronics Market by Region [Shipment Analysis by Value from 2018 to 2030]:
• North America
• Europe
• Asia Pacific
• The Rest of the World
List of Radiation Hardened Electronics Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies radiation hardened electronics companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the radiation hardened electronics companies profiled in this report include-
• Microchip Technology
• BAE Systems
• Renesas Electronics Corporation
• Infineon Technologies
• STMicroelectronics
• Xilinx
• Texas Instruments Incorporated
• Honeywell International
• Teledyne Technologies
• TTM Technologies
Radiation Hardened Electronics Market Insights
Lucintel forecasts that power management will remain the largest segment over the forecast period as it delivers excellent durability against high-energy-charged particles and ionizing radiation that drives their demand in outer space requirements.
Within this market, space will remain the largest segment due to the rising number of ISR operations along with the increasing number of space missions.
North America will remain the largest region over the forecast period due to growing adoption of advanced technologies and miniaturization of components and existence of rad-hard component mnufacturers in the region.
Features of the Global Radiation Hardened Electronics Market
Market Size Estimates: Radiation hardened electronics market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: Radiation hardened electronics market size by various segments, such as by component, manufacturing technique, product type, application, and region in terms of value ($B).
Regional Analysis: Radiation hardened electronics market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different components, manufacturing techniques, product types, applications, and regions for the radiation hardened electronics market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the radiation hardened electronics market.
Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
FAQ
Q.1 What is the radiation hardened electronics market size?
Answer: The global radiation hardened electronics market is expected to reach an estimated $2.1 billion by 2030.
Q.2 What is the growth forecast for radiation hardened electronics market?
Answer: The global radiation hardened electronics market is expected to grow with a CAGR of 3.6% from 2024 to 2030.
Q.3 What are the major drivers influencing the growth of the radiation hardened electronics market?
Answer: The major drivers for this market are rising intelligence, surveillance, and reconnaissance (ISR) activities, technology advancements in multicore processors used for military and space-grade applications, and increasing demand for radiation-hardened electronics in commercial satellites.
Q4. What are the major segments for radiation hardened electronics market?
Answer: The future of the radiation hardened electronics market looks promising with opportunities in the space, aerospace & defense, nuclear power plant, and medical markets.
Q5. Who are the key radiation hardened electronics market companies?
Answer: Some of the key radiation hardened electronics companies are as follows:
• Microchip Technology
• BAE Systems
• Renesas Electronics Corporation
• Infineon Technologies
• STMicroelectronics
• Xilinx
• Texas Instruments Incorporated
• Honeywell International
• Teledyne Technologies
• TTM Technologies
Q6. Which radiation hardened electronics market segment will be the largest in future?
Answer: Lucintel forecasts that power management will remain the largest segment over the forecast period as it delivers excellent durability against high-energy-charged particles and ionizing radiation that drives their demand in outer space requirements.
Q7. In radiation hardened electronics market, which region is expected to be the largest in next 5 years?
Answer: North America will remain the largest region over the forecast period due to growing adoption of advanced technologies and miniaturization of components and existence of rad-hard component mnufacturers in the region.
Q.8 Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.
This report answers following 11 key questions:
Q.1. What are some of the most promising, high-growth opportunities for the radiation hardened electronics market by component (mixed signal ICs, processors & controllers, memory, and power management), manufacturing technique (radiation-hardening by design (RHBD), and radiation-hardening by process (RHBP)), product type (commercial-off-the-shelf (COTS), and custom made), application (space, aerospace & defense, nuclear power plant, medical, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?
For any questions related to radiation hardened electronics market or related to radiation hardened electronics companies, radiation hardened electronics market size, radiation hardened electronics market share, radiation hardened electronics market growth, radiation hardened electronics market research, write Lucintel analyst at email: helpdesk@lucintel.com we will be glad to get back to you soon.
Table of Contents
1. Executive Summary
2. Global Radiation Hardened Electronics Market : Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
3. Market Trends and Forecast Analysis from 2018 to 2030
3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
3.2. Global Radiation Hardened Electronics Market Trends (2018-2023) and Forecast (2024-2030)
3.3: Global Radiation Hardened Electronics Market by Component
3.3.1: Mixed Signal ICs
3.3.2: Processors & Controllers
3.3.3: Memory
3.3.4: Power Management
3.4: Global Radiation Hardened Electronics Market by Manufacturing Technique
3.4.1: Radiation-Hardening by Design (RHBD)
3.4.2: Radiation-Hardening by Process (RHBP)
3.5: Global Radiation Hardened Electronics Market by Product Type
3.5.1: Commercial-off-the-Shelf (COTS)
3.5.2: Custom Made
3.6: Global Radiation Hardened Electronics Market by Application
3.6.1: Space
3.6.2: Aerospace & Defense
3.6.3: Nuclear Power Plant
3.6.4: Medical
3.6.5: Others
4. Market Trends and Forecast Analysis by Region from 2018 to 2030
4.1: Global Radiation Hardened Electronics Market by Region
4.2: North American Radiation Hardened Electronics Market
4.2.1: North American Radiation Hardened Electronics Market by Component: Mixed Signal ICs, Processors & Controllers, Memory, and Power Management
4.2.2: North American Radiation Hardened Electronics Market by Application: Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others
4.3: European Radiation Hardened Electronics Market
4.3.1: European Radiation Hardened Electronics Market by Component: Mixed Signal ICs, Processors & Controllers, Memory, and Power Management
4.3.2: European Radiation Hardened Electronics Market by Application: Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others
4.4: APAC Radiation Hardened Electronics Market
4.4.1: APAC Radiation Hardened Electronics Market by Component: Mixed Signal ICs, Processors & Controllers, Memory, and Power Management
4.4.2: APAC Radiation Hardened Electronics Market by Application: Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others
4.5: ROW Radiation Hardened Electronics Market
4.5.1: ROW Radiation Hardened Electronics Market by Component: Mixed Signal ICs, Processors & Controllers, Memory, and Power Management
4.5.2: ROW Radiation Hardened Electronics Market by Application: Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global Radiation Hardened Electronics Market by Component
6.1.2: Growth Opportunities for the Global Radiation Hardened Electronics Market by Manufacturing Technique
6.1.3: Growth Opportunities for the Global Radiation Hardened Electronics Market by Product Type
6.1.4: Growth Opportunities for the Global Radiation Hardened Electronics Market by Application
6.1.5: Growth Opportunities for the Global Radiation Hardened Electronics Market Region
6.2: Emerging Trends in the Global Radiation Hardened Electronics Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global Radiation Hardened Electronics Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Radiation Hardened Electronics Market
6.3.4: Certification and Licensing
7. Company Profiles of Leading Players
7.1: Microchip Technology
7.2: BAE Systems
7.3: Renesas Electronics Corporation
7.4: Infineon Technologies
7.5: STMicroelectronics
7.6: Xilinx
7.7: Texas Instruments Incorporated
7.8: Honeywell International
7.9: Teledyne Technologies
7.10: TTM Technologies
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Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
In-depth interviews of the major players in this market
Detailed secondary research from competitors’ financial statements and published data
Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process.
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